EP3C16F256C8 vs EP3C16F256I7N Karşılaştırma

Ayrıntılı yan yana karşılaştırma EP3C16F256C8 tarafından Intel ve EP3C16F256I7N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Özellik Karşılaştırması

Parametre EP3C16F256C8 EP3C16F256I7N
Marka Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Obsolete Aktif
Device Type Cyclone III Field-Programmable Gate Array (FPGA) —
Logic Elements 15,408 logic elements —
Embedded Memory 516,096 bits (504 Kb) 56 M9K blocks (504 Kbit)
Maximum Frequency 402 MHz —
I/O Pins 168 pins —
Process Technology 65 nm CMOS TSMC 60 nm low-leakage
Core Supply Voltage 1.2 V —
Paket 256-LBGA (F256) 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Package Dimensions 17 mm × 17 mm —
Number of Package Terminals 256 balls —
Montaj Stili Surface mount —
Speed Grade Grade 8 —
Commercial Junction Temperature 0 °C to 85 °C —
Industrial Junction Temperature -40 °C to 125 °C —
Package Outline Reference MS-034 —
Lead-Free Status Lead free —
Terminal Form Ball-grid array —
Programmable Logic Family Cyclone III —
RoHS Compliance [DATA_NEEDED: RoHS compliance] Compliant
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
İşletim Sıcaklığı — -40C to +100C (industrial, I7)
Supply Voltage (Core) — 1.2 V typical
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)

Dökümanlar & Kaynaklar

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