EP3C16F256I7 vs EP3C16F256I7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C16F256I7 sa pamamagitan ng Intel at EP3C16F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C16F256I7 EP3C16F256I7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Device Type Cyclone III Field Programmable Gate Array (FPGA) —
Logic Elements 15,408 logic elements —
Logic Array Blocks 963 LABs —
User I/O Count 168 I/Os —
Embedded Memory 516,096 bits 56 M9K blocks (504 Kbit)
Maximum Frequency 437.5 MHz —
Core Supply Voltage 1.2 V —
Packhaging 256-LBGA (FBGA) 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Total Terminals 256 terminals —
Temperature na Operasyon -40°C to 125°C -40C to +100C (industrial, I7)
Uri ng Pagpapasok Surface mount —
Lead-Free Status Lead free —
MSL Classification [DATA_NEEDED: MSL classification] —
Programmable Logic FPGA logic array with 15,408 logic elements —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Uri ng Memory [DATA_NEEDED: embedded memory organization and block count] —
PLL Count [DATA_NEEDED: PLL count] —
Differential I/O [DATA_NEEDED: differential I/O capability] —
Tindminan RoHS [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
Supply Voltage (Core) — 1.2 V typical
Process Technology — TSMC 60 nm low-leakage
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)
RoHS Compliance — Compliant

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