EP3C5F256C8 vs EP3C5F256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256C8 sa pamamagitan ng Intel at EP3C5F256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256C8 | EP3C5F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Series | Cyclone III | EP3C5 |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 | 423936 |
| Number of LABs/CLBs | 321 | — |
| Number of Logic Elements/Cells | 5,136 | — |
| Maximum User I/O | 182 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Temperature na Operasyon | -40°C to +125°C | 0 C to +85 C (commercial "C6" speed grade) |
| Package Type | 256-LBGA (FineLine BGA) | — |
| Package Code | FBGA-256 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Volte ng Pagbibigay | [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] | — |
| Configuration Memory | External flash via AS/PS/JTAG/FPP | — |
| Process Technology | 65 nm low-power CMOS | — |
| Embedded Multipliers | Yes (18x18 hard multipliers) | — |
| PLLs | Yes (general-purpose PLLs) | 2 |
| Tindminan RoHS | Lead Free, MS-034 | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 5136 |
| Logic Array Blocks (LABs) | — | 182 (per DigiKey listing) |
| Embedded 18x18 Multipliers | — | 23 |
| Maximum User I/Os | — | 182 |
| Core Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.2 V |
| Packhaging | — | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |
| Configuration Modes | — | Serial, Parallel, JTAG, AS, PS |