EP3SE260F1517I3G vs EP3SE260F1517I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I3G sa pamamagitan ng Intel at EP3SE260F1517I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517I3G | EP3SE260F1517I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | Stratix III E | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | 16,672,768 bits |
| Maximum Operating Frequency | 500 MHz | — |
| Core Voltage | 1.1 V | 1.1 V |
| User I/O Count | 976 | 976 |
| Packhaging | 1517-ball FC-FBGA (Flip-Chip BGA) | 1517-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Node | 65 nm | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLL Count | 12 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Logic Array Blocks (LABs) | — | 10,200 |
| Process Technology | — | 65 nm |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Industrial (I): -40 °C to +100 °C |
| Temperature ng Junction na Operasyon | — | -40 °C to +100 °C |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | — | Yes (dedicated multiply-accumulate) |