EP3SE260F1517I4N vs EP3SL200F1517I4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I4N sa pamamagitan ng Intel at EP3SL200F1517I4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517I4N | EP3SL200F1517I4LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits | 10,901,504 |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | 976 |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power |
| Packhaging | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Operating Temperature Grade | Industrial (I4) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| Level ng MSL | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Family | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 8,000 |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Blocks (18x18 multipliers) | — | 384 |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |