EP3SE260F1517I4N vs EP3SL200F1517I4LN Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3SE260F1517I4N tarafından Intel ve EP3SL200F1517I4LN tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Son Satın Alma
Özellik Karşılaştırması
| Parametre | EP3SE260F1517I4N | EP3SL200F1517I4LN |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits | 10,901,504 |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | 976 |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power |
| Paket | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| İşletim Sıcaklığı | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Operating Temperature Grade | Industrial (I4) | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| MSL Seviyesi | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Family | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 8,000 |
| RoHS Durumu | — | Compliant |
| Lead-Free | — | Yes |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Blocks (18x18 multipliers) | — | 384 |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |