EP3SE260H780I3 vs EP3SE260H780I4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I3 sa pamamagitan ng Intel at EP3SE260H780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780I3 EP3SE260H780I4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III E Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 16,672,640
Embedded 18x18 Multipliers 384 —
User I/Os 488 —
Operating Frequency (logic) 500 MHz —
Operating Frequency (internal max) 800 MHz —
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 0.9 V
Packhaging 780-Ball FC-HFBGA / FCBGA —
Uri ng Pagpapasok Surface Mount Surface Mount (flip-chip)
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 Hours) —
Tindminan RoHS Lead Free / Compliant Compliant (lead-free)
Temperature na Operasyon -40C to +100C (Industrial) Industrial, -40C to +85C
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
User I/O Count — 488
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

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