EP3SE260H780I4N vs EP3SE260H780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4N sa pamamagitan ng Intel at EP3SE260H780C2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Huling PagbiliAltera
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
EP3SE260H780C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780I4N | EP3SE260H780C2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III Enhanced (Stratix III E) | Stratix® III E |
| Logic Elements | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 488 | 488 |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 0.86 V to 1.15 V |
| Maximum Operating Frequency | 450 MHz | — |
| Packhaging | 780-pin FC-HFBGA (FCBGA) | 780-BBGA, FCBGA |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | [DATA_NEEDED: BGA ball pitch in mm] | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Series | — | Stratix III |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 102,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| Process Node | — | 65 nm |
| Uri ng Pagpapasok | — | Surface Mount |
| Lead Free | — | Yes |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |