EP3SE50F484C2N vs EP3SE50F484C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484C2N sa pamamagitan ng Intel at EP3SE50F484C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F484C2N EP3SE50F484C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Series Stratix III E —
Family Stratix III E FPGA Stratix III E
Logic Elements 47,500 47,500
Embedded Memory 2,304 Kbits —
DSP Blocks (18x18) 264 —
User I/Os 296 —
LABs/CLBs 1,900 —
Core Voltage 0.9 V / 1.1 V 1.1 V
Internal Frequency 600 MHz —
Process Technology 65 nm —
Packhaging 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) 484-ball FCBGA (F484), 1.0 mm pitch
Temperature na Operasyon 0C to +85C (Commercial) 0C to +85C (commercial, "C")
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS Compliant Compliant (lead-free)
Lead-Free Yes —
Adaptive Logic Modules (ALMs) — 19,000
Total Embedded Memory — 5,760,000 bits (5.76 Mbit)
M9K Memory Blocks — 320 (2,304 Kbits)
M144K Memory Blocks — 12 (1,728 Kbits)
User I/O Pins — 296
18x18 Multipliers — 384
PLLs — 4
Global Clock Networks — 16
Speed Grade — C3
Process Node — 65 nm TSMC low-power

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