EP3SE50F484C2N vs EP3SE50F484C3G 比較

詳細並排比較 EP3SE50F484C2N 由 Intel 與 EP3SE50F484C3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F484C2N EP3SE50F484C3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Series Stratix III E —
Family Stratix III E FPGA Stratix III E
Logic Elements 47,500 47,500
Embedded Memory 2,304 Kbits —
DSP Blocks (18x18) 264 —
User I/Os 296 —
LABs/CLBs 1,900 —
Core Voltage 0.9 V / 1.1 V 1.1 V
Internal Frequency 600 MHz —
Process Technology 65 nm —
封裝 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) 484-ball FCBGA (F484), 1.0 mm pitch
工作溫度 0C to +85C (Commercial) 0C to +85C (commercial, "C")
安裝類型 Surface Mount (BGA) Surface Mount
RoHS 狀態 Compliant Compliant (lead-free)
Lead-Free Yes —
Adaptive Logic Modules (ALMs) — 19,000
Total Embedded Memory — 5,760,000 bits (5.76 Mbit)
M9K Memory Blocks — 320 (2,304 Kbits)
M144K Memory Blocks — 12 (1,728 Kbits)
User I/O Pins — 296
18x18 Multipliers — 384
PLLs — 4
Global Clock Networks — 16
Speed Grade — C3
Process Node — 65 nm TSMC low-power

資料表與資源

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