EP3SL50F780C3 vs EP3SE50F780C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C3 sa pamamagitan ng Intel at EP3SE50F780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F780C3 EP3SE50F780C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III L (low-power) Stratix III E
Series Stratix III —
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory Bits 2,184,192 —
User I/Os 488 488
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
Temperature na Operasyon 0C to +85C (Commercial) 0C to +85C (Commercial grade, 'C' suffix)
Speed Grade 3 —
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS status]
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
Level ng Sensitivity sa Asid ng Moisture (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Logic Elements (LE) — 47,500
Embedded Memory (BRAM) — 5,760 Kbits
Packhaging — 780-ball FC-FBGA (FineLine BGA)
Process Technology — 65 nm
Core Voltage — 1.1 V
Logic Voltage — 0.9 V
Transceiver Speed (max) — 500 MHz
Total LABs/CLBs — 1900
DSP Blocks — [DATA_NEEDED: DSP block count]
Number of Transceivers — [DATA_NEEDED: transceiver count]
Uri ng Pagpapasok — Surface Mount (BGA)
Level ng MSL — [DATA_NEEDED: MSL level]

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