EP3SL50F780C3 vs EP3SE50F780C3 比較

詳細並排比較 EP3SL50F780C3 由 Intel 與 EP3SE50F780C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL50F780C3 EP3SE50F780C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III L (low-power) Stratix III E
Series Stratix III —
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory Bits 2,184,192 —
User I/Os 488 488
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
工作溫度 0C to +85C (Commercial) 0C to +85C (Commercial grade, 'C' suffix)
Speed Grade 3 —
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
濕度敏感等級 (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Logic Elements (LE) — 47,500
Embedded Memory (BRAM) — 5,760 Kbits
封裝 — 780-ball FC-FBGA (FineLine BGA)
Process Technology — 65 nm
Core Voltage — 1.1 V
Logic Voltage — 0.9 V
Transceiver Speed (max) — 500 MHz
Total LABs/CLBs — 1900
DSP Blocks — [DATA_NEEDED: DSP block count]
Number of Transceivers — [DATA_NEEDED: transceiver count]
安裝類型 — Surface Mount (BGA)
MSL 等級 — [DATA_NEEDED: MSL level]

資料表與資源

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