EP3SL70F780C3N vs EP3SL70F780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C3N sa pamamagitan ng Intel at EP3SL70F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL70F780C3N | EP3SL70F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Series | Stratix III L | — |
| Logic Elements | 67,500 | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,750 | — |
| Embedded Memory Bits | 2,699,264 bits (2.699 Mbit) | 2,699,264 bits |
| Embedded Multipliers (18x18) | 488 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 1.1 V |
| Number of I/O Banks | 8 | — |
| Bilang ng Pins | 780 | — |
| Package Type | 780-ball FC-FBGA (29x29 mm) | — |
| Hanay ng Temperature na Operasyon | Commercial (0C to +85C) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (lead-free FBGA) | [DATA_NEEDED: RoHS status] |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III L |
| Maximum User I/O | — | 488 |
| Temperature na Operasyon | — | -40 C to +100 C (Industrial) |
| Speed Grade | — | I3 (industrial) |
| Process Node | — | 65 nm |
| Packhaging | — | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |