EP3SL70F780C3N vs EP3SL70F780I3 比較
詳細並排比較 EP3SL70F780C3N 由 Intel 與 EP3SL70F780I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL70F780C3N | EP3SL70F780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 最後購買 |
| Series | Stratix III L | — |
| Logic Elements | 67,500 | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,750 | — |
| Embedded Memory Bits | 2,699,264 bits (2.699 Mbit) | 2,699,264 bits |
| Embedded Multipliers (18x18) | 488 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 1.1 V |
| Number of I/O Banks | 8 | — |
| 腳位數 | 780 | — |
| Package Type | 780-ball FC-FBGA (29x29 mm) | — |
| 工作溫度範圍 | Commercial (0C to +85C) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant (lead-free FBGA) | [DATA_NEEDED: RoHS status] |
| MSL 等級 | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III L |
| Maximum User I/O | — | 488 |
| 工作溫度 | — | -40 C to +100 C (Industrial) |
| Speed Grade | — | I3 (industrial) |
| Process Node | — | 65 nm |
| 封裝 | — | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |