EP4CGX50DF23C7N vs EP4CGX50DF23I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF23C7N sa pamamagitan ng Intel at EP4CGX50DF23I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50DF23C7N | EP4CGX50DF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV |
| Logic Elements | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total RAM Bits | 2,432 Kbit (≈ 304 KB) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 2 | — |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | — |
| Number of I/O Pins | 290 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | — |
| Packhaging | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-ball FBGA (BGA-484) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| Tindminan RoHS | Compliant (Pb-free variant) | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Series | — | Cyclone IV GX |
| Logic Elements (LE) | — | 49,888 |
| Embedded Memory | — | 2,562 Kbit |
| Number of Logic Cells | — | 49,888 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum User I/O Pins | — | 290 |
| Number of Transceivers | — | 8 (3.125 Gbps) |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.00 mm |
| Operating Temperature (Industrial) | — | -40 C to +100 C |
| Speed Grade | — | I7 |
| Number of PLLs | — | 4 |