EP4SGX110DF29I3G vs EP4SGX110DF29C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX110DF29I3G sa pamamagitan ng Intel at EP4SGX110DF29C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4SGX110DF29I3G EP4SGX110DF29C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Stratix IV GX Stratix IV GX
Family Stratix IV Stratix IV GX
Process Technology 40 nm 40 nm
Logic Elements (LE) 105,600 —
Adaptive Logic Modules (ALM) 41,250 —
Embedded Memory Bits 9,793,536 —
Embedded Memory Blocks (M9K) 660 —
DSP Blocks 660 (18x18 multipliers) 266 (18x18 multipliers)
Maximum User I/O 372 —
Transceivers 16 (up to 8.5 Gbps) —
PCIe Hard IP Gen2 x4 (8.5 Gbps) —
Packhaging 780-ball FCBGA, 29x29 mm —
Package Code DF29 —
Temperature na Operasyon -40C to +100C (Industrial I3 grade) Commercial (0C to +85C) - per C3 grade suffix
Speed Grade 3 —
Uri ng Pagpapasok Surface Mount Surface Mount (Flip-Chip BGA)
Level ng MSL [DATA_NEEDED: MSL level] —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS compliance status]
Logic Elements — 105,600
Adaptive Logic Modules (ALMs) — 4,224 LABs
Total Memory Bits — 9,793,536
User I/O Count — 372
Package Type — 780-BBGA, FCBGA (Flip-Chip)
Package Pin/Ball Count — 780
Volte ng Pagbibigay — 0.9 V core
Transceiver Data Rate — Up to 8.5 Gbps
Transceiver Count — [DATA_NEEDED: number of transceivers]

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