EPF10K100EBC356-2 vs EPF10K100EBC356-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EBC356-2 sa pamamagitan ng Intel at EPF10K100EBC356-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K100EBC356-2 EPF10K100EBC356-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series FLEX-10KE —
Family Embedded Programmable Logic Device (PLD) FLEX-10KE
Typical Gates 100,000 —
Maximum System Gates 158,000 —
Logic Elements (LEs) 4,992 —
Number of LABs/CLBs 624 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 49,152 —
User I/O Pins 274 —
Supply Voltage (Core) 2.375 V to 2.625 V (2.5 V nominal) 2.5 V (2.375 V to 2.625 V)
Propagation Delay (tPD) 0.5 ns —
Internal Operating Frequency up to 250 MHz —
Process Technology CMOS, SRAM-based 0.22 micron CMOS
Package Type 356-LBGA (35 x 35 mm, 1.27 mm pitch) —
Temperature na Operasyon 0 C to 70 C (Commercial) 0 C to 70 C (Commercial)
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Method SRAM, JTAG (IEEE 1149.1) —
Speed Grade -2 -3
Tindminan RoHS [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS compliance status]
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Elements / Cells — 4,992
Total Gates — ~100,000
Logic Array Blocks (LABs) — 624
Embedded Memory (RAM bits) — 49,152
User I/Os — 274
Propagation Delay (typical) — 0.6 ns
Maximum Internal Frequency — 200 MHz
Configuration Technology — SRAM (volatile)
Packhaging — 356-LBGA (35 x 35 mm)

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