EPF10K200EBI600-2N vs EPF10K200EBC600-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBI600-2N sa pamamagitan ng Intel at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K200EBI600-2N | EPF10K200EBC600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | 9984 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Dedicated Inputs | 6 | — |
| Packhaging | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) | — |
| Technology / Process | 0.22 µm CMOS SRAM | — |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) | — |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) | 0.4 ns |
| Maximum Internal Frequency | 200 MHz | — |
| Temperature na Operasyon | 0 °C to +70 °C (commercial) | 0°C to +70°C (Commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | FLEX-10KE |
| Logic Family | — | CMOS (SRAM-based) |
| Process Technology | — | 0.30 µm CMOS |
| Typical Gate Count | — | 200,000 gates |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| Volte ng Pagbibigay | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Part Status | — | Obsolete |