EPF10K200EFC672-2 vs EPF10K130EFC672-2X Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EFC672-2 sa pamamagitan ng Intel at EPF10K130EFC672-2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EFC672-2 EPF10K130EFC672-2X
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family FLEX 10KE —
Logic Elements 9,984 —
Typical Gates 200,000 —
Maximum User I/Os 470 —
Embedded Memory 98,304 bits —
Embedded Array Blocks (EABs) 12 —
Logic Array Blocks (LABs) 624 —
Packhaging 672-BBGA (FineLine BGA) 672-FBGA (FineLine BGA, 27x27 mm)
Package Dimensions 45 x 45 mm —
Ball Pitch 1.27 mm 1.0 mm
Process Technology 0.22 um CMOS 0.22 μm CMOS SRAM
Speed Grade -2 —
Propagation Delay 0.4 ns —
Temperature na Operasyon 0 C to 70 C 0C to +70C (commercial)
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
Programmability JTAG (IEEE 1149.1) / in-system —
Tindminan RoHS Compliant (per distributor listing) [DATA_NEEDED: RoHS compliance status]
Logic Family CMOS CMOS, SRAM-based
Series — FLEX 10KE
Number of Logic Elements (LEs) — 6656
Number of Logic Array Blocks (LABs) — 832
Total RAM Bits — 65536
Number of User I/Os — 413
Number of DLLs — 4
Core Supply Voltage — 2.5 V (2.375 V to 2.625 V)
I/O Supply Voltage — 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V)
Configuration Method — Serial configuration device, JTAG
Uri ng Pagpapasok — Surface Mount (BGA)

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