H5TC4G63MFR-PBA vs K4B4G1646E-BYMA Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng H5TC4G63MFR-PBA sa pamamagitan ng SK hynix at K4B4G1646E-BYMA sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | H5TC4G63MFR-PBA | K4B4G1646E-BYMA |
|---|---|---|
| Brand | SK hynix | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Presyo ng Yunit (USD) | — | $14.32 |
| Uri ng Memory | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | 4 Gb |
| Organisasyon | 256M x 16 | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V (+0.100V/-0.067V) | — |
| Rate ng Data | 1866 Mbps (PC3L-14900) | 1866 Mbps/pin |
| Packhaging | 96-ball FBGA | FBGA-96 |
| Number of Banks | 8 | — |
| Burst Length | BL8, BL4 (with burst chop) | [DATA_NEEDED: Burst Length] |
| CAS Latency (CL) | Programmable | — |
| CAS Write Latency (CWL) | Programmable | — |
| Additive Latency | Programmable | — |
| On-Die Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| Auto Self-Refresh | Yes | — |
| Temperature-Compensated Self-Refresh | Yes | — |
| Process Technology | 30nm-class | — |
| RoHS Compliant | Yes (Lead-Free & Halogen-Free) | — |
| Volte ng Pagbibigay | — | 1.35 V (1.28 V to 1.575 V) |
| Clock Frequency | — | 933 MHz |
| Temperature na Operasyon | — | 0°C to +95°C |
| Operating Current | — | 14 mA |
| Standby Current | — | 2 mA, 3 mA |
| Uri ng Pagpapasok | — | Surface Mount |
| RoHS | — | Compliant |
| Latensya ng CAS | — | [DATA_NEEDED: CAS Latency] |
| Bilang ng Pins | — | 96 |