H5TC4G63MFR-PBA vs K4B4G1646E-BYMA Comparison

Detailed side-by-side comparison of H5TC4G63MFR-PBA by SK hynix and K4B4G1646E-BYMA by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5TC4G63MFR-PBA H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA ✓ Active
Samsung Electronics
K4B4G1646E-BYMA K4B4G1646E-BYMA - 4Gb DDR3L SDRAM 1866MHz | Samsung

K4B4G1646E-BYMA - 4Gb DDR3L SDRAM 1866MHz | Samsung

K4B4G1646E-BYMA ✓ Active

Specification Comparison

Parameter H5TC4G63MFR-PBA K4B4G1646E-BYMA
Brand SK hynix Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Unit Price (USD) — $14.32
Memory Type DDR3L SDRAM DDR3L SDRAM
Density 4 Gb 4 Gb
Organization 256M x 16 256M x 16
Supply Voltage (VDD/VDDQ) 1.35V (+0.100V/-0.067V) —
Data Rate 1866 Mbps (PC3L-14900) 1866 Mbps/pin
Package 96-ball FBGA FBGA-96
Number of Banks 8 —
Burst Length BL8, BL4 (with burst chop) [DATA_NEEDED: Burst Length]
CAS Latency (CL) Programmable —
CAS Write Latency (CWL) Programmable —
Additive Latency Programmable —
On-Die Termination (ODT) Yes —
ZQ Calibration Yes —
Write Leveling Yes —
Auto Self-Refresh Yes —
Temperature-Compensated Self-Refresh Yes —
Process Technology 30nm-class —
RoHS Compliant Yes (Lead-Free & Halogen-Free) —
Supply Voltage — 1.35 V (1.28 V to 1.575 V)
Clock Frequency — 933 MHz
Operating Temperature — 0°C to +95°C
Operating Current — 14 mA
Standby Current — 2 mA, 3 mA
Mounting Type — Surface Mount
RoHS — Compliant
CAS Latency — [DATA_NEEDED: CAS Latency]
Number of Pins — 96

Datasheets & Resources

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