IRF640NSTRLPBF vs IRFZ48NSTRLPBF Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng IRF640NSTRLPBF sa pamamagitan ng Infineon at IRFZ48NSTRLPBF sa pamamagitan ng Infineon. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | IRF640NSTRLPBF | IRFZ48NSTRLPBF |
|---|---|---|
| Brand | Infineon | Infineon |
| Kategorya | MOSFETs | MOSFETs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| FET Type | N-Channel | N-Channel Power MOSFET |
| Technology | HEXFET (5th generation, trench MOSFET) | — |
| Drain-to-Source Voltage (VDS) | 200 V | 55 V |
| Continuous Drain Current (ID, Tc=25C) | 18 A | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current] | [DATA_NEEDED: pulsed drain current] |
| Maximum Power Dissipation (PD, Tc=25C) | 150 W | — |
| On-Resistance (RDS(on)) at VGS=10V | 0.15 ohm | — |
| Gate-to-Source Threshold Voltage (VGS(th)) | [DATA_NEEDED: VGS(th) typical/min] | 2.0 V to 4.0 V |
| Total Gate Charge (Qg) | 44.7 nC | 54 nC |
| Input Capacitance (Ciss) | [DATA_NEEDED: Ciss] | — |
| Output Capacitance (Coss) | [DATA_NEEDED: Coss] | — |
| Reverse Transfer Capacitance (Crss) | [DATA_NEEDED: Crss] | — |
| Hanay ng Temperature ng Junction na Operasyon | -55C to +175C | — |
| Packhaging | D2PAK (TO-263AB), surface mount, 3-pin (2+tab) | D2PAK (TO-263) Surface Mount |
| Uri ng Pagpapasok | Surface Mount (Tape and Reel) | Surface Mount |
| Lead-Free (PbF) | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Continuous Drain Current (ID) @ Tc=25C | — | 64 A |
| Static Drain-to-Source On-Resistance (Rds(on)) | — | 14 mΩ at VGS = 10 V |
| Gate-to-Source Voltage (VGS) max | — | ±20 V |
| Power Dissipation (Pd) @ Tc=25C | — | 130 W |
| Power Dissipation (Pd) @ Ta=25C on FR-4 | — | 3.8 W |
| Temperature ng Junction na Operasyon | — | -55C to +175C |
| Packaging | — | Tape & Reel (13-inch reel, TRL) |
| Lead Finish | — | Lead-free (PBF) matte tin |
| Technology Family | — | HEXFET advanced process technology |