K4AAG085WA-BCWE vs K4AAG165WA-BCWE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4AAG085WA-BCWE sa pamamagitan ng Samsung Electronics at K4AAG165WA-BCWE sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4AAG085WA-BCWE - 16Gb DDR4-3200 SDRAM 1.2V | Samsung
K4AAG085WA-BCWE ✓ NakahandaSamsung Electronics
K4AAG165WA-BCWE - 16Gb DDR4 3200Mbps SDRAM | Samsung
K4AAG165WA-BCWE ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4AAG085WA-BCWE | K4AAG165WA-BCWE |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | — |
| Organisasyon | 2G x 8 | — |
| Rate ng Data | 3200 Mbps (DDR4-3200) | 3200 Mbps (DDR4-3200) |
| Volte ng Pagbibigay | 1.2 V | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| Temperature na Operasyon | 0 C to 85 C | -40C to +95C |
| Packhaging | 78-ball FBGA (9 x 11 mm, 0.8 mm pitch) | 96-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Interface | JEDEC DDR4 | — |
| Memory Width | 8-bit | — |
| Refresh | Auto-refresh (per JEDEC DDR4) | — |
| Application Class | Main memory / embedded DRAM | — |
| Tindminan RoHS | Compliant (per JLCPCB listing) | Compliant |
| Manufacturer | Samsung Electronics | — |
| Laki ng Memory | — | 16 Gb (2 GB) |
| Memory Organization | — | 1G x 16 |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| Uri ng Interface | — | Parallel, DDR4 |
| Memory Format | — | DRAM (Volatile) |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |