K9LCG08U1M vs K9HQGY8S5M Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng K9LCG08U1M sa pamamagitan ng Samsung Electronics at K9HQGY8S5M sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Samsung Electronics
K9LCG08U1M K9LCG08U1M - 64Gbit MLC NAND Flash | Samsung | SSD Storage

K9LCG08U1M - 64Gbit MLC NAND Flash | Samsung | SSD Storage

K9LCG08U1M ✓ Nakahanda
Samsung Electronics
K9HQGY8S5M K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro K9LCG08U1M K9HQGY8S5M
Brand Samsung Electronics Samsung Electronics
Kategorya Flash Memory ICs
Katayuan ng Lifecycle Aktibo Aktibo
Uri ng Memory NAND Flash, MLC —
Density 64 Gbit (8 GB) [DATA_NEEDED: total bit density]
Organisasyon x8 I/O —
Interface Asynchronous multiplexed NAND I/O NAND (ONFI/Toggle-style asynchronous interface) - exact timing mode [DATA_NEEDED: interface timing mode]
Cell Type MLC (2 bits per cell) —
Packhaging BGA —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Volte ng Pagbibigay [DATA_NEEDED: supply voltage] [DATA_NEEDED: VCC range]
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: block size]
Page Read Time [DATA_NEEDED: page read time] —
Page Program Time [DATA_NEEDED: page program time] —
Block Erase Time [DATA_NEEDED: block erase time] —
Endurance [DATA_NEEDED: program/erase cycles] —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Tindminan RoHS unknown [DATA_NEEDED: RoHS status]
Ordering Codes K9LCG08U1M-LCB0 / K9LCG08U1M-LCB00 / K9LCG08U1M-LCB —
Manufacturer — Samsung Electronics
Product Type — 3D V-NAND Flash Memory (stacked, client NAND)
Package Type — 316-ball Fine Pitch BGA (FBGA-316)
Die Configuration — 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis)
NAND Technology — 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis)
Memory Class — Non-volatile NAND flash
Program/Erase Cycles — [DATA_NEEDED: P/E endurance rating]
Level ng MSL — [DATA_NEEDED: moisture sensitivity level]
Original Application — Samsung SSD 850 Pro solid-state drive

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