M29F200FB55N3F2 vs M29F160FB55N3F2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M29F200FB55N3F2 sa pamamagitan ng Micron Technology at M29F160FB55N3F2 sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Micron Technology
M29F200FB55N3F2 - 2Mbit 5V NOR Flash 55ns 48-TSOP | Micron
M29F200FB55N3F2 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M29F200FB55N3F2 | M29F160FB55N3F2 |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Uri ng Memory | Parallel NOR Flash | Parallel NOR Flash |
| Density | 2 Mbit (2097 kbits) | 16777 kbits (16 Mbit) |
| Organisasyon | 256K x 8 bit / 128K x 16 bit | 1 Mword x 16 bits / 2 Mbyte x 8 bits |
| Number of Words | 128 K (x16 mode) | 1000 k |
| Bits per Word | 16 bits | 16 bits |
| Supply Voltage (VCC) | 5 V | — |
| Access Time | 55 ns | 55 ns |
| Boot Block Architecture | Bottom Boot Block (FB) | Bottom Boot Block |
| Programming | Embedded byte/word program algorithm | — |
| Erase | Embedded block erase controller | — |
| Temperature na Operasyon | -40C to +125C | -40 to +125 C |
| Packhaging | 48-TSOP I | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| Interface | Parallel | Parallel |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free) |
| Endurance | [DATA_NEEDED: program/erase cycles] | — |
| Volte ng Pagbibigay | — | 5 V |
| Package Type | — | 48-TSOP |
| Termination Finish | — | Lead-free (F2 suffix) |
| Program/Erase Controller | — | Embedded byte/word program algorithms |
| Block Protection | — | Hardware boot block protection |
| Speed Grade (from MPN) | — | 55 (55 ns) |