MC68EN360VR33L vs MC68EN360ZQ33L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC68EN360VR33L sa pamamagitan ng NXP Semiconductors at MC68EN360ZQ33L sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP
MC68EN360VR33L ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MC68EN360VR33L | MC68EN360ZQ33L |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | NRND |
| Processor Type | M683xx 32-bit CPU32+ | M683xx CPU32+ 32-Bit |
| Core Architecture | CPU32+ with QUICC RISC communications engine | CPU32+ with MMU |
| Core Count | 1 | — |
| Bus Speed / Operating Frequency | 33 MHz | — |
| Width ng Data Bus | 32-bit | — |
| Address Bus Width | 32-bit (4 GB space) | — |
| Volte ng Pagbibigay | 5 V | — |
| Ethernet MAC | Integrated 10/100 Ethernet (MII interface) - 'EN' suffix | — |
| Serial Communication Channels (SCC) | 4 (per QUICC engine) | — |
| DMA Channels | 2 (per QUICC engine) | 16 |
| Timers | 4 general-purpose 16-bit timers | — |
| DRAM Controller | Integrated, supports FPM/EDO DRAM | — |
| Interrupt Controller | Integrated, programmable priority | — |
| Packhaging | 357-Ball PBGA, 25x25 mm, 1.27 mm pitch ('VR') | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Temperature na Operasyon | -40C to +85C (industrial) | — |
| Instruction Set | M68k (CPU32+) binary-compatible | 68K / CPU32+ |
| Packaging | Tray | Tray |
| Lead Free / RoHS | Lead Free / RoHS Compliant | — |
| Process Technology | 0.57 um CMOS (per Freescale datasheet) | — |
| Clock Speed | — | 33 MHz |
| Supply Voltage na Operasyon | — | 5 V |
| Number of Cores | — | 1 |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Integrated Communication Engine | — | QUICC (SCC x4, SMC x2) |
| Integrated Ethernet MAC | — | 10/100 Mbps Fast Ethernet |
| Serial Interfaces | — | SCC x4, SMC x2, I2C, SPI |
| Packhaging / Kaso | — | 357-BBGA / 357-PBGA (25 x 25 mm) |
| Operating Temperature Grade | — | Commercial |
| Lead Free Status | — | Contains Lead |
| Tindminan RoHS | — | RoHS Non-Compliant |