MC9S08DZ60AMLC vs MC9S08DZ60AMLF Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08DZ60AMLC sa pamamagitan ng NXP Semiconductors at MC9S08DZ60AMLF sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MC9S08DZ60AMLC | MC9S08DZ60AMLF |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Core | HCS08 (CISC, 8-bit) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | — |
| EEPROM | 2 KB | — |
| Volte ng Pagbibigay | 2.7 V to 5.5 V | 3.3 V / 5 V |
| ADC | 24-channel, 12-bit, 2.5 us conversion | — |
| CAN Interface | 1x MSCAN (CAN 2.0A/B) | — |
| SCI / UART | 2 | — |
| SPI | 1 | — |
| I/O Pins | 40 (32-LQFP exposed count varies by mux) | — |
| LCD Driver | Up to 8x36 segments | — |
| Timers | TPM channels included | — |
| Packhaging | 32-LQFP (7x7 mm, 0.5 mm pitch) | 48-LQFP (7x7 mm) |
| Temperature na Operasyon | -40 C to +125 C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| Tindminan RoHS | Compliant | RoHS compliant (per distributor listing) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 4 KB |
| Data EEPROM | — | Embedded EEPROM |
| Connectivity | — | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 24-channel (16-channel 12-bit ADC per FindIC overview) |
| ADC Conversion Time | — | 2.5 us |
| Analog Comparators | — | 1 |
| Interrupt/Reset Sources | — | Up to 32 |
| Debug | — | On-chip background debug (BGND instruction) |
| Uri ng Pagpapasok | — | Surface Mount |
| Packaging | — | Tray |
| Katayuan ng Lifecycle | — | NRND (Not Recommended for New Designs) per NXP |