MC9S12DT256MPVE vs MC9S12D64CPVE Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DT256MPVE sa pamamagitan ng NXP Semiconductors at MC9S12D64CPVE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd

Pagsanggunian na paghahambing

Parametro MC9S12DT256MPVE MC9S12D64CPVE
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle NRND NRND
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz 25 MHz
Program Memory (Flash) 256 KB —
RAM 12 KB —
EEPROM 4 KB —
Width ng Data Bus 16-bit —
Volte ng Pagbibigay 2.35 V to 2.75 V (regulated core) 2.5 V / 5 V
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 8-channel, 10-bit (x2 ATD modules)
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
Packhaging 112-LQFP (20x20 mm) 112-LQFP (20x20 mm)
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon -40C to +125C (automotive grade) -40C to +85C (industrial)
Debug Interface Background Debug Mode (BDM) + JTAG —
Tindminan RoHS Compliant —
Katayuan ng Lifecycle NRND (Not Recommended for New Designs) —
Core Processor — HCS12
Core Size — 16-Bit
Architecture — CISC
Program Memory Size — 64 KB (64K x 8) Flash
RAM Size — 4 KB (4K x 8)
EEPROM Size — 1 KB (1K x 8)
Number of I/O — 91
Connectivity — CANbus, I2C, SCI, SPI
Peripherals — PWM, WDT, ECT, ATD
PWM Channels — 8
AEC-Q100 — Qualified (automotive)
Lead-Free / RoHS — Compliant per NXP product page

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