MC9S12DT256MPVE vs MC9S12D64CPVE 比較
詳細並排比較 MC9S12DT256MPVE 由 NXP Semiconductors 與 MC9S12D64CPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndNXP Semiconductors
MC9S12D64CPVE - 16-Bit HCS12 MCU, 64KB Flash, 25MHz, 112-LQFP | NXP
MC9S12D64CPVE Nrnd規格比較
| 參數 | MC9S12DT256MPVE | MC9S12D64CPVE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Core | HCS12 (16-bit CISC) | — |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| 資料匯流排寬度 | 16-bit | — |
| 供應電壓 | 2.35 V to 2.75 V (regulated core) | 2.5 V / 5 V |
| I/O Pins | 91 | — |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | 8-channel, 10-bit (x2 ATD modules) |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | — |
| 封裝 | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40C to +125C (automotive grade) | -40C to +85C (industrial) |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| RoHS 狀態 | Compliant | — |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | — |
| Core Processor | — | HCS12 |
| Core Size | — | 16-Bit |
| Architecture | — | CISC |
| Program Memory Size | — | 64 KB (64K x 8) Flash |
| RAM Size | — | 4 KB (4K x 8) |
| EEPROM Size | — | 1 KB (1K x 8) |
| Number of I/O | — | 91 |
| Connectivity | — | CANbus, I2C, SCI, SPI |
| Peripherals | — | PWM, WDT, ECT, ATD |
| PWM Channels | — | 8 |
| AEC-Q100 | — | Qualified (automotive) |
| Lead-Free / RoHS | — | Compliant per NXP product page |