MMA6262QR2 vs MMA6263QR2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MMA6262QR2 sa pamamagitan ng NXP Semiconductors at MMA6263QR2 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MMA6263QR2 - ±1.5g Dual-Axis Analog Accelerometer | NXP / Freescale
MMA6263QR2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MMA6262QR2 | MMA6263QR2 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Motion Sensors | Motion Sensors |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Type ng Sensor | Accelerometer, Dual-Axis (X, Y) | Accelerometer, Dual Axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g (g-select to ±6 g) |
| Sensitivity | 740 mV/g to 860 mV/g (at 3.3 V) | 740 mV/g to 860 mV/g (typ. 800 mV/g at 3.3 V) |
| Supply Voltage (VDD) | 3.15 V to 5.25 V (per MMA6801KW comp doc) | — |
| Type ng Output | Analog, Ratiometric | Analog, ratiometric voltage |
| Bandwidth (Low-Pass Filter) | 150 Hz (1-pole factory-set) | — |
| Zero-g Offset | Factory calibrated, no external trim required | — |
| Temperature Compensation | On-chip, factory-set | On-chip factory trimmed |
| Temperature na Operasyon | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] | — |
| Packhaging / Kaso | 16-QFN-EP (6x6 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Supplier Device Package | 16-QFN-EP (6x6) | — |
| Lead Free Status | Contains Lead (per digchip snippet) | — |
| Tindminan RoHS | RoHS3 Compliant | RoHS Compliant |
| Sense Technology | Capacitive Micromachined (MEMS) | — |
| Volte ng Pagbibigay | — | 3.3 V nominal (range per datasheet) |
| Bandwidth | — | 900 Hz sensor bandwidth |
| Low-Pass Filter | — | 1-pole on-chip, ~400 Hz cutoff |
| Zero-g Output (Typ) | — | 1.65 V (mid-supply) |
| Self-Test | — | Logic-level input on each axis |
| Packhaging | — | 16-QFN-EP (6x6 mm) with exposed pad |
| Lead Status | — | Contains Lead (legacy package) |
| Operating Principle | — | Capacitive micromachined (MEMS) |