MPC8250AZUPIBC vs MPC8260AZUPJDB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8250AZUPIBC sa pamamagitan ng NXP Semiconductors at MPC8260AZUPJDB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPC8260AZUPJDB ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MPC8250AZUPIBC | MPC8260AZUPJDB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 Core, 32-Bit | — |
| Core Speed | 300 MHz | — |
| Process Technology | 0.25 µm CMOS | 0.25 micrometer CMOS (HiP4) |
| Series | MPC82xx (PowerQUICC II) | PowerQUICC II (MPC8260A HiP4) |
| Coprocessor | Communications (HIP4C) | — |
| Packhaging | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Volte ng Pagbibigay | 3.3 V I/O | — |
| External Bus Width | 32-Bit (60x-compatible) | — |
| Cache | [DATA_NEEDED: L1 / L2 cache sizes] | — |
| Temperature na Operasyon | -40 °C to +85 °C (industrial) | [DATA_NEEDED: operating temperature range] |
| L1 Instruction Cache | 16 Kbyte | 32 KB |
| L1 Data Cache | 16 Kbyte | 32 KB |
| Peripherals | PCI, HDLC, Fast Ethernet, ATM, TDM | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Core | — | PowerPC G2, single core |
| Width ng Data Bus | — | 32-bit |
| Maksimum na Taktiko ng Oras | — | 300 MHz |
| Core Supply Voltage | — | 1.9 V to 2.2 V |
| I/O Supply Voltage | — | 3.3 V |
| Communications Processor Module (CPM) | — | Integrated (FCC, SCC, SMC) |
| External Bus | — | 60x bus, 64-bit data |
| Packaging | — | Tray |
| Lifecycle | — | End-of-Life / Last Time Buy (per NXP PCN) |