MPC8250AZUPIBC vs MPC8260AZUPJDB 比較
詳細並排比較 MPC8250AZUPIBC 由 NXP Semiconductors 與 MPC8260AZUPJDB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC8250AZUPIBC | MPC8260AZUPJDB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | Obsolete | 最後購買 |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 Core, 32-Bit | — |
| Core Speed | 300 MHz | — |
| Process Technology | 0.25 µm CMOS | 0.25 micrometer CMOS (HiP4) |
| Series | MPC82xx (PowerQUICC II) | PowerQUICC II (MPC8260A HiP4) |
| Coprocessor | Communications (HIP4C) | — |
| 封裝 | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| 供應電壓 | 3.3 V I/O | — |
| External Bus Width | 32-Bit (60x-compatible) | — |
| Cache | [DATA_NEEDED: L1 / L2 cache sizes] | — |
| 工作溫度 | -40 °C to +85 °C (industrial) | [DATA_NEEDED: operating temperature range] |
| L1 Instruction Cache | 16 Kbyte | 32 KB |
| L1 Data Cache | 16 Kbyte | 32 KB |
| Peripherals | PCI, HDLC, Fast Ethernet, ATM, TDM | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | unknown |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Core | — | PowerPC G2, single core |
| 資料匯流排寬度 | — | 32-bit |
| 最大時脈頻率 | — | 300 MHz |
| Core Supply Voltage | — | 1.9 V to 2.2 V |
| I/O Supply Voltage | — | 3.3 V |
| Communications Processor Module (CPM) | — | Integrated (FCC, SCC, SMC) |
| External Bus | — | 60x bus, 64-bit data |
| Packaging | — | Tray |
| Lifecycle | — | End-of-Life / Last Time Buy (per NXP PCN) |