MPC855TVR66D4 vs MPC860SRVR66D4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC855TVR66D4 sa pamamagitan ng NXP Semiconductors at MPC860SRVR66D4 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ Tapus ng BuhayNXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MPC855TVR66D4 | MPC860SRVR66D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Huling Pagbili |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (single core) | — |
| Width ng Data Bus | 32 bit | — |
| Maksimum na Taktiko ng Oras | 66 MHz | — |
| Process Technology | 0.32 µm | — |
| Packhaging | 357-PBGA (25x25 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0 °C to +95 °C | -40C to +95C |
| Ethernet Support | Fast Ethernet (100 Mbps) | — |
| Communication Interfaces | ENET, ATM, HDLC, PCMCIA | — |
| Communication Processor Module | Yes (CPM, dedicated RISC engine) | — |
| Kategorya | Microprocessors (MPU) | — |
| Tray Packaging | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Type | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC 32-bit |
| Number of Cores | — | 1 |
| Clock Speed | — | 66 MHz |
| Operating Voltage | — | 3.3 V (5 V tolerant I/O) |
| Instruction Cache | — | 4 Kbyte |
| Data Cache | — | 4 Kbyte |
| MMU | — | Yes |
| Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/SPI/I2C) |
| Multiply-Accumulate (MAC) Unit | — | Yes |
| JTAG / Debug | — | IEEE 1149.1 compliant |
| Packhaging / Kaso | — | 357-PBGA (25 mm x 25 mm) |
| Packaging (Shipping) | — | Tray |
| Lead Free Status | — | Lead Free |