MSC8157SVT1000A vs MSC8144ETVT800A Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MSC8157SVT1000A sa pamamagitan ng NXP Semiconductors at MSC8144ETVT800A sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteNXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoletePagsanggunian na paghahambing
| Parametro | MSC8157SVT1000A | MSC8144ETVT800A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | DSP | DSP |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Product Type | Multi-core Digital Signal Processor (DSP SoC) | — |
| Architecture | StarCore SC3850, six cores | — |
| Width ng Data Bus | 64-bit | — |
| Maximum Clock Speed | 1 GHz | — |
| Performance | 1000 MIPS per core, up to 6000 MIPS aggregate | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| L2 Cache (unified) | Shared KB-scale unified L2 | — |
| Volte ng Pagbibigay | 1 V (core) + I/O rails | — |
| Package Type | FCBGA-783 (Flip-Chip BGA) | — |
| Package Size | 29 mm x 29 mm | — |
| Bilang ng Pin | 783 | — |
| Temperature na Operasyon | -40C to +105C | -40C to +105C |
| Lead Free | Yes | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status not in web data] |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Memory Interface | External DDR2/DDR3 SDRAM controller | — |
| Serial Interfaces | SerDes, Ethernet MAC, I2C, UART | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| On-Chip RAM | — | 10.5 MB |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| Packhaging | — | 783-FCBGA (29x29 mm) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Interfaces | — | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | — | High-performance multi-core DSP, SIMD |