MT40A1G8SA-062E vs YZ48G08V-F9HPI-M Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MT40A1G8SA-062E sa pamamagitan ng Micron Technology at YZ48G08V-F9HPI-M sa pamamagitan ng Loongtion. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MT40A1G8SA-062E | YZ48G08V-F9HPI-M |
|---|---|---|
| Brand | Micron Technology | Loongtion |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| Organisasyon | 1G x 8 | 1G x 8 |
| Rate ng Data | 3200 MT/s (DDR4-3200) | 3200 MT/s |
| Clock Frequency | 1.6 GHz | — |
| Access Time (CAS Latency) | CL22 at 3200 MT/s | — |
| Row Access Time | 19 ns | — |
| VDD / VDDQ | 1.2 V +/-60 mV | — |
| VPP | 2.5 V, -125 mV, +250 mV | — |
| Internal Banks | 16 banks (4 bank groups x 4 banks) | — |
| Refresh | 8192-cycle; 64 ms (0-85C), 32 ms (85-95C), 16 ms (>95C) | — |
| Temperature na Operasyon | 0C to +95C (CT range; IT: -40C to +95C) | — |
| I/O Type | 1.2 V pseudo open-drain | — |
| Burst Length | BL8, BC4 (burst chop) | — |
| Packhaging | 78-ball FBGA (7.5 x 11 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Mga Karakteristika | Auto self-refresh, write leveling, dynamic ODT, CRC, auto precharge, ZQ calibration, on-die adjustable VREFDQ | — |
| Volte ng Pagbibigay | — | 1.2 V |
| Hanay ng Temperature na Operasyon | — | -40°C to +85°C |
| Package Type | — | FBGA78 |
| Interface | — | Parallel |
| Latensya ng CAS | — | [DATA_NEEDED: CAS Latency] |
| Row Cycle Time (tRC) | — | [DATA_NEEDED: tRC] |
| Refresh Cycle Time (tRFC) | — | [DATA_NEEDED: tRFC] |
| Tindminan RoHS | — | Compliant |
| REACH Status | — | Compliant |
| AEC-Q100 | — | Not Applicable |