XC3S200-4FTG256I vs XC3S200-4FT256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC3S200-4FTG256I sa pamamagitan ng Xilinx at XC3S200-4FT256I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC3S200-4FTG256I | XC3S200-4FT256I |
|---|---|---|
| Brand | Xilinx | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Spartan-3 | — |
| System Gates | 200,000 | 50,000 gates |
| Logic Cells | 4,320 | — |
| Slices | 2,160 | — |
| Block RAM | 216 Kbit (12 blocks x 18 Kbit) | [DATA_NEEDED: block RAM resources] |
| Dedicated Multipliers | 4 (18x18) | — |
| DCM (Digital Clock Manager) | 4 | — |
| Maximum User I/O | 173 | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | -4 | -4 |
| Process Technology | 90 nm | — |
| Packhaging | 256-ball FTBGA (FTG256), 17 x 17 mm | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0 C to +85 C |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball | — |
| Peak Reflow Time | 30 s | — |
| Tindminan RoHS | Compliant (G suffix = lead-free) | Compliant |
| Device Type | — | Spartan-3 field-programmable gate array (FPGA) |
| Nominal System Gates | — | 200,000 gates |
| Logic Cells / Logic Blocks | — | 4,320 |
| Maksimum na Taktiko ng Oras | — | 630 MHz |
| Technology | — | 90 nm |
| Core Supply Voltage | — | 1.14 V to 1.26 V |
| Package Type | — | FTBGA-256 |
| Package Dimensions | — | 17 mm x 17 mm |
| Number of Terminals | — | 256 |
| Device Family | — | Spartan-3 |
| Temperature Grade | — | Industrial |
| User I/O Count | — | [DATA_NEEDED: user I/O count] |
| DSP Resources | — | [DATA_NEEDED: DSP resources] |