EP1SGX25DF672I6 - Stratix GX FPGA 25,660 Cells | Intel | 672-FBGA
MPN: EP1SGX25DF672I6 ✗ Tapus ng BuhayEP1SGX25DF672I6 Ulas
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined after manufacturing by the customer rather than the fab. FPGAs occupy the programmable-logic branch of the semiconductor hierarchy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor), and the Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplanes, communications line cards, and signal-processing pipelines. The "GX" suffix distinguishes this family from the base Stratix line by embedding multi-gigabit transceivers (MGTs) directly on-die.
Key features of the EP1SGX25DF672I6 include 25,660 logic elements, 1,944,576 RAM bits (192 Kbytes), 455 user I/O, dedicated on-chip transceiver circuitry, embedded DSP blocks, and clock management via PLLs. The 672-ball FBGA at 33 x 33 mm with 1.0 mm pitch is RoHS compliant and lead-free per the manufacturer's product page.
Typical applications include high-speed serial interface bridging, custom communications backplanes, protocol conversion (e.g., SPI 4.2, RapidIO, SerialLite), and DSP front-end co-processing. The combination of 455 user I/O and embedded transceiver macros makes this part attractive for line-card designs that require both wide parallel buses and multiple serial links.
Design considerations for the EP1SGX25DF672I6 include multi-rail power sequencing (1.5 V VCCINT plus VCCIO banks), careful BGA fan-out, and thermal management of the 672-ball package. Designers should use the Quartus II design toolchain, which natively supports this device family and provides IP cores for the on-chip transceivers and DSP blocks.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not collected in any single datasheet document.
Mga alternatibo na pwedeng ilagay na EP1SGX25DF672I6 — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP1SGX25DF672I6 (parehas na form factor at footprint) — pagkakaiba sa Operating Temperature, Package, Process Technology, Speed Grade, Family.
EP1SGX25DF672I6N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1SGX25DF672I5N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1SGX25DF672I5
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1SGX25DF672C7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1SGX25DF672C7
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1SGX25DF672C6N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1SGX25DF67216
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Tingnan ang Datasheet →EP1SGX25DF672I6 Mga Pinakamataas na Rating at Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 455 |
| Packhaging | 672-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Temperature na Operasyon | -40C to +85C (industrial, I6 grade) |
| Temperature Grade | Industrial (I6) |
| Maximum Internal Frequency | 5000 MHz (per datasheet header) |
| Uri ng Pagpapasok | Surface Mount |
| Lead Free / RoHS | Yes / Compliant |
| Bilang ng Pins | 672 |
| DSP Blocks | Yes (embedded multipliers) |
| On-chip Transceivers | Yes (Stratix GX embedded MGTs) |
| Clock Management | PLLs (on-chip) |
| Logic Family / Base Technology | CMOS |
Gabay sa Pin Configuration ng EP1SGX25DF672I6 672-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch
Pin configuration para sa EP1SGX25DF672I6 (672-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP1SGX25DF672I6.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP1SGX25DF672I6 ay nararapat para sa 6 aplikasyons: High-Speed Serial Interface Bridging, Communications Line Card Design, Custom Protocol Conversion (SPI 4.2 / RapidIO / SerialLite), DSP Co-Processing Front-End, Test and Measurement Backplane Aggregation, Legacy Industrial Control and Factory Automation.
High-Speed Serial Interface Bridging
The EP1SGX25DF672I6 is purpose-built for serial-interface bridging because it embeds Stratix GX multi-gigabit transceivers directly on-die, alongside 455 user I/O for parallel side-band signals. The 25,660-LE fabric is sized to absorb protocol-conversion state machines (8b/10b, 64b/66b, channel bonding) without external logic, while the on-chip PLLs generate the multiple reference clocks these links require. Engineers use this part to bridge between backplanes running proprietary SERDES rates and ASIC/ASSP interfaces that only expose parallel LVDS or HSTL buses. Compared with glue-logic plus external SERDES, the integrated approach cuts board area, BOM count, and inter-chip latency for 1-3 Gbps links.
Inirekomenda
Communications Line Card Design
In telecom line cards the EP1SGX25DF672I6 functions as the glue between a network processor, framer/mapper, and the physical-layer SERDES. Its 455 user I/O comfortably accommodates 32-bit LVDS datapaths to an NPU, plus SPI 4.2 / SFI-4 / SerialLite side channels. The 1,944,576 bits of block RAM are large enough to buffer packet segments and implement per-channel statistics counters in hardware. Industrial -40C to +85C temperature grade (I6) lets the card operate in uncontrolled central-office environments. Designers choose the 672-ball FBGA over the 1020-ball family variant to keep PCB layer count and BGA escape cost manageable for mid-density line cards.
Inirekomenda
Custom Protocol Conversion (SPI 4.2 / RapidIO / SerialLite)
The EP1SGX25DF672I6 is widely deployed as a protocol-conversion engine because its 25,660 LEs can hold substantial FIFOs and packet-fragmentation state machines, while the embedded MGTs serialize the converted traffic at 1-3.125 Gbps. Altera/Intel IP cores (SPI 4.2 PHY, RapidIO, SerialLite II) are pre-validated against the Stratix GX family, which compresses integration time. Industrial temperature grade supports outdoor base-station and industrial-Ethernet equipment. The 672-ball FBGA is small enough for ATCA/AdvancedMC mezzanine cards where board area is at a premium but bandwidth is not.
Inirekomenda
DSP Co-Processing Front-End
The Stratix GX die in the EP1SGX25DF672I6 includes embedded multiplier/accumulator blocks sized for FIR filters, FFTs, and channelizers - making the part an effective DSP front-end sitting ahead of a host CPU or DSP ASIC. Data enters through the embedded transceivers, gets beam-formed or pulse-shaped in the FPGA fabric, and exits on parallel LVDS to a downstream processor. The 1.9 Mbit of block RAM is large enough to hold coefficient banks for adaptive filters and short FFT windows. Designers select the EP1SGX25 over the smaller EP1SGX10 when the DSP workload exceeds ~10k LEs after synthesis.
Inirekomenda
Test and Measurement Backplane Aggregation
Test equipment vendors use the EP1SGX25DF672I6 to aggregate multiple instrument channels onto a high-speed serial backplane. The 455 user I/O easily collects 8-16 LVDS channels from ADC/DAC front ends, and the on-chip transceivers push the aggregated data upstream over one or more multi-gigabit links. The 25,660 LEs are large enough to implement custom packetization, timestamping, and trigger logic without an external microcontroller. Industrial temperature operation lets the aggregation board sit in chassis that are not thermally controlled. The 672-ball FBGA footprint matches the Stratix GX mechanical ecosystem used across multiple product generations.
Inirekomenda
Legacy Industrial Control and Factory Automation
The EP1SGX25DF672I6 is still in service in long-lifecycle industrial automation designs that were launched during the Stratix GX era (2004-2010). The FPGA implements custom motion-control state machines, encoder interfaces, and machine-vision pre-processing, while the on-chip transceivers carry compressed image data to a central controller over fibre. The industrial -40C to +85C temperature grade handles factory-floor thermal stress, and the obsolete status is mitigated by franchised-distributor stock. Engineers sustaining these systems migrate to drop-in speed-grade or temperature-grade variants on the existing DF672 footprint rather than redesigning PCBs.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP1SGX25DF672I6 — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP1SGX25DF672I6N | EP1SGX25DF672I5N | EP1SGX25DF672C7N | EP1SGX25DF672C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (DF672) 33x33 mm | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O | 455 | 455 | 455 | 455 | 455 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | I6 (industrial, -6) | I6 | I5 (faster) | C7 (commercial, slower) | C6 (commercial) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS / Lead Free | Yes | Yes (N finish) | Yes (N finish) | Yes (N finish) | Yes (N finish) |
| On-chip Transceivers | Yes (Stratix GX MGTs) | Yes | Yes | Yes | Yes |
Pangunahing mga Pagkakaiba
- Same-package drop-in flexibility across speed and temperature grades (kumpara saEP1SGX25DF672I5N)
- RoHS-compliant finish variant for new-build compliance (kumpara saEP1SGX25DF672I6N)
- Industrial temperature grade for harsh environments (kumpara saEP1SGX25DF672C7N)
Talaan ng Disenyo
Estimated: the EP1SGX25DF672I6 requires multi-rail power (VCCINT 1.5 V core plus multiple VCCIO bank voltages). Use a sequencer or RC delay network to ensure VCCINT ramps before VCCIO; reverse sequencing can latch-up I/O buffers. Decoupling per the Stratix GX pin connection guidelines: at least 0.1 uF and 0.01 uF ceramic per VCCINT pin, plus bulk tantalum or polymer capacitors near the package. The on-chip transceivers have separate PLL analog supplies (VCCA_PLL) that must be filtered with ferrite beads to keep PLL jitter within spec.
The 672-ball FBGA exposes its thermal pad via the centre ball array; solder the EP1SGX25DF672I6 to a PCB thermal pad with thermal vias to an internal copper plane to keep theta-JA manageable. In a fan-less industrial enclosure, derate internal-clock frequency or reduce transceiver count if the case temperature approaches +85C. The I6 grade (industrial -40C to +85C) is rated for the case, not ambient, so a real thermal probe is essential during validation.
The 33 x 33 mm 672-ball FBGA at 1.0 mm pitch requires 6 or 8 PCB layers with microvia-in-pad or via-on-pad escape for the centre balls. Maintain at least 4 routing layers between BGA and high-speed transceivers to control impedance (100 ohm differential for MGT pairs). Keep SERDES trace lengths matched within the tolerance specified in the Stratix GX handbook (typically under 150 mil intra-pair, 2-4 inches pair-to-pair) and avoid 90-degree bends on any MGT trace.
Do not confuse the EP1SGX25DF672I6 (672-ball DF672 package) with the EP1SGX25CF672I6 (672-ball CF672 package) - both are 672-ball but the BGA ball maps differ, so a PCB designed for DF672 will not accept CF672. Likewise, the EP1SGX40GF1020I6 is a 1020-ball package and is not pin-compatible. Always cross-check the package suffix (DF672 vs CF672 vs GF1020) against your PCB land pattern before ordering. Configuration mode pins (MSEL) must match the Quartus II programming file for the chosen configuration scheme (AS, PS, JTAG, or FPP).
Impormasyon ng Pagsunod sa Kautusan
RoHS and lead-free status confirmed by Intel Altera product page for EP1SGX25DF672I6. REACH compliance carried over from manufacturer documentation. Halogen-free and conflict-minerals declarations not explicitly published in the verified data - flagged as unknown.
