EP1SGX25DF672I6 - Stratix GX FPGA 25,660 Cells | Intel | 672-FBGA
MPN： EP1SGX25DF672I6 ✗ 停產EP1SGX25DF672I6 概覽
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined after manufacturing by the customer rather than the fab. FPGAs occupy the programmable-logic branch of the semiconductor hierarchy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor), and the Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplanes, communications line cards, and signal-processing pipelines. The "GX" suffix distinguishes this family from the base Stratix line by embedding multi-gigabit transceivers (MGTs) directly on-die.
Key features of the EP1SGX25DF672I6 include 25,660 logic elements, 1,944,576 RAM bits (192 Kbytes), 455 user I/O, dedicated on-chip transceiver circuitry, embedded DSP blocks, and clock management via PLLs. The 672-ball FBGA at 33 x 33 mm with 1.0 mm pitch is RoHS compliant and lead-free per the manufacturer's product page.
Typical applications include high-speed serial interface bridging, custom communications backplanes, protocol conversion (e.g., SPI 4.2, RapidIO, SerialLite), and DSP front-end co-processing. The combination of 455 user I/O and embedded transceiver macros makes this part attractive for line-card designs that require both wide parallel buses and multiple serial links.
Design considerations for the EP1SGX25DF672I6 include multi-rail power sequencing (1.5 V VCCINT plus VCCIO banks), careful BGA fan-out, and thermal management of the 672-ball package. Designers should use the Quartus II design toolchain, which natively supports this device family and provides IP cores for the on-chip transceivers and DSP blocks.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not collected in any single datasheet document.
直接替換替代品，適用於 EP1SGX25DF672I6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX25DF672I6 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Process Technology, Speed Grade, Family.
EP1SGX25DF672I6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672I5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672I5
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF67216
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX25DF672I6 最大額定值與電氣特性
| Series | Stratix GX |
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 455 |
| 封裝 | 672-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| 工作溫度 | -40C to +85C (industrial, I6 grade) |
| Temperature Grade | Industrial (I6) |
| Maximum Internal Frequency | 5000 MHz (per datasheet header) |
| 安裝類型 | Surface Mount |
| Lead Free / RoHS | Yes / Compliant |
| 腳位數 | 672 |
| DSP Blocks | Yes (embedded multipliers) |
| On-chip Transceivers | Yes (Stratix GX embedded MGTs) |
| Clock Management | PLLs (on-chip) |
| Logic Family / Base Technology | CMOS |
EP1SGX25DF672I6 672-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch 腳位配置指南
EP1SGX25DF672I6（672-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX25DF672I6.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX25DF672I6 適用於 6 應用s: High-Speed Serial Interface Bridging, Communications Line Card Design, Custom Protocol Conversion (SPI 4.2 / RapidIO / SerialLite), DSP Co-Processing Front-End, Test and Measurement Backplane Aggregation, Legacy Industrial Control and Factory Automation.
High-Speed Serial Interface Bridging
The EP1SGX25DF672I6 is purpose-built for serial-interface bridging because it embeds Stratix GX multi-gigabit transceivers directly on-die, alongside 455 user I/O for parallel side-band signals. The 25,660-LE fabric is sized to absorb protocol-conversion state machines (8b/10b, 64b/66b, channel bonding) without external logic, while the on-chip PLLs generate the multiple reference clocks these links require. Engineers use this part to bridge between backplanes running proprietary SERDES rates and ASIC/ASSP interfaces that only expose parallel LVDS or HSTL buses. Compared with glue-logic plus external SERDES, the integrated approach cuts board area, BOM count, and inter-chip latency for 1-3 Gbps links.
推薦
Communications Line Card Design
In telecom line cards the EP1SGX25DF672I6 functions as the glue between a network processor, framer/mapper, and the physical-layer SERDES. Its 455 user I/O comfortably accommodates 32-bit LVDS datapaths to an NPU, plus SPI 4.2 / SFI-4 / SerialLite side channels. The 1,944,576 bits of block RAM are large enough to buffer packet segments and implement per-channel statistics counters in hardware. Industrial -40C to +85C temperature grade (I6) lets the card operate in uncontrolled central-office environments. Designers choose the 672-ball FBGA over the 1020-ball family variant to keep PCB layer count and BGA escape cost manageable for mid-density line cards.
推薦
Custom Protocol Conversion (SPI 4.2 / RapidIO / SerialLite)
The EP1SGX25DF672I6 is widely deployed as a protocol-conversion engine because its 25,660 LEs can hold substantial FIFOs and packet-fragmentation state machines, while the embedded MGTs serialize the converted traffic at 1-3.125 Gbps. Altera/Intel IP cores (SPI 4.2 PHY, RapidIO, SerialLite II) are pre-validated against the Stratix GX family, which compresses integration time. Industrial temperature grade supports outdoor base-station and industrial-Ethernet equipment. The 672-ball FBGA is small enough for ATCA/AdvancedMC mezzanine cards where board area is at a premium but bandwidth is not.
推薦
DSP Co-Processing Front-End
The Stratix GX die in the EP1SGX25DF672I6 includes embedded multiplier/accumulator blocks sized for FIR filters, FFTs, and channelizers - making the part an effective DSP front-end sitting ahead of a host CPU or DSP ASIC. Data enters through the embedded transceivers, gets beam-formed or pulse-shaped in the FPGA fabric, and exits on parallel LVDS to a downstream processor. The 1.9 Mbit of block RAM is large enough to hold coefficient banks for adaptive filters and short FFT windows. Designers select the EP1SGX25 over the smaller EP1SGX10 when the DSP workload exceeds ~10k LEs after synthesis.
推薦
Test and Measurement Backplane Aggregation
Test equipment vendors use the EP1SGX25DF672I6 to aggregate multiple instrument channels onto a high-speed serial backplane. The 455 user I/O easily collects 8-16 LVDS channels from ADC/DAC front ends, and the on-chip transceivers push the aggregated data upstream over one or more multi-gigabit links. The 25,660 LEs are large enough to implement custom packetization, timestamping, and trigger logic without an external microcontroller. Industrial temperature operation lets the aggregation board sit in chassis that are not thermally controlled. The 672-ball FBGA footprint matches the Stratix GX mechanical ecosystem used across multiple product generations.
推薦
Legacy Industrial Control and Factory Automation
The EP1SGX25DF672I6 is still in service in long-lifecycle industrial automation designs that were launched during the Stratix GX era (2004-2010). The FPGA implements custom motion-control state machines, encoder interfaces, and machine-vision pre-processing, while the on-chip transceivers carry compressed image data to a central controller over fibre. The industrial -40C to +85C temperature grade handles factory-floor thermal stress, and the obsolete status is mitigated by franchised-distributor stock. Engineers sustaining these systems migrate to drop-in speed-grade or temperature-grade variants on the existing DF672 footprint rather than redesigning PCBs.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX25DF672I6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX25DF672I6N | EP1SGX25DF672I5N | EP1SGX25DF672C7N | EP1SGX25DF672C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (DF672) 33x33 mm | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O | 455 | 455 | 455 | 455 | 455 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | I6 (industrial, -6) | I6 | I5 (faster) | C7 (commercial, slower) | C6 (commercial) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS / Lead Free | Yes | Yes (N finish) | Yes (N finish) | Yes (N finish) | Yes (N finish) |
| On-chip Transceivers | Yes (Stratix GX MGTs) | Yes | Yes | Yes | Yes |
主要差異化特點
- Same-package drop-in flexibility across speed and temperature grades (對比EP1SGX25DF672I5N)
- RoHS-compliant finish variant for new-build compliance (對比EP1SGX25DF672I6N)
- Industrial temperature grade for harsh environments (對比EP1SGX25DF672C7N)
設計說明
Estimated: the EP1SGX25DF672I6 requires multi-rail power (VCCINT 1.5 V core plus multiple VCCIO bank voltages). Use a sequencer or RC delay network to ensure VCCINT ramps before VCCIO; reverse sequencing can latch-up I/O buffers. Decoupling per the Stratix GX pin connection guidelines: at least 0.1 uF and 0.01 uF ceramic per VCCINT pin, plus bulk tantalum or polymer capacitors near the package. The on-chip transceivers have separate PLL analog supplies (VCCA_PLL) that must be filtered with ferrite beads to keep PLL jitter within spec.
The 672-ball FBGA exposes its thermal pad via the centre ball array; solder the EP1SGX25DF672I6 to a PCB thermal pad with thermal vias to an internal copper plane to keep theta-JA manageable. In a fan-less industrial enclosure, derate internal-clock frequency or reduce transceiver count if the case temperature approaches +85C. The I6 grade (industrial -40C to +85C) is rated for the case, not ambient, so a real thermal probe is essential during validation.
The 33 x 33 mm 672-ball FBGA at 1.0 mm pitch requires 6 or 8 PCB layers with microvia-in-pad or via-on-pad escape for the centre balls. Maintain at least 4 routing layers between BGA and high-speed transceivers to control impedance (100 ohm differential for MGT pairs). Keep SERDES trace lengths matched within the tolerance specified in the Stratix GX handbook (typically under 150 mil intra-pair, 2-4 inches pair-to-pair) and avoid 90-degree bends on any MGT trace.
Do not confuse the EP1SGX25DF672I6 (672-ball DF672 package) with the EP1SGX25CF672I6 (672-ball CF672 package) - both are 672-ball but the BGA ball maps differ, so a PCB designed for DF672 will not accept CF672. Likewise, the EP1SGX40GF1020I6 is a 1020-ball package and is not pin-compatible. Always cross-check the package suffix (DF672 vs CF672 vs GF1020) against your PCB land pattern before ordering. Configuration mode pins (MSEL) must match the Quartus II programming file for the chosen configuration scheme (AS, PS, JTAG, or FPP).
合規資訊
RoHS and lead-free status confirmed by Intel Altera product page for EP1SGX25DF672I6. REACH compliance carried over from manufacturer documentation. Halogen-free and conflict-minerals declarations not explicitly published in the verified data - flagged as unknown.
