10AS066K3F35E2LG - Arria 10 SX 660K LE SoC FPGA 1152-FBGA | Intel
MPN: 10AS066K3F35E2LG ✓ Aktif10AS066K3F35E2LG Genel Bakış
An SoC FPGA is a single-chip integration of a microprocessor subsystem and an FPGA fabric. The Arria 10 SX series is Intel's mid-range SoC FPGA, positioned between the lower-density Cyclone V SoC and the high-performance Stratix 10 SoC in the broader programmable logic device hierarchy. The integrated ARM Cortex-A9 subsystem runs up to 1.5 GHz with CoreSight debug, while the FPGA fabric provides hardware acceleration for DSP, packet processing, and custom interfaces - enabling lower BOM cost, lower power, and tighter deterministic latency than a discrete CPU + FPGA two-chip solution.
Key features include 660K logic elements, 256 KB of embedded memory (per search-engine snippet), hard DDR3/DDR4 memory controllers, transceivers, and 396 user I/Os. The device targets industrial temperature grade and supports configuration via fast passive parallel (FPP) and active serial (AS) schemes. The F35 package designation indicates a 35 mm x 35 mm FCBGA with 1152 balls.
Typical applications include wireless baseband processing, military radar, medical imaging, industrial machine vision, and high-performance test & measurement. The HPS (Hard Processor System) makes it well suited to applications requiring both Linux/real-time OS execution and parallel hardware processing, such as software-defined radio (SDR) and protocol-aware network appliances.
The -E2 speed grade balances timing margin and power; -E1 (fastest) and -E3 (lowest power) variants are also offered in this device family. The 'K3' code denotes logic density 660 and 3 (transceiver/feature) tier within Arria 10 SX.
Drop-in alternatifler için 10AS066K3F35E2LG — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller 10AS066K3F35E2LG (aynı form faktörü ve ayağa oturma) — farklı olan Package, Speed Grade, Logic Elements, Mounting Type, RoHS Status.
10AS066K3F35E2SG
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10AS066K3F35I2LG
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10AS066K3F35E1HG
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
10AS066K2F35E2LG
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10AS066K2F35E2SG
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10AS066K2F35I2SG
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10AS066K2F35I2LG
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10AS066K3F35E2LG Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Core Voltage | 0.9 V |
| Speed Grade | -E2 |
| Paket | 1152-ball FCBGA, 35 mm x 35 mm |
| Package Code | F35 |
| User I/Os | 396 |
| Memory Cells (per snippet) | 660,000 cells (LE equivalent) |
| On-chip Memory | 256 KB (per FindIC snippet) |
| Configuration Scheme | FPP, AS supported |
| Temperature Grade | Industrial |
| Montaj Türü | Surface Mount (BGA) |
| RoHS Durumu | Compliant (per FindIC listing) |
10AS066K3F35E2LG f35 Pin Yapısı Kılavuzu
10AS066K3F35E2LG (f35 paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: 10AS066K3F35E2LG.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
10AS066K3F35E2LG için uygundur 6 uygulamas: Software-Defined Radio (SDR) Baseband, Military Radar Signal Processing, Medical Imaging (Ultrasound / CT Front-End), Industrial Machine Vision, High-Performance Test & Measurement, 5G / Wireless Baseband Processing.
Software-Defined Radio (SDR) Baseband
The 10AS066K3F35E2LG is well-suited to SDR baseband processing because its dual-core ARM Cortex-A9 HPS running up to 1.5 GHz handles protocol stacks, control-plane processing, and Linux/RTOS execution, while the 660K-LE FPGA fabric delivers parallel DSP for FFTs, channelization, and modulation/demodulation at sample rates beyond the reach of general-purpose DSPs. Arria 10 SX transceivers support multi-gigabit links to JESD204B/C data converters and RF front ends, enabling a single-chip implementation of multi-channel SDR platforms. Compared with a discrete CPU + FPGA solution, the SoC integration reduces board area, inter-chip latency, and BOM cost.
Önerilen
Military Radar Signal Processing
In phased-array radar systems, the 10AS066K3F35E2LG's 660K logic elements provide massive parallel compute for pulse compression, MTI filtering, and digital beamforming across hundreds of antenna elements. The hardened ARM Cortex-A9 subsystem executes tracker and control-plane algorithms in real time. Multi-gigabit transceivers stream digitized antenna data to/from ADC/DAC devices, while industrial temperature grade supports ruggedized deployments. Per Arria 10 SX product literature, this density tier balances DSP throughput and power for medium-range surveillance and fire-control radar.
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Medical Imaging (Ultrasound / CT Front-End)
The 10AS066K3F35E2LG supports multi-channel beamforming in ultrasound and CT imaging systems. The 660K-LE FPGA fabric processes 64-128 channels of digitized RF in parallel for delay-and-sum beamforming, while the ARM Cortex-A9 HPS handles user interface, image reconstruction, and DICOM networking. On-chip memory and DDR4 controller support high-bandwidth data movement without external memory bottlenecks. The 20 nm process and integrated SoC reduce power and footprint versus older dual-FPGA ultrasound architectures, enabling portable diagnostic cart designs.
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Industrial Machine Vision
For high-speed industrial inspection lines, the 10AS066K3F35E2LG ingests multi-gigabit pixel streams from Camera Link, CoaXPress, or GigE Vision cameras through its transceivers, performs real-time image processing (filtering, segmentation, defect detection) in the FPGA fabric, and uses the ARM Cortex-A9 subsystem for line-control communication, HMI, and rejection decisions. The 396 user I/Os allow direct connection to encoders, lighting controllers, and PLCs without bridge logic. Industrial temperature grade and long-term Intel product support suit 24/7 factory-floor operation.
Önerilen
High-Performance Test & Measurement
The 10AS066K3F35E2LG powers next-generation oscilloscopes, protocol analyzers, and BERT platforms where the FPGA fabric handles real-time waveform processing, eye-diagram rendering, and trigger logic at multi-GS/s rates. The integrated ARM HPS runs the instrument's GUI, measurement firmware, and remote-control interfaces (LXI, USBTMC). Tight FPGA-to-HPS coupling minimizes data-movement latency for segmented capture and deep-memory triggers. The 20 nm Arria 10 process gives deterministic timing margin required for measurement-grade instruments.
Önerilen
5G / Wireless Baseband Processing
In small-cell and macro baseband units, the 10AS066K3F35E2LG implements PHY-layer functions (channel coding, MIMO detection, FFT/iFFT) in the FPGA fabric while the dual ARM Cortex-A9 cores run MAC scheduling and OAM stacks under Linux. Multiple CPRI or eCPRI fronthaul links are supported via the integrated transceivers, and the DDR4 controller handles high-bandwidth data movement between PHY buffers and upper layers. SoC integration reduces the bill of materials and power versus discrete ASSP + FPGA designs.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: 10AS066K3F35E2LG — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | 10AS066K3F35E2SG | 10AS066K3F35I2LG | 10AS066K3F35E1HG | 10AS066K2F35E2LG | 10AS066K2F35E2SG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA F35 (35x35 mm) | 1152-FBGA F35 (35x35 mm) - same | 1152-FBGA F35 (35x35 mm) - same | 1152-FBGA F35 (35x35 mm) - same | 1152-FBGA F35 (35x35 mm) - same | 1152-FBGA F35 (35x35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | -E2 | -E2 | -I2 (industrial) | -E1 (faster) | -E2 | -E2 |
| Feature Tier | K3 (max transceiver / hardened IP) | K3 | K3 | K3 | K2 (reduced) | K2 (reduced) |
| Ball Finish | Pb-free (G suffix) | SnPb (S suffix) | Pb-free (G suffix) | Pb-free (G suffix) | Pb-free (G suffix) | SnPb (S suffix) |
| Temperature Grade | Industrial (E suffix) | Industrial | Industrial | Extended industrial | Industrial | Industrial |
| Approx Unit Price (qty 1, USD) | 2850.00 | Similar (legacy SnPb) | Similar | Higher (~10-15% premium for -E1) | Lower (~10-20% K2 discount) | Lower (~10-20% K2 discount) |
Ana Farklılayıcılar
- Maximum K3-tier hardened IP and transceiver count in the 660K-LE density (karşılaştırma:10AS066K2F35E2LG)
- Mid-tier -E2 speed grade balances timing margin and cost (karşılaştırma:10AS066K3F35E1HG)
- Pb-free (RoHS-compliant) ball finish for new designs (karşılaştırma:10AS066K3F35E2SG)
Tasarım Notları
The 10AS066K3F35E2LG requires multiple supply rails (core 0.9 V, HPS core, HPS I/O, FPGA I/O banks, transceiver, and auxiliary) with strict power-up and power-down sequencing. Per Altera's Arria 10 pin connection guidelines, use an Intel-recommended power management IC such as the Enpirion EM11Z or equivalent multi-rail controller with PG signals tied back to CONF_DONE. Sequencing violations can cause inrush currents above the FPGA's tolerance and risk long-term reliability degradation.
Estimated: At full fabric utilization (~80%) and ~250K logic elements toggling at 250 MHz, the FPGA core can dissipate 8-12 W; the HPS at 1.5 GHz adds another 3-5 W; transceivers at full lane utilization add 1-2 W. The 1152-FBGA F35 package has a typical theta_JA around 8-10 C/W with proper 12-layer PCB and thermal vias under the heat slug. A heatsink with 1-2 C/W thermal resistance and 200 LFM airflow is recommended for industrial-grade deployment; use Arria 10 thermal models in Quartus PowerPlay for accurate per-design estimation.
The 1152-FBGA F35 footprint (35 mm x 35 mm, 1.0 mm ball pitch) requires an HDI PCB stack-up with laser-drilled microvias and at least 8 layers for signal integrity. Match length on DDR4 channels per the Arria 10 EMIF specification. Provide a full ground plane under the BGA with stitched ground vias on the thermal ball array for thermal dissipation. Reference the Arria 10 SoC Development Kit PCB layout files as a starting point.
Do not omit the configuration flash memory or attempt to use a different MSL level than the package specifies - BGA packages are moisture sensitive and require controlled storage and reflow profiles per IPC/JEDEC J-STD-020. Per Intel documentation, leaving MSEL pins in the wrong state during power-up will prevent configuration. Always validate the HPS boot ROM source (SD/eMMC/QSPI) using the Intel SoC EDS bootloader configuration tool before silicon bring-up.
Uyumluluk Bilgisi
RoHS and lead-free confirmed by 'G' suffix per Altera/Intel package naming convention. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part. For automotive designs consider Cyclone V or Arria 10 Auto variants instead.
