EP1K50FC256-3AA - ACEX-1K 50K Gates FPGA 256-BGA | Intel
MPN: EP1K50FC256-3AA ✗ اختتامِ زندگیEP1K50FC256-3AA جائزہ
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that combines programmable logic blocks, programmable interconnects, and I/O cells on a single die. FPGAs sit in the programmable logic hierarchy above CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits), offering a middle ground between the high NRE cost of ASICs and the fixed function of standard logic. The ACEX-1K family was the industry's first low-cost FPGA family with embedded array blocks (EABs) for on-chip memory and DSP megafunctions, providing system-on-a-programmable-chip (SOPC) integration.
Key features include 40,960 typical logic elements (per the DigiKey listing), embedded dual-port RAM blocks for memory-intensive designs, four phase-locked loops (PLLs) for clock management, multi-voltage I/O support, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device supports LVTTL, LVCMOS, SSTL, and PCI I/O standards through dedicated I/O banks.
Architecturally, the EP1K50FC256-3AA uses a CMOS SRAM cell with a 0.22 µm process (per Altera ACEX 1K Device Family datasheet), making it volatile but instantly reconfigurable for prototyping and production. The 256-FBGA 17x17 mm package provides high pin density with controlled-impedance signal paths suitable for high-speed designs.
Typical applications include telecommunications line cards, industrial control and motor drives, low-volume ASIC prototyping, glue logic consolidation, and legacy system upgrades. The 186 user I/Os support wide parallel buses and multi-channel serial interfaces.
When designing with this device, remember that the configuration is volatile - an external configuration memory (such as EPC2 or EPC16) is required to load the bitstream at power-up. The ACEX 1K family is now End-of-Life; designers targeting new designs should evaluate Cyclone or MAX families.
This page synthesizes the legacy ACEX-1K part summary with cross-reference alternatives, design notes, and pricing data not consolidated in the original Altera datasheet PDF.
کے لیے ڈراپ اِن متبادل EP1K50FC256-3AA — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP1K50FC256-3AA (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Configuration Method, Process Technology, Family, Speed Grade, Package.
EP1K50FC256-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K50FC256-3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K50FC256-2N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K50FC256-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K50FC256-1N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K50FC256-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP1K50FC256-3AA زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | ACEX-1K |
| Family | ACEX 1K Device Family (2.5V) |
| Number of Logic Elements | 2880 |
| Number of LABs (Logic Array Blocks) | 360 |
| Total RAM Bits | 40960 |
| Number of I/O Pins | 186 |
| Number of Gates | 50000 (typical) |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) |
| آپریٹنگ درجہ حرارت | 0 °C to 70 °C (commercial) |
| Speed Grade | -3 (faster tier) |
| پیکیج | 256-BGA (FBGA, 17x17 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Process Technology | 0.22 µm CMOS SRAM |
| Configuration Method | SRAM (volatile, requires external config device) |
| Number of PLLs | 4 (per family datasheet) |
| RoHS اسٹیٹس | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) |
EP1K50FC256-3AA 256-bga (fbga, 17x17 mm) پن کنفیگریشن گائیڈ
EP1K50FC256-3AA (256-bga (fbga, 17x17 mm) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP1K50FC256-3AA.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP1K50FC256-3AA کے لیے موزوں ہے 6 ایپلیکیشنs: Telecom Line Card Interface Logic, Industrial Motor Control and Drive, Legacy ASIC Prototyping Platform, Print Engine and Image Pipeline Controller, Test and Measurement Front-End, Glue Logic Consolidation Board.
Telecom Line Card Interface Logic
The EP1K50FC256-3AA fits telecom line card designs that require a balance of glue logic, bus interface conversion, and parallel I/O expansion. With 2,880 logic elements and 186 user I/Os across multiple I/O banks, it can bridge legacy 8/16-bit TDM buses (H.110, SCSA) to modern processors while providing per-channel state machines. The 40,960 bits of embedded RAM support small lookup tables for routing and channel mapping, and the four PLLs generate the multiple clock domains typical of T1/E1/J1 line interfaces. Compared to a CPLD solution, the FPGA delivers higher I/O density and more flexible register/buffer structures in a single BGA footprint, lowering board area and BOM cost.
تجویز کردہ
Industrial Motor Control and Drive
The EP1K50FC256-3AA is well-suited to industrial motor control where PWM generation, encoder feedback decoding, and protection logic must run deterministically. Its 186 user I/Os accept quadrature encoder inputs, Hall sensor signals, and trip-zone faults, while the 2,880 logic elements implement space-vector PWM modulators and field-oriented control (FOC) state machines. The four PLLs multiply a low-frequency crystal to the high-frequency carrier clocks needed by 50 kHz+ PWM switching. The 256-FBGA package supports industrial -40 to +85 °C operation when paired with the industrial-grade EP1K50FI256 variant, and its non-volatile configuration via external EPC PROM allows instant restart after power dips in factory environments.
تجویز کردہ
Legacy ASIC Prototyping Platform
The EP1K50FC256-3AA serves as a proven prototyping vehicle for designers validating ASIC register-transfer level (RTL) code before committing to mask costs. With 2,880 logic elements and 40,960 bits of embedded RAM, the device emulates mid-complexity ASIC blocks such as interrupt controllers, peripheral bridges, and small protocol engines. Designers map ASIC I/O pads to the FPGA's 186 user I/Os, using the same Quartus II Web Edition toolchain that supports both ACEX-1K and the production ASIC cell library. The SRAM-based configuration allows rapid design iteration - a new bitstream can be downloaded in milliseconds via JTAG or external EPC PROM - accelerating verification cycles by 10x compared to ASIC re-spins.
تجویز کردہ
Print Engine and Image Pipeline Controller
The EP1K50FC256-3AA is commonly deployed in office printers and copiers to drive the print engine's laser modulation, paper transport, and image processing pipelines. Its 2,880 logic elements implement pixel-clocking FIFOs, halftone engines, and motor synchronization state machines, while the embedded dual-port RAM blocks buffer scanned image lines between the scanner and formatter ASIC. The 186 user I/Os handle parallel video buses, multiple stepper motor drivers, and high-voltage discharge controls. The -3 speed grade delivers sufficient timing margin for 200+ MHz pixel clocks needed at 600 dpi color print resolution, and the 256-FBGA package provides the thermal headroom required by always-on commercial printing equipment.
تجویز کردہ
Test and Measurement Front-End
The EP1K50FC256-3AA is used in low-cost test equipment and data acquisition front-ends where custom timing and pattern generation are required. The 186 user I/Os provide ample channels for parallel stimulus/response buses, while the four PLLs generate the multiple phase-shifted clocks needed by high-speed ADC/DAC sample timing. Embedded RAM blocks store calibration coefficients and waveform lookup tables. Compared to discrete TTL gate arrays, this FPGA integrates timing, pattern generation, and protocol decode in a single BGA device, reducing test fixture cost and enabling rapid reconfiguration between DUT types via JTAG programming in under a second.
تجویز کردہ
Glue Logic Consolidation Board
The EP1K50FC256-3AA is widely used to consolidate multiple 74-series logic gates, counters, and small state machines into a single reconfigurable device. With 2,880 logic elements, it can replace 30-50 discrete SSI/MSI logic packages, dramatically reducing PCB area, power consumption, and assembly cost. Designers map existing gate-level schematics or netlists into Quartus II, retaining proven logic functionality while gaining flexibility to update timing and features via configuration bitstream changes. The 256-FBGA package provides sufficient I/O for address decoding, bus arbitration, and interrupt steering typical of legacy ISA/PCI bridge designs.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP1K50FC256-3AA — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP1K50FC256-3 | EP1K50FC256-3N | EP1K50FC256-2N | EP1K50FC256-1 | EP1K50FC256-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-BGA (FBGA, 17x17 mm) | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same |
| Logic Elements | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 |
| User I/Os | 186 | 186 | 186 | 186 | 186 | 186 |
| Speed Grade | -3 (fastest) | -3 (fastest) | -3 (fastest) | -2 (mid tier) | -1 (slowest) | -2 (mid tier) |
| Terminal Finish | Standard (SnPb or non-RoHS) | Standard | Lead-free (RoHS) | Lead-free (RoHS) | Standard | Standard |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0 °C to 70 °C (commercial) | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C |
| Lifecycle Status | Obsolete (NOS only) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Fastest speed grade in 256-FBGA ACEX-1K 50K family (بمقابلہEP1K50FC256-1)
- Highest user I/O count among ACEX-1K commercial-temp 50K variants (بمقابلہEP1K50FI256-2 (industrial-temp 256-FBGA variant))
- Balanced logic density versus cost (بمقابلہEP1K100FC256-3 (higher-density 100K variant))
ڈیزائن نوٹس
The EP1K50FC256-3AA requires a regulated 2.5 V core supply within the 2.375 V to 2.625 V range. Place 0.1 µF and 10 µF decoupling capacitors as close as possible to every VCCINT ball (typically 8 balls for the 256-FBGA package). The I/O banks require separate VCCIO rails (3.3 V, 2.5 V, or 1.8 V depending on the I/O standard selected) with their own decoupling. Estimated: at 2.5 V core and 50% toggle rate, Icc_core can reach 200-300 mA; budget for a 750 mA LDO or switching regulator with adequate thermal margin.
The 256-FBGA package has a theta_JA of approximately 18-22 C/W with adequate PCB thermal vias (per ACEX 1K family datasheet). At typical industrial operating points, junction-to-ambient rise is below 30 °C without special cooling. However, in enclosed systems with limited airflow, add thermal vias under the BGA thermal pad ball cluster and consider copper pours on inner PCB layers to spread heat. The commercial 0-70 °C temperature range is preserved with conservative switching activity in well-ventilated enclosures.
The 256-FBGA 17x17 mm package has 1.27 mm ball pitch. Use a 4-layer or 6-layer PCB with a continuous ground plane beneath the BGA and microvia-in-pad or dogbone fanout for BGA breakout. Matched-impedance traces (50 Ω single-ended, 100 Ω differential) are required for LVDS or high-speed LVTTL signals. Per the ACEX 1K family datasheet, keep all configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) short and isolated from switching I/O to avoid false triggering during bitstream load.
Configuration is volatile - the EP1K50FC256-3AA loses its bitstream on every power-down. You MUST include an external configuration memory (Altera EPC2, EPC4, or EPC16) or microcontroller to load the bitstream at power-up. Do not assume the part retains state like a CPLD. Common mistakes include omitting the EPC footprint, misconfiguring MSEL pins (selecting wrong configuration mode), forgetting pull-up resistors on nCONFIG and nSTATUS, and failing to specify the correct JTAG chain order when multiple devices share the JTAG bus.
ACEX-1K I/O banks must be powered before or simultaneously with the 2.5 V core supply to avoid latch-up. Sequence VCCIO before or with VCCINT using an integrated power management IC. For mixed-voltage designs (3.3 V and 2.5 V), use a TI TPS3808 or similar voltage supervisor to gate the FPGA nCONFIG input until both rails are stable. SSTL and PCI I/O standards require external reference voltage (VREF) pins per bank - tie these to a clean low-impedance voltage divider or dedicated reference LDO.
تعمیل کی معلومات
ACEX-1K family was introduced before RoHS took full effect. The 'N' suffix variants (e.g., EP1K50FC256-3N) are the lead-free RoHS-compliant versions. AEC-Q100 is not applicable because this is a commercial-grade FPGA not qualified for automotive safety-critical applications. Always verify date code and compliance status with the distributor when procuring.
