10AS032E4F29I3SG - Arria 10 SX SoC FPGA, 320K LE, 1.5GHz | Intel
MPN: 10AS032E4F29I3SG ✓ Hoạt động10AS032E4F29I3SG Tóm tắt
A SoC FPGA (System-on-Chip FPGA) is a class of programmable device that combines a general-purpose processor subsystem (typically ARM Cortex-A cores) with a fabric of FPGA logic elements, on-chip memory, and high-speed transceivers on a single die. This heterogeneous architecture sits between pure microcontrollers, which lack reconfigurable logic, and standalone FPGAs, which require an external processor for operating-system tasks. SoC FPGAs are part of the broader programmable logic hierarchy: FPGA → SoC FPGA → Adaptive Compute Acceleration Platform (ACAP), and they are widely used when designers need deterministic hardware acceleration alongside Linux-capable application processors.
Key features of the 10AS032E4F29I3SG include 320K logic elements, embedded hard processor subsystem, transceiver support, and industrial temperature operation. The 780-FBGA (FC) 29×29 mm footprint uses flip-chip packaging for improved signal and thermal performance, making the device suitable for high-density board designs where multiple transceiver channels and parallel processing are required simultaneously.
Architecturally, the Arria 10 SX integrates ARM Cortex-A9 cores with CoreSight debug, allowing designers to run a full operating system on the hard processor while offloading latency-critical DSP, packet processing, or interface bridging tasks to the FPGA fabric. The 1.5 GHz maximum core frequency targets high-throughput signal-processing workloads, and the 0.9 V core supply is typical of 20 nm Arria 10 devices.
Typical applications include wireless baseband processing, software-defined radio, broadcast video infrastructure, industrial machine vision, and military signal intelligence platforms. The SoC architecture enables Linux-driven control planes paired with hardware-accelerated data planes within a single chip.
When designing with this device, pay close attention to PCB layout for the 780-ball BGA: escape routing requires at least 6–8 PCB layers, and a continuous ground pour under the package is mandatory for thermal dissipation. Use the Intel Quartus Prime toolchain for synthesis, place-and-route, and HPS firmware development, and validate transceiver channel performance with IBIS-AMI models before tape-out.
This page synthesizes distributor pricing, drop-in same-package alternatives within the Arria 10 SX family, and practical design notes not aggregated in the manufacturer datasheet, giving engineers a single reference for sourcing and selection decisions.
Bộ thay thế dễ dàng lắp đặt cho 10AS032E4F29I3SG — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10AS032E4F29I3SG (cùng hình factor và footprint) — khác nhau ở Package, Mounting Type, Logic Elements, Package Code, Operating Temperature Grade.
10AS032E4F29I3LG
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10AS032E4F29E3SG
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10AS032E4F29E3LG
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10AS032E3F29I2SG
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10AS032E3F29I2LG
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →10AS032E4F29I3SG Tỷ lệ tối đa & tính chất điện
| Family | Arria 10 SX |
| Device Type | SoC FPGA with dual ARM Cortex-A9 MPCore + CoreSight |
| Logic Elements | 320,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Core Supply Voltage | 0.9 V |
| Hộp | 780-ball FBGA, FC (flip-chip), 29 mm × 29 mm |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) |
| Speed Grade | 4 |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Packaging | Tray |
| Trạng thái vòng đời | Active |
| Trạng thái RoHS | Compliant |
| Process Node | 20 nm (Tri-Gate) |
| Programming Toolchain | Intel Quartus Prime |
Hướng dẫn cấu hình chân 10AS032E4F29I3SG 780-ball fbga, fc (flip-chip), 29 mm × 29 mm
Cấu hình chân cho 10AS032E4F29I3SG (780-ball fbga, fc (flip-chip), 29 mm × 29 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho 10AS032E4F29I3SG.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
10AS032E4F29I3SG phù hợp cho 7 Áp dụngs: Wireless Baseband Processing, Software Defined Radio (SDR), Broadcast Video Infrastructure, Industrial Machine Vision, Military Signal Intelligence, Medical Imaging Accelerator, High-Performance Protocol Bridging.
Wireless Baseband Processing
The 10AS032E4F29I3SG fits wireless baseband processing because its 320K logic elements and ARM Cortex-A9 HPS jointly execute PHY-layer DSP, MAC scheduling, and protocol-stack processing on a single device. The 1.5 GHz HPS clock drives LTE/5G NR layer-2/3 stacks under Linux, while the FPGA fabric accelerates FFT, channel estimation, and MIMO matrix operations in parallel. Industrial temperature grading enables outdoor small-cell and macro deployments.
Được đề xuất
Software Defined Radio (SDR)
The 10AS032E4F29I3SG is well matched to software-defined radio platforms where wideband DSP pipelines must coexist with Linux-based waveform control. The Arria 10 SX fabric hosts multi-rate digital down-conversion, FIR filtering, and modulation/demodulation cores, while the dual ARM Cortex-A9 HPS runs GNU Radio or custom waveforms. Transceiver-rich device variants in the same F29 footprint deliver multi-Gsps ADC interfacing for tactical radio systems.
Được đề xuất
Broadcast Video Infrastructure
The 10AS032E4F29I3SG enables broadcast video processing equipment such as contribution encoders, playout servers, and IP gateway blades. Its 320K LE fabric is large enough to handle multi-stream 4K/UHD HEVC pipeline stages, color-space conversion, and SDI-to-IP bridging concurrently. The integrated HPS runs control-plane software for NMOS IS-04/IS-05 discovery and PTP timing, eliminating the need for a separate SBC in the chassis.
Được đề xuất
Industrial Machine Vision
The 10AS032E4F29I3SG serves high-speed industrial inspection systems where multi-camera CoaXPress or GigE Vision streams must be processed in real time. The FPGA fabric hosts image preprocessing (debayer, defect detection, color correction) while the dual ARM Cortex-A9 HPS manages camera control protocols and factory-floor networking. Industrial temperature grading makes the part suitable for factory-side installations without active cooling.
Được đề xuất
Military Signal Intelligence
The 10AS032E4F29I3SG's combination of hardened ARM Cortex-A9 HPS, 320K LE fabric, and industrial temperature range fits deployable SIGINT and EW platforms. Sensitive signal-detection and direction-finding algorithms run in the fabric for deterministic latency, while classification and database lookups execute on the HPS under a secure operating system. The 780-FBGA flip-chip package supports dense, vibration-tolerant board assemblies.
Được đề xuất
Medical Imaging Accelerator
The 10AS032E4F29I3SG accelerates CT, MRI, and ultrasound image reconstruction by offloading back-projection and beamforming kernels to the FPGA fabric, while the dual-core ARM Cortex-A9 HPS manages DICOM networking and operator interface logic. Real-time reconstruction at clinically required frame rates benefits from the device's 1.5 GHz HPS clock and high on-die memory bandwidth, and the industrial temperature grade supports mobile cart-based imaging systems.
Được đề xuất
High-Performance Protocol Bridging
The 10AS032E4F29I3SG enables low-latency protocol bridging between PCIe Gen3, 10/25/40/100 Gigabit Ethernet, SATA, and custom serial interfaces in hyperscale data center and telecom equipment. The FPGA fabric terminates line-rate MAC, IPsec, or compression pipelines, while the dual ARM Cortex-A9 HPS runs Linux for management, telemetry, and routing-protocol stacks. The 780-ball BGA supports dense serializer/deserializer routing.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10AS032E4F29I3SG — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10AS032E4F29I3LG | 10AS032E4F29E3SG | 10AS032E4F29E3LG | 10AS032E3F29I2SG | 10AS032E3F29I2LG |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA, FC, 29x29 mm | 780-ball FBGA, FC, 29x29 mm - same | 780-ball FBGA, FC, 29x29 mm - same | 780-ball FBGA, FC, 29x29 mm - same | 780-ball FBGA, FC, 29x29 mm - same | 780-ball FBGA, FC, 29x29 mm - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Speed Grade | I3 (industrial, speed 3-class) | I3 | E3 (extended temperature) | E3 | I2 (slower speed) | I2 |
| Temperature Grade | Industrial | Industrial / lead-free | Extended | Extended / lead-free | Industrial | Industrial / lead-free |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Maximum Core Frequency | 1.5 GHz | 1.5 GHz | ~1.4 GHz (E3) | ~1.4 GHz (E3) | ~1.25 GHz (I2) | ~1.25 GHz (I2) |
| Unit Price (USD, qty 1) | $2,850 | $2,750 | $2,650 | $2,600 | $2,300 | $2,250 |
Bảo phân biệt quan trọng
- Higher speed-grade Fmax for the most demanding transceiver and DSP workloads (vs10AS032E3F29I2SG)
- Standard industrial temperature grade for harsh-environment deployment (vs10AS032E4F29E3SG)
- Tray packaging as stocked by major distributors (vs10AS032E4F29E3LG)
Ghi chú thiết kế
The 780-ball F29 BGA at 1.0 mm pitch requires escape routing on a high-layer-count PCB (typically 8–12 layers) with 50 Ω controlled-impedance traces for high-speed transceiver channels. Use the Intel/Altera BGA escape routing guidelines and stack the top layers with microvia-in-pad construction (laser-drilled) so the inner-row balls can be fanned out without dog-bone stubs. Maintain a continuous solid ground plane directly under the BGA to provide both return-current paths and thermal spreading.
The 20 nm Arria 10 SX device dissipates 10–25 W in typical applications; design a thermal solution sized for the worst-case workload (e.g., fully utilized transceiver channels and high DSP block toggle rate). Use a heat-spreader or heatsink with thermal interface material rated for the industrial temperature range (-40 °C to +100 °C) and provide 200 LFM minimum airflow across the package. Estimated junction-to-ambient thermal resistance θ_JA is approximately 8–10 °C/W with a high-performance heatsink; verify with the Arria 10 thermal model before finalizing the mechanical design.
Arria 10 SX devices require multiple regulated rails (0.9 V core, 1.8 V/2.5 V/3.3 V I/O, and transceiver supplies) with strict sequencing and ramp-time requirements. Use the Intel/Altera reference power tree with the dedicated controller (e.g., LTC/TI PMBus sequencer) and follow the in-rush current limit guidelines to avoid tripping the SmartVID controller. Decouple each rail with a 4.7 µF bulk + 0.1 µF + 0.01 µF capacitor network placed as close to each BGA ball cluster as possible.
Do not migrate between F29 and F27/F31 Arria 10 SX packages without a full PCB re-spin: ball maps differ between package outlines even though silicon is identical. Also, the I3, I2, and E3 speed grades have different Fmax guarantees for DSP blocks and transceivers; downgrading a design from I3 to I2 may fail timing closure without re-running Quartus Prime place-and-route. Always verify temperature-grade part numbering carefully - SG denotes industrial and LG denotes lead-free tray variant (not 'lower grade').
Thông tin tuân thủ
RoHS and lead-free compliance stated on Altera/Intel product page. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. Reach and conflict-minerals compliance standard for Intel/Altera FPGAs.
