10AS048H4F34E3SG - Arria 10 SX SoC FPGA, 480K LE, 1152-FBGA | Intel
MPN: 10AS048H4F34E3SG ✓ Hoạt động10AS048H4F34E3SG Tóm tắt
A System-on-Chip (SoC) FPGA is an integrated circuit that merges a general-purpose processor subsystem with programmable logic on the same silicon die, enabling software programmability and hardware parallelism to coexist with low-latency interconnects. Arria 10 SX belongs to Intel's mid-range programmable logic family, sitting between Cyclone (low-power/cost) and Stratix (high-performance), and is engineered for transceiver-rich, DSP-intensive applications such as wireless baseband, broadcast, medical imaging, and defense signal processing.
Key differentiating features include 480K logic elements, on-chip HPS peripherals (USB, Gigabit Ethernet, DDR controllers), transceivers supporting multi-gigabit serial links, and an integrated CoreSight debug infrastructure. The 1152-ball FC-FBGA package provides high I/O density for memory interfaces and multi-channel transceiver routing, while the 20 nm process balances static and dynamic power for fan-cooled deployments.
Architecturally, the device partitions into FPGA fabric (logic elements, MLABs, DSP blocks, M20K memory blocks, and 14.1 Gbps transceivers) and the HPS subsystem (dual ARM Cortex-A9, L1/L2 caches, hardware floating-point, NEON media engine, and a rich peripheral set). The FPGA-to-HPS bridges provide AXI-based coherent and non-coherent paths for tight CPU-加速器 coupling. Configuration is supported via JTAG, Active Serial, and fast passive parallel modes.
Typical applications include software-defined radio (SDR) platforms, radar and electronic-warfare preprocessing, medical imaging accelerators, broadcast video processing, and 5G fronthaul prototyping. For board-level integration, ensure a 0.9 V core supply with sufficient decoupling and a robust thermal solution given the FC-FBGA substrate's thermal resistance. Quartus Prime is the primary toolchain; the SoC EDS provides ARM Development Studio and a tailored Linux distribution for HPS bring-up.
This page synthesizes distributor pricing snapshots, drop-in same-package alternatives, and practical design notes drawn from the official datasheet — content not bundled on the OEM's product page alone.
Bộ thay thế dễ dàng lắp đặt cho 10AS048H4F34E3SG — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 10AS048H4F34E3SG (cùng hình factor và footprint) — khác nhau ở Package, Logic Elements, Process Technology, Core Voltage, DSP Blocks.
10AS048H4F34E3LG
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →10AS048H4F34I3SG
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✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
10AS048H3F34I2SG
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Xem tài liệu →10AS032H4F34E3SG
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Xem tài liệu →10AS048H4F34E3SG Tỷ lệ tối đa & tính chất điện
| Product Type | System on Chip (SoC) FPGA |
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | 1.5 GHz (max) |
| Hộp | 1152-ball FC-FBGA (35 x 35 mm) |
| Core Voltage | 0.9 V |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
| Supply Configuration | Tray |
| Toolchain | Intel Quartus Prime + SoC EDS |
| Market Segment | Embedded / Industrial / Defense / Medical |
Hướng dẫn cấu hình chân 10AS048H4F34E3SG 1152-ball fc-fbga (35 x 35 mm)
Cấu hình chân cho 10AS048H4F34E3SG (1152-ball fc-fbga (35 x 35 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho 10AS048H4F34E3SG.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
10AS048H4F34E3SG phù hợp cho 6 Áp dụngs: Software-Defined Radio (SDR) Baseband, Medical Imaging Acceleration, Defense Radar and EW Preprocessing, Broadcast Video Processing, Industrial Machine Vision, 5G Fronthaul Prototyping.
Software-Defined Radio (SDR) Baseband
The 10AS048H4F34E3SG is well suited to SDR baseband platforms because its 480K logic elements and high-density variable-precision DSP blocks can implement multi-channel LTE/5G NR physical-layer processing at line rate. The integrated dual-core ARM Cortex-A9 HPS runs a real-time Linux stack for MAC scheduling, RF management, and network stack offload, while the FPGA fabric accelerates FFT, channel estimation, and turbo decoding. Transceivers capable of multi-gigabit serial link rates connect to RF ADCs/DACs and CPRI/eCPRI fronthaul. A typical design places the chip between the analog front-end and an Ethernet aggregator, achieving deterministic latency that pure-software DSP cannot match.
Được đề xuất
Medical Imaging Acceleration
In CT, MRI, and ultrasound imaging systems, the 10AS048H4F34E3SG accelerates back-projection, beamforming, and image-reconstruction pipelines using its parallel DSP fabric, while the Cortex-A9 HPS handles patient I/O, display rendering, and DICOM networking. The 480K logic elements provide headroom for multi-channel beamforming in portable ultrasound, and the 1152-FBGA package allows dense PCB layouts inside compact cart-based systems. Medical-grade variants within the same family (where qualified) simplify regulatory documentation; designers should validate IEC 60601 compliance at the system level rather than relying on component-level ratings.
Được đề xuất
Defense Radar and EW Preprocessing
Phased-array radar and electronic-warfare subsystems require deterministic, low-latency signal processing that the 10AS048H4F34E3SG delivers through parallel DSP pipelines and high-speed transceivers. Pulse compression, moving-target indication, and digital-beamforming fit comfortably in 480K logic elements, and the HPS subsystem coordinates mode control, track management, and datalink interfacing. The FC-FBGA package supports the ruggedized board stack-ups typical of defense electronics, with thermal paths engineered for conduction-cooled VPX slots.
Được đề xuất
Broadcast Video Processing
The 10AS048H4F34E3SG accelerates 4K/UHD video processing pipelines — including deinterlacing, scaling, color-space conversion, and codec pre-processing — by mapping parallel datapaths into the FPGA fabric. The HPS runs a Linux control plane for IP streaming, captioning insertion, and audio routing. Transceivers handle SMPTE ST 425 / ST 2082 SDI and emerging IP-based ST 2110 workflows. The wide logic capacity lets one device replace multiple discrete ASSPs in studio-grade broadcast encoders.
Được đề xuất
Industrial Machine Vision
High-speed line-scan and area-scan inspection systems leverage the 10AS048H4F34E3SG's parallel fabric to run edge detection, defect classification, and convolutional neural-network inference at line rate. The HPS manages the GigE Vision / USB3 Vision stack and PLC handshaking, while the FPGA pipelines raw pixels into feature maps in real time. With 480K logic elements, multi-camera aggregation (4-8 sensors) is feasible on a single chip, reducing bill-of-material cost and footprint for smart-factory deployments.
Được đề xuất
5G Fronthaul Prototyping
The 10AS048H4F34E3SG supports CPRI and eCPRI fronthaul interfaces through its multi-gigabit transceivers, while the FPGA fabric implements the lower PHY and fronthaul-split processing required between the radio unit and the baseband unit. The dual-core ARM Cortex-A9 HPS runs the O-RAN near-RT-RIC and timing synchronization stack, including IEEE 1588 and SyncE. Designers use this combination to prototype O-RAN Alliance 7-2x splits before committing to ASIC-based production hardware.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 10AS048H4F34E3SG — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 10AS048H4F34E3LG | 10AS048H4F34I3SG | 10AS048H3F34E3SG | 10AS032H4F34E3SG |
|---|---|---|---|---|---|
| Package | 1152-FBGA (35x35) | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 (-33%) |
| Speed Grade | 4 (fastest) | 4 | 3 | 3 (-10-15% Fmax) | 4 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Extended (E) |
| Hard Processor System | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active | Active |
Bảo phân biệt quan trọng
- Fastest commercial speed grade in the 480K LE Arria 10 SX family (vs10AS048H3F34E3SG)
- Same-footprint lead-free variant for RoHS-strict OEM builds (vs10AS048H4F34E3LG)
- 480K LE density in the same 1152-FBGA, preserving PCB layout across speed/temp variants (vs10AS032H4F34E3SG)
- Integrated dual-core ARM Cortex-A9 HPS eliminates external host CPU (vsXilinx XC7Z100-2FFG1156I)
Ghi chú thiết kế
Estimated: at typical Arria 10 SX utilization (~70% LE, ~50% DSP, full HPS active), the device draws roughly 15-20 W from a 0.9 V core rail plus 1.8 V / 2.5 V / 3.3 V auxiliary rails. Use a multi-rail PMIC such as the LTM4677 or Intel's recommended uModule sequencer to control in-rush; stagger HPS and fabric power-up per Intel's power-management guide to avoid latch-up. Decouple every VCC pin with a 0.1 µF X7R plus a 10 µF bulk, placed within 2 mm of the BGA pad.
The 1152-FBGA (35 x 35 mm) substrate has a theta_JB around 0.5 C/W with a properly stitched thermal via array. Estimated: a 25 W dissipation yields a 12.5 C rise above the board — acceptable for extended temp but tight for industrial -40 to 100 C. Use at least 4 oz copper inner layers, a 5x5 thermal-via grid under the die, and a heat-spreader for sealed enclosures. Apply thermal interface material rated for the FC-BGA standoff.
Route the transceiver channels on the top layer with reference to a continuous ground plane; never split the reference plane under a transceiver lane. Maintain 100 Ω differential impedance with 5 mil trace width / 8 mil gap on a low-loss substrate such as Megtron 6. Keep DDR3/4 address/command traces within 50 mils of the SoC to satisfy the 1152-FBGA breakout constraints; use the Intel pin-connection guidelines for exact break-out pattern.
Configuration mode pins (MSEL) must be set before VCC ramps; a wrong MSEL state is the most common brick on first power-up. Always include a JTAG header with a recognized buffer (FTDI FT232H or Intel USB-Blaster II clone) for rescue programming. For HPS boot, validate the SD card boot image with the Intel SoC EDS bootloader tool before committing to eMMC; corrupted HPS boot images lock the device into JTAG-only recovery.
Place the HPS reference clock as close as possible to the CLK1 ball with a guarded keep-out zone; HPS jitter budgets are tighter than FPGA fabric clocks and directly impact Ethernet PHY timing. Series-terminate SD card signals with 33 Ω near the SoC; the SD controller's pull-ups are weak and 50 mm+ SD trace lengths will fail SDR104 mode. Keep high-speed serial lanes on a single routing layer to avoid via stubs.
Thông tin tuân thủ
RoHS compliance stated by all authorized distributor listings (DigiKey, Mouser) and confirmed by datasheets.com; halogen-free status and exact MSL rating are not surfaced in the verified distributor listings and require direct Intel documentation lookup.
