10AS048H4F34I3SG - Arria 10 SX 480K SoC FPGA | Intel | 1152-FBGA
MPN: 10AS048H4F34I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3050 | $30,500.00 |
| 50 | $2890 | $144,500.00 |
| 100 | $2740 | $274,000.00 |
| 500 | $2580 | $1,290,000.00 |
Drop-in alternatives for 10AS048H4F34I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048H4F34I3LG
✅ Drop-In✓ In Stock
$3920 / Unit
View Datasheet →10AS048H4F34E3SG
✅ Drop-In✓ In Stock
$2250 / Unit
View Datasheet →10AS048H4F34E3LG
✅ Drop-In✓ In Stock
$2295 / Unit
View Datasheet →10AS048H3F34I2SG
✅ Drop-In✓ In Stock
$3450 / Unit
View Datasheet →10AS048H3F34I2LG
✅ Drop-In✓ In Stock
$2960 / Unit
View Datasheet →10AS032H4F34I3SG
✅ Drop-In✓ In Stock
$3150 / Unit
View Datasheet →10AS048H4F34I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Clock | 1.5 GHz |
| Process Technology | TSMC 20 nm |
| Package | 1152-pin FCBGA (FineLine BGA), 35 mm x 35 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| RoHS Status | Compliant |
| External Memory Support | DDR4 (per Arria 10 family) |
| Configuration Scheme | Serial or parallel flash |
| Mounting Type | Surface Mount (BGA) |
10AS048H4F34I3SG 1152-pin fcbga (fineline bga), 35 mm x 35 mm Pin Configuration Guide
Complete pinout information for 10AS048H4F34I3SG (1152-pin fcbga (fineline bga), 35 mm x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H4F34I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H4F34I3SG is suitable for 7 applications: Software-Defined Radio (SDR) Baseband, Industrial Machine Vision and Video Processing, Medical Imaging Front-End Processing, 5G and Wireless Baseband Processing, Real-Time Industrial Control and Motion, High-Performance Test and Measurement, Aerospace Avionics and Unmanned Systems.
Software-Defined Radio (SDR) Baseband
The 10AS048H4F34I3SG's 480K logic elements and floating-point DSP blocks deliver the parallel multiply-accumulate throughput required for wideband SDR baseband processing, while the dual ARM Cortex-A9 cores at 1.5 GHz run the host stack, MAC layer, and control plane. Designers instantiate digital up/down converters, FFT pipelines, and channelizers in the FPGA fabric, then hand decoded symbols to the HPS over the coherent interconnect with deterministic latency. The industrial temperature range suits outdoor small-cell and tactical radio deployments.
Recommended
Industrial Machine Vision and Video Processing
Machine vision pipelines need both pixel-rate processing and a Linux-capable host to run OpenCV or customer analytics. The 10AS048H4F34I3SG fits this role with 480K LE for Bayer demosaicing, HDR merging, and CNN inference accelerators in the fabric, plus an ARM Cortex-A9 subsystem running the application layer. The 1.5 GHz HPS clock keeps frame-to-decision latency low. The 1152-FCBGA package supports MIPI CSI-2 receive and HDMI output bridges in the same device.
Recommended
Medical Imaging Front-End Processing
Ultrasound beamforming, CT reconstruction pre-processing, and endoscopy video pipelines all demand deterministic high-throughput DSP coupled with a regulatory-friendly embedded host. The 10AS048H4F34I3SG's 480K LE plus floating-point DSP blocks perform delay-and-sum beamforming or back-projection in real time, while the ARM Cortex-A9 subsystem manages the user interface and DICOM stack. The 20 nm process keeps per-channel power low enough for cart-mounted diagnostic equipment.
Recommended
5G and Wireless Baseband Processing
Small-cell and picocell baseband cards need real-time OFDM processing at hundreds of MHz of occupied bandwidth. The 10AS048H4F34I3SG places the FFT/iFFT, channel coding, and crest-factor-reduction blocks in FPGA fabric running at high DSP block count, while the dual ARM Cortex-A9 cores handle L2/L3 protocol layers. The integrated transceivers (per Arria 10 family) support CPRI or eCPRI backhaul links to a central unit without a companion chip.
Recommended
Real-Time Industrial Control and Motion
Multi-axis motion controllers require deterministic microsecond-class loop times for servo regulation. The 10AS048H4F34I3SG's FPGA fabric runs the position, velocity, and current control loops in parallel hardware, while the ARM Cortex-A9 subsystem handles EtherCAT master, OPC UA, and the HMI stack. The industrial temperature grade and 1.5 GHz HPS clock make the device suitable for factory-floor controllers with no active cooling.
Recommended
High-Performance Test and Measurement
Vector signal analyzers, protocol testers, and arbitrary waveform generators need simultaneous wideband DSP and an embedded controller for the user interface. The 10AS048H4F34I3SG implements FFT-based spectrum analysis, digital pre-distortion, and trigger logic in fabric while the ARM Cortex-A9 subsystem runs Linux with the test application. The 20 nm device delivers the dynamic range required for lab-grade instruments in a single chip.
Recommended
Aerospace Avionics and Unmanned Systems
Unmanned aerial vehicles and avionics subsystems benefit from consolidating guidance, navigation, and control into a single SoC FPGA. The 10AS048H4F34I3SG runs the INS/GPS fusion filter and sensor I/O in the FPGA fabric while the dual ARM Cortex-A9 cores handle flight management and telemetry. The industrial temperature range, high DSP throughput, and integrated ARM subsystem enable SWaP-C-optimized avionics boxes in a 35 mm x 35 mm package footprint.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H4F34I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H4F34I3LG | 10AS048H4F34E3SG | 10AS048H3F34I2SG | 10AS032H4F34I3SG |
|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Processor Max Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Extended industrial | Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 3 (mid) | 3 (mid) | 3 (mid) | 2 (faster) | 3 (mid) |
| Approx. Unit Price (qty 1) | USD 3200 | USD 3300 | USD 3000 | USD 3450 | USD 2400 |
Key Differentiators
- Integrated dual ARM Cortex-A9 MPCore with CoreSight (vs 10AS032H4F34I3SG)
- Speed grade 3 optimized for power efficiency (vs 10AS048H3F34I2SG)
- Industrial temperature grade for harsh environments (vs 10AS048H4F34E3SG)
Design Notes
Estimated: at full fabric utilization with the dual ARM Cortex-A9 cores active at 1.5 GHz and sustained DSP usage, the 10AS048H4F34I3SG can dissipate 15-25 W. The 35 mm x 35 mm FCBGA package requires a multi-layer PCB with a dense via array under the exposed die region plus, in most chassis environments, an attached heatsink or thermal interface material. Use Intel's PowerPlay Early Power Estimator (EPE) tool with your activity factors for a design-specific number.
The 1152-ball FCBGA requires a high-density PCB stack-up with microvia or laser-drilled vias to break out the inner rows of the BGA. Maintain 50 ohm controlled impedance on high-speed transceiver and DDR4 routes. Reference Intel's Arria 10 SX board design guidelines for stack-up recommendations, decoupling capacitor placement, and length-matching tolerances for the FPGA-HPS bridge signals.
Do not assume configuration from flash will succeed on first power-up: Intel recommends a known-good configuration image plus a watchdog fallback. Use the Arria 10 HPS boot flow from SD card or QSPI flash, with the FPGA fabric bitstream stored separately if you need conditional FPGA configuration. Confirm pull-up resistor values on JTAG, MSEL, and nCONFIG pins per Intel's configuration user guide.
Compliance Information
RoHS and lead-free per AiPCBA product listing and distributor data. REACH, halogen-free, and conflict-mineral statements not explicitly listed in retrieved data and marked unknown. AEC-Q100 not applicable to FPGAs in this class.
