10AS048H4F34E3SG - Arria 10 SX SoC FPGA, 480K LE, 1152-FBGA | Intel
MPN: 10AS048H4F34E3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2720 | $27,200.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2410 | $1,205,000.00 |
| 1,000 | $2250 | $2,250,000.00 |
Drop-in alternatives for 10AS048H4F34E3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048H4F34E3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2295 / Unit
View Datasheet →10AS048H4F34I3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2580 / Unit
View Datasheet →10AS048H3F34E3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048H3F34I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3450 / Unit
View Datasheet →10AS032H4F34E3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3490 / Unit
View Datasheet →10AS048H4F34E3SG Maximum Ratings & Electrical Characteristics
| Product Type | System on Chip (SoC) FPGA |
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | 1.5 GHz (max) |
| Package | 1152-ball FC-FBGA (35 x 35 mm) |
| Core Voltage | 0.9 V |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Supply Configuration | Tray |
| Toolchain | Intel Quartus Prime + SoC EDS |
| Market Segment | Embedded / Industrial / Defense / Medical |
10AS048H4F34E3SG 1152-ball fc-fbga (35 x 35 mm) Pin Configuration Guide
Complete pinout information for 10AS048H4F34E3SG (1152-ball fc-fbga (35 x 35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H4F34E3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H4F34E3SG is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, Medical Imaging Acceleration, Defense Radar and EW Preprocessing, Broadcast Video Processing, Industrial Machine Vision, 5G Fronthaul Prototyping.
Software-Defined Radio (SDR) Baseband
The 10AS048H4F34E3SG is well suited to SDR baseband platforms because its 480K logic elements and high-density variable-precision DSP blocks can implement multi-channel LTE/5G NR physical-layer processing at line rate. The integrated dual-core ARM Cortex-A9 HPS runs a real-time Linux stack for MAC scheduling, RF management, and network stack offload, while the FPGA fabric accelerates FFT, channel estimation, and turbo decoding. Transceivers capable of multi-gigabit serial link rates connect to RF ADCs/DACs and CPRI/eCPRI fronthaul. A typical design places the chip between the analog front-end and an Ethernet aggregator, achieving deterministic latency that pure-software DSP cannot match.
Recommended
Medical Imaging Acceleration
In CT, MRI, and ultrasound imaging systems, the 10AS048H4F34E3SG accelerates back-projection, beamforming, and image-reconstruction pipelines using its parallel DSP fabric, while the Cortex-A9 HPS handles patient I/O, display rendering, and DICOM networking. The 480K logic elements provide headroom for multi-channel beamforming in portable ultrasound, and the 1152-FBGA package allows dense PCB layouts inside compact cart-based systems. Medical-grade variants within the same family (where qualified) simplify regulatory documentation; designers should validate IEC 60601 compliance at the system level rather than relying on component-level ratings.
Recommended
Defense Radar and EW Preprocessing
Phased-array radar and electronic-warfare subsystems require deterministic, low-latency signal processing that the 10AS048H4F34E3SG delivers through parallel DSP pipelines and high-speed transceivers. Pulse compression, moving-target indication, and digital-beamforming fit comfortably in 480K logic elements, and the HPS subsystem coordinates mode control, track management, and datalink interfacing. The FC-FBGA package supports the ruggedized board stack-ups typical of defense electronics, with thermal paths engineered for conduction-cooled VPX slots.
Recommended
Broadcast Video Processing
The 10AS048H4F34E3SG accelerates 4K/UHD video processing pipelines — including deinterlacing, scaling, color-space conversion, and codec pre-processing — by mapping parallel datapaths into the FPGA fabric. The HPS runs a Linux control plane for IP streaming, captioning insertion, and audio routing. Transceivers handle SMPTE ST 425 / ST 2082 SDI and emerging IP-based ST 2110 workflows. The wide logic capacity lets one device replace multiple discrete ASSPs in studio-grade broadcast encoders.
Recommended
Industrial Machine Vision
High-speed line-scan and area-scan inspection systems leverage the 10AS048H4F34E3SG's parallel fabric to run edge detection, defect classification, and convolutional neural-network inference at line rate. The HPS manages the GigE Vision / USB3 Vision stack and PLC handshaking, while the FPGA pipelines raw pixels into feature maps in real time. With 480K logic elements, multi-camera aggregation (4-8 sensors) is feasible on a single chip, reducing bill-of-material cost and footprint for smart-factory deployments.
Recommended
5G Fronthaul Prototyping
The 10AS048H4F34E3SG supports CPRI and eCPRI fronthaul interfaces through its multi-gigabit transceivers, while the FPGA fabric implements the lower PHY and fronthaul-split processing required between the radio unit and the baseband unit. The dual-core ARM Cortex-A9 HPS runs the O-RAN near-RT-RIC and timing synchronization stack, including IEEE 1588 and SyncE. Designers use this combination to prototype O-RAN Alliance 7-2x splits before committing to ASIC-based production hardware.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H4F34E3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H4F34E3LG | 10AS048H4F34I3SG | 10AS048H3F34E3SG | 10AS032H4F34E3SG |
|---|---|---|---|---|---|
| Package | 1152-FBGA (35x35) | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 (-33%) |
| Speed Grade | 4 (fastest) | 4 | 3 | 3 (-10-15% Fmax) | 4 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Extended (E) |
| Hard Processor System | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active | Active |
Key Differentiators
- Fastest commercial speed grade in the 480K LE Arria 10 SX family (vs 10AS048H3F34E3SG)
- Same-footprint lead-free variant for RoHS-strict OEM builds (vs 10AS048H4F34E3LG)
- 480K LE density in the same 1152-FBGA, preserving PCB layout across speed/temp variants (vs 10AS032H4F34E3SG)
- Integrated dual-core ARM Cortex-A9 HPS eliminates external host CPU (vs Xilinx XC7Z100-2FFG1156I)
Design Notes
Estimated: at typical Arria 10 SX utilization (~70% LE, ~50% DSP, full HPS active), the device draws roughly 15-20 W from a 0.9 V core rail plus 1.8 V / 2.5 V / 3.3 V auxiliary rails. Use a multi-rail PMIC such as the LTM4677 or Intel's recommended uModule sequencer to control in-rush; stagger HPS and fabric power-up per Intel's power-management guide to avoid latch-up. Decouple every VCC pin with a 0.1 µF X7R plus a 10 µF bulk, placed within 2 mm of the BGA pad.
The 1152-FBGA (35 x 35 mm) substrate has a theta_JB around 0.5 C/W with a properly stitched thermal via array. Estimated: a 25 W dissipation yields a 12.5 C rise above the board — acceptable for extended temp but tight for industrial -40 to 100 C. Use at least 4 oz copper inner layers, a 5x5 thermal-via grid under the die, and a heat-spreader for sealed enclosures. Apply thermal interface material rated for the FC-BGA standoff.
Route the transceiver channels on the top layer with reference to a continuous ground plane; never split the reference plane under a transceiver lane. Maintain 100 Ω differential impedance with 5 mil trace width / 8 mil gap on a low-loss substrate such as Megtron 6. Keep DDR3/4 address/command traces within 50 mils of the SoC to satisfy the 1152-FBGA breakout constraints; use the Intel pin-connection guidelines for exact break-out pattern.
Configuration mode pins (MSEL) must be set before VCC ramps; a wrong MSEL state is the most common brick on first power-up. Always include a JTAG header with a recognized buffer (FTDI FT232H or Intel USB-Blaster II clone) for rescue programming. For HPS boot, validate the SD card boot image with the Intel SoC EDS bootloader tool before committing to eMMC; corrupted HPS boot images lock the device into JTAG-only recovery.
Place the HPS reference clock as close as possible to the CLK1 ball with a guarded keep-out zone; HPS jitter budgets are tighter than FPGA fabric clocks and directly impact Ethernet PHY timing. Series-terminate SD card signals with 33 Ω near the SoC; the SD controller's pull-ups are weak and 50 mm+ SD trace lengths will fail SDR104 mode. Keep high-speed serial lanes on a single routing layer to avoid via stubs.
Compliance Information
RoHS compliance stated by all authorized distributor listings (DigiKey, Mouser) and confirmed by datasheets.com; halogen-free status and exact MSL rating are not surfaced in the verified distributor listings and require direct Intel documentation lookup.
