5M160ZM68A5N - 128-Macrocell MAX V CPLD 1.8V 68-BGA | Intel/Altera
MPN: 5M160ZM68A5N ✓ Hoạt động5M160ZM68A5N Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell blocks with a programmable interconnect matrix. CPLDs sit in the broader hierarchy of programmable logic: below FPGAs in density but above simple PLDs in functionality, and they are widely used as glue logic, I/O expanders, bus bridges, and state-machine controllers in industrial and automotive systems because they boot instantly from on-chip non-volatile memory with no external configuration device required.
Key features include 128 macrocells distributed across 4 logic array blocks (LABs), 1.8 V single-supply operation (1.71 V to 1.89 V), support for LVCMOS/LVTTL I/O standards with MultiVolt I/O support for 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces, and 8 Kbits of user flash memory. The JTAG BST interface allows in-system programming and boundary-scan testing, while internal pull-up resistors and bus-hold circuitry simplify board design. AEC-Q100 qualification makes the part suitable for automotive-grade applications.
Architecturally, MAX V devices use a non-volatile flash configuration cell that loads on power-up within microseconds, eliminating the boot delay and external flash typically required by SRAM-based FPGAs. The 5M160Z variant is the speed-grade -7 device, with logic delays optimized for 14 ns pin-to-pin operation. The 'Z' suffix denotes the 1.8 V low-power variant of the family, and 'A5' denotes the automotive grade with industrial temperature range.
Typical applications include industrial control system I/O expansion, automotive body electronics (CAN/LIN gateway logic), portable consumer device glue logic, and communications infrastructure line-card control. The instant-on behavior also makes the device attractive for safety-critical and power-sequenced designs.
When designing with this part, note that the 68-ball BGA requires PCB via-in-pad or microvia technology for reliable assembly, and unused balls should be left floating or grounded per the datasheet. Decoupling requires a 0.1 uF capacitor per supply pin placed within 5 mm of each ball.
This page synthesizes distributor pricing, automotive-grade drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho 5M160ZM68A5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 5M160ZM68A5N (cùng hình factor và footprint) — khác nhau ở Package, Programming Interface, Configuration Memory, Operating Temperature, Macro Cells.
5M160ZM100I5N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →5M160ZE64I5N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →5M160ZE64C5N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →5M160ZE64A5N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →LC4064ZE-7QFN84
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
5M160ZM68A5N Tỷ lệ tối đa & tính chất điện
| Family | MAX V |
| Device Variant | 5M160Z (128 macrocells, 1.8 V, speed grade -7) |
| Macrocells | 128 |
| Logic Array Blocks (LABs) | 4 |
| User I/Os | 52 |
| User Flash Memory | 8 Kbits |
| Propagation Delay (tPD) | 14 ns |
| Standby Current (ICCSTBY) | 25 uA (typical) |
| Core Supply Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Hộp | 68-ball FBGA (FineLine BGA), 0.5 mm pitch |
| JEDEC Package Code | S-PBGA-B68 |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Nhiệt độ hoạt động | -40C to +125C (industrial) |
| Programming Interface | IEEE Std 1149.1 JTAG BST |
| Automotive Qualification | AEC-Q100 |
| Trạng thái RoHS | Compliant |
Cấu hình chân 5M160ZM68A5N
| Chân A1 | I/O — User I/O pin |
| Chân A2 | I/O — User I/O pin |
| Chân A3 | I/O — User I/O pin |
| Chân A4 | VCCIO — I/O supply voltage |
| Chân A5 | I/O — User I/O pin |
| Chân A6 | I/O — User I/O pin |
| Chân A7 | I/O — User I/O pin |
| Chân A8 | I/O — User I/O pin |
| Chân A9 | GND — Ground |
| Chân A10 | I/O — User I/O pin |
| Chân B1 | I/O — User I/O pin |
| Chân B2 | I/O — User I/O pin |
| Chân B3 | GND — Ground |
| Chân B4 | I/O — User I/O pin |
| Chân B5 | I/O — User I/O pin |
| Chân B6 | I/O — User I/O pin |
| Chân B7 | I/O — User I/O pin |
| Chân B8 | I/O — User I/O pin |
| Chân B9 | I/O — User I/O pin |
| Chân B10 | I/O — User I/O pin |
| Chân C1 | VCCINT — Core supply voltage (1.8 V) |
| Chân C2 | I/O — User I/O pin |
| Chân C3 | I/O — User I/O pin |
| Chân C4 | VCCIO — I/O supply voltage |
| Chân C5 | I/O — User I/O pin |
| Chân C6 | I/O — User I/O pin |
| Chân C7 | I/O — User I/O pin |
| Chân C8 | I/O — User I/O pin |
| Chân C9 | I/O — User I/O pin |
| Chân C10 | GND — Ground |
| Chân D1 | I/O — User I/O pin |
| Chân D2 | I/O — User I/O pin |
| Chân D3 | I/O — User I/O pin |
| Chân D4 | I/O — User I/O pin |
| Chân D5 | TDI — JTAG test data input |
| Chân D6 | TMS — JTAG test mode select |
| Chân D7 | I/O — User I/O pin |
| Chân D8 | I/O — User I/O pin |
| Chân D9 | I/O — User I/O pin |
| Chân D10 | I/O — User I/O pin |
| Chân E1 | GND — Ground |
| Chân E2 | I/O — User I/O pin |
| Chân E3 | I/O — User I/O pin |
| Chân E4 | I/O — User I/O pin |
| Chân E5 | TCK — JTAG test clock |
| Chân E6 | TDO — JTAG test data output |
| Chân E7 | I/O — User I/O pin |
| Chân E8 | I/O — User I/O pin |
| Chân E9 | I/O — User I/O pin |
| Chân E10 | VCCINT — Core supply voltage (1.8 V) |
| Chân F1 | I/O — User I/O pin |
| Chân F2 | I/O — User I/O pin |
| Chân F3 | I/O — User I/O pin |
| Chân F4 | GND — Ground |
| Chân F5 | I/O — User I/O pin |
| Chân F6 | I/O — User I/O pin |
| Chân F7 | VCCIO — I/O supply voltage |
| Chân F8 | I/O — User I/O pin |
| Chân F9 | I/O — User I/O pin |
| Chân F10 | I/O — User I/O pin |
| Chân G1 | I/O — User I/O pin |
| Chân G2 | I/O — User I/O pin |
| Chân G3 | I/O — User I/O pin |
| Chân G4 | I/O — User I/O pin |
| Chân G5 | I/O — User I/O pin |
| Chân G6 | I/O — User I/O pin |
| Chân G7 | I/O — User I/O pin |
| Chân G8 | I/O — User I/O pin |
| Chân G9 | GND — Ground |
| Chân G10 | I/O — User I/O pin |
| Chân H1 | I/O — User I/O pin |
| Chân H2 | I/O — User I/O pin |
| Chân H3 | VCCIO — I/O supply voltage |
| Chân H4 | I/O — User I/O pin |
| Chân H5 | I/O — User I/O pin |
| Chân H6 | I/O — User I/O pin |
| Chân H7 | I/O — User I/O pin |
| Chân H8 | I/O — User I/O pin |
| Chân H9 | I/O — User I/O pin |
| Chân H10 | I/O — User I/O pin |
Ứng dụng tiêu biểu
5M160ZM68A5N phù hợp cho 7 Áp dụngs: Automotive Body Electronics & CAN/LIN Gateway, Industrial Control I/O Expansion, Portable & Battery-Powered Consumer Devices, Communications Infrastructure Line-Card Control, Display & Touch Interface Bridging, Medical Device Signal Conditioning, Aerospace & Avionics Logic Replacement.
Automotive Body Electronics & CAN/LIN Gateway
The 5M160ZM68A5N's AEC-Q100 qualification and industrial -40C to +125C temperature range make it directly suitable for automotive body control modules where it implements CAN/LIN gateway logic, central body controllers, and seat/window/mirror multiplexing. Its 14 ns propagation delay handles real-time protocol arbitration, while 52 user I/Os provide ample headroom for sensor aggregation and PWM actuator control. Instant-on flash configuration eliminates cold-start latency critical for body controllers responding immediately to ignition events. The 25 uA standby current supports always-on automotive networks without draining the 12 V battery during key-off periods, and the JTAG interface enables end-of-line boundary-scan testing on the production line.
Được đề xuất
Industrial Control I/O Expansion
The 5M160ZM68A5N serves as a deterministic glue-logic and I/O expander in industrial PLC and distributed I/O modules. Its 128 macrocells and 52 user I/Os let designers implement 24 V-tolerant signal conditioning logic, encoder quadrature decoding, and high-cycle-count pulse counters that microcontrollers handle poorly. The 14 ns propagation delay ensures deterministic response for safety I/O chains (e.g., emergency stop circuits). MultiVolt I/O lets the CPLD interface directly to 3.3 V MCU GPIO and 5 V sensor outputs, eliminating external level shifters. The BGA-68 footprint supports compact DIN-rail module form factors, and AEC-Q100 over-qualification ensures long-term reliability in factory automation.
Được đề xuất
Portable & Battery-Powered Consumer Devices
The 5M160ZM68A5N's 25 uA standby current and 1.8 V single-supply operation make it ideal for always-on logic in portable consumer electronics such as wearables, IoT edge nodes, and handheld medical devices. It can implement power-management sequencing, button matrix decoding, and low-power state machines that wake the main application processor on user input. The instant-on flash configuration avoids the multi-second FPGA boot delay that would degrade user experience in power-button responsiveness. Its small 68-ball BGA (8x8 mm body) plus 0.5 mm pitch supports high-density wearables, while MultiVolt I/O bridges 1.8 V core rails to 3.3 V display or sensor peripherals without extra level shifters.
Được đề xuất
Communications Infrastructure Line-Card Control
The 5M160ZM68A5N provides deterministic glue logic for telecommunications line cards, including FPGA configuration supervision, clock-distribution control, and front-panel LED multiplexing. Telecom designs benefit from the device's instant-on behavior since line cards must respond to backplane enumeration within milliseconds of insertion; a CPLD's sub-microsecond flash boot avoids the FPGA configuration handshake complexity. The 52 user I/Os multiplex SPI/I2C buses between redundant FPGAs and PHYs, and the 128 macrocells implement up to several hundred combinational gates for hot-swap state machines. JTAG BST support allows board-level boundary-scan test for high-reliability telecom equipment.
Được đề xuất
Display & Touch Interface Bridging
The 5M160ZM68A5N bridges modern display interfaces by implementing LVDS-to-MIPI bridging, touch-panel I2C/SPI aggregation, and timing-controller assist logic in human-machine interface (HMI) modules. Its 14 ns propagation delay supports up to 50 MHz pixel-clock glue logic, and the 52 user I/Os route LVDS, RGB, and SPI interfaces between display driver ICs and the host SoC. The 1.8 V core plus MultiVolt I/O simplifies mixed-voltage HMI designs where 3.3 V legacy peripherals coexist with 1.8 V SoCs. AEC-Q100 over-qualification also serves ruggedized industrial HMIs requiring -40C to +125C operation.
Được đề xuất
Medical Device Signal Conditioning
The 5M160ZM68A5N provides deterministic, low-power logic for medical device front-end signal conditioning, including patient-monitor lead-fail detection, infusion-pump safety interlocks, and portable ultrasound beamformer control logic. Medical designs benefit from the CPLD's instant-on behavior for safety-critical interlocks that must be live before any firmware boots. The 14 ns propagation delay supports real-time safety-state-machine execution, while AEC-Q100 over-qualification provides the long-term reliability documentation that medical regulatory submissions (FDA 510(k), IEC 60601) require. The 25 uA standby supports battery-powered ambulatory devices that monitor patients for days on a single charge.
Được đề xuất
Aerospace & Avionics Logic Replacement
The 5M160ZM68A5N functions as a radiation-tolerant-adjacent logic replacement in non-flight-critical avionics subsystems such as in-flight entertainment, cabin-management systems, and aircraft sensor aggregation. Its industrial -40C to +125C temperature range and AEC-Q100 qualification satisfy DO-160 environmental requirements for commercial avionics. The 52 user I/Os implement ARINC 429 / RS-485 / SPI bridging between cabin systems, and 128 macrocells support complex cabin-state machines. The instant-on behavior eliminates cold-start delays for cabin lighting and seat-control modules that must respond instantly to crew input. JTAG boundary-scan allows field-maintenance verification of avionics LRUs (line replaceable units).
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 5M160ZM68A5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 5M160ZM100I5N | 5M160ZE64I5N | 5M160ZE64C5N | LC4064ZE-7QFN84 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Lattice Semiconductor |
| Package | FBGA-68 (68-ball, 0.5 mm pitch) | MBGA-100 - different footprint | EQFP-64 - different footprint | EQFP-64 - different footprint | QFN-84 - different footprint |
| Macrocells | 128 | 128 | 128 | 128 | 64 |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Propagation Delay | 14 ns | 14 ns | 14 ns | 14 ns | 7.5 ns (faster) |
| Automotive Grade | Yes (AEC-Q100, A5 suffix) | Industrial only | Industrial only | Commercial only | Industrial only |
Bảo phân biệt quan trọng
- AEC-Q100 qualified with -40C to +125C industrial temperature range (vs5M160ZM100I5N)
- Compact 68-ball BGA footprint optimized for space-constrained designs (vs5M160ZE64I5N)
- Cross-brand functional equivalence with Lattice ispMACH 4000ZE (vsLC4064ZE-7QFN84)
Ghi chú thiết kế
The 68-ball FineLine BGA package with 0.5 mm pitch requires PCB via-in-pad (VIP) or microvia technology for reliable assembly. Per the MAX V family datasheet, each BGA ball should have a corresponding microvia in the land pad connected to the inner signal layer. PCB land pattern must follow the JEDEC MO-225 recommendation. Use NSMD (non-solder mask defined) pads with 0.4 mm pad diameter for optimum solder joint reliability. Estimated: PCB fabrication cost increases ~$0.30/unit vs QFP, but routing density improves ~60%.
Decoupling requires a 0.1 uF X7R ceramic capacitor placed within 5 mm of each VCCINT and VCCIO ball pair. According to the MAX V family datasheet, bulk decoupling of 10 uF tantalum or ceramic should be placed near the device. Power sequencing: VCCINT must ramp before or simultaneously with VCCIO to prevent I/O latch-up; in-system programming via JTAG requires both rails within specification before configuration. Estimated: 4-6 decoupling capacitors needed for this 68-ball package.
MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, but each VCCIO bank must be tied to a single voltage. According to the MAX V family datasheet, mixing voltages within a bank causes undefined I/O behavior. JTAG signals (TCK/TMS/TDI/TDO) should be pulled to known states with 10 kohm resistors to prevent inadvertent JTAG state transitions. For high-speed (>50 MHz) designs, use 50 ohm controlled-impedance traces on clock and JTAG signals.
Per the MAX V family datasheet, unused user I/O pins should be configured as outputs driving low (not left floating) to minimize power consumption and reduce susceptibility to ESD events. The 68-ball FineLine BGA has no center balls (perimeter-only BGA), so all balls are accessible for routing. Do not exceed the 1.89 V maximum VCCINT - the device is NOT 2.5 V or 3.3 V tolerant on core supply. Automotive 'A5' grade must be operated within -40C to +125C ambient.
Place the 5M160ZM68A5N on the top PCB layer with no signal traces routed beneath the BGA land pads except through microvias to inner layers. Per the MAX V family datasheet, keep high-speed signal traces short and matched (within 1 mm) for bus interfaces. JTAG connector should be placed within 50 mm of the device to minimize signal degradation. Thermal pad is integrated into GND balls; provide a continuous ground pour beneath the device for thermal dissipation.
Thông tin tuân thủ
RoHS and REACH compliance per Intel/Altera product declaration. AEC-Q100 qualified per automotive datasheet. Lead-free reflow-compatible per JEDEC J-STD-020. Halogen-free status not explicitly stated in verified web data.
