A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip
MPN: A3PE3000L-FGG484M ✓ Hoạt độngA3PE3000L-FGG484M Tóm tắt
A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, it sits as an FPGA -> programmable logic device -> semiconductor. Unlike SRAM FPGAs, ProASIC3L devices are single-chip, instant-on, and inherently more secure because the bitstream is stored internally.
Key features of the ProASIC3L family include 1.2V to 1.5V core voltage operation, Flash*Freeze technology that dramatically cuts static power while retaining state, and per the Microchip datasheet roughly 40% lower dynamic power and 50% lower static power than the equivalent ProASIC3 device. The non-volatile flash fabric eliminates configuration PROMs, reduces bill-of-material cost, and improves supply-chain security.
The A3PE3000L fabric provides versatile logic elements, embedded SRAM, and supports soft-core processors and common IP cores. The 23 x 23 mm, 1.0 mm pitch FGG484 package with 2.23 mm height suits high-I/O-count designs where board area and solderable inspection matter.
Typical applications include military and aerospace systems needing -55C to +125C operation, industrial automation controllers, communications line cards, and medical instrumentation where low static power extends battery or conduction-cooled system budgets.
Design consideration: allocate adequate decoupling on the 1.2V/1.5V core rails and plan the power-up sequence early; Flash*Freeze pin usage should be fixed before layout freeze.
This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.
Bộ thay thế dễ dàng lắp đặt cho A3PE3000L-FGG484M — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với A3PE3000L-FGG484M (cùng hình factor và footprint) — khác nhau ở Family, Process Technology, Package, System Gates, RoHS Status.
M1A3PE3000L-FGG484M
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
A3PE3000L-FGG484
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →A3PE3000L-1FGG484I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →A3PE3000L-FG484M
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →A3PE3000L-1FG484I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →A3PE3000L-FGG484M Tỷ lệ tối đa & tính chất điện
| Family | ProASIC3L (ProASIC3 Low Power) |
| Logic Elements / Cells | 75264 |
| System Gates | 3000000 |
| Number of I/Os | 341 |
| Embedded Memory | 516096 bits |
| Core Voltage | 1.2 V to 1.5 V |
| Kiểu lắp đặt | SMD/SMT |
| Hộp / Vỏ | FBGA-484 (FGG484) |
| Package Dimensions | 23 x 23 mm, 2.23 mm height, 1.0 mm pitch |
| Minimum Operating Temperature | -55 C |
| Maximum Operating Temperature | +125 C |
| Temperature Grade | Military (M suffix) |
| Technology | Flash-based, non-volatile, Flash*Freeze |
| Packaging | Tray |
| Trạng thái RoHS | Compliant |
| Terminal Form | Ball |
| Product Series | A3PE3000L |
Hướng dẫn cấu hình chân A3PE3000L-FGG484M 23 x 23 mm, 2.23 mm height, 1.0 mm pitch
Cấu hình chân cho A3PE3000L-FGG484M (23 x 23 mm, 2.23 mm height, 1.0 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho A3PE3000L-FGG484M.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
A3PE3000L-FGG484M phù hợp cho 6 Áp dụngs: Military and Aerospace Systems, Industrial Automation Controllers, Communications Line Cards, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Control.
Military and Aerospace Systems
The -55C to +125C military temperature rating of the A3PE3000L-FGG484M makes it directly suited to defense electronics such as avionics controllers, radar interface boards, and missile guidance subsystems. The 3M-gate fabric with 341 I/Os absorbs glue logic, bus interfaces, and sensor preprocessing in a single 23 x 23 mm package, while the non-volatile flash fabric delivers instant-on operation with no configuration PROM - a key reliability advantage in systems with tight power-sequencing windows. Flash*Freeze mode cuts static power substantially while retaining register and memory state, useful in event-driven payloads that idle between bursts. Designs should recompile bitstreams in Libero SoC and verify conduction-cooling thermal margins at the +125C junction limit.
Được đề xuất
Industrial Automation Controllers
In factory automation and motion-control backplanes, the A3PE3000L-FGG484M consolidates deterministic I/O handling, encoder interpolation, and fieldbus interfacing into one flash FPGA. Its 1.2V to 1.5V core voltage lowers switching losses, and per the Microchip datasheet the L family cuts dynamic power about 40% versus the standard ProASIC3, reducing cabinet heat in sealed enclosures. The 341 user I/Os drive multiple isolated I/O banks at 3.3V and mixed voltages, while 516 kbit of embedded memory buffers process data without external SRAM. Single-chip flash configuration eliminates the config PROM, improving uptime in vibration-prone environments. Use the FGG484 footprint for consistent reflow assembly with lead-free processes.
Được đề xuất
Communications Line Cards
Telecom and datacom line cards benefit from the A3PE3000L's combination of fabric density and I/O count: 341 user I/Os map cleanly to multi-port backplane interfaces, Serdes-adjacent glue logic, and LED or alarm aggregation. The high PSRR-friendly 1.5V core simplifies power-tree design behind point-of-load converters, and Flash*Freeze lets standby line cards drop static power roughly 50% versus equivalent ProASIC3 silicon while preserving state for fast reactivation. Non-volatile configuration means a card can enumerate within microseconds of hot-swap insertion, simplifying redundant-architecture bring-up. Designers should verify I/O banking rules in the DS50003268 datasheet against backplane voltage standards before pin freezing.
Được đề xuất
Medical Instrumentation
Diagnostic imaging front ends, patient-monitoring bases, and laboratory analyzers use the A3PE3000L-FGG484M to time acquisitions, preprocess sensor streams, and manage display and communication interfaces. The flash fabric powers up instantly with no external configuration, shortening instrument boot time - a user-visible benefit in clinical workflows. Low static power, further reduced by Flash*Freeze between scans, extends the thermal and battery budget of portable and bedside units. The 23 x 23 mm FGG484 package with 1.0 mm pitch supports standard surface-mount assembly used in medical manufacturing. Note that the M temperature grade exceeds typical medical requirements; the industrial A3PE3000L-1FGG484I on the same footprint is usually the more economical pick for this sector.
Được đề xuất
Test and Measurement Equipment
Bench instruments, automated test fixtures, and protocol analyzers exploit the A3PE3000L's reprogrammability and abundant I/O for pattern generation, capture buffering, and DUT interface adaptation. Embedded flash memory (516,096 bits) implements small lookup tables and configuration snapshots locally, while the fabric's low dynamic power keeps thermal noise contributions predictable in sensitive analog signal chains. Instant-on flash configuration means instruments are measurement-ready in under a typical USB-enumeration interval. The 484-ball package provides ample power and ground balls for low-inductance distribution to fast I/O banks. Instrument makers commonly dual-source the FGG484 and FG484M ball-finish variants across production sites - confirm RoHS requirements per region before qualifying the FG lead-finish options.
Được đề xuất
Secure Embedded Control
Applications that must protect design IP - such as encryption key handling modules, license-control dongles, and proprietary industrial controllers - benefit from the A3PE3000L's non-volatile flash bitstream storage. Because the configuration lives on-chip, there is no external bitstream to intercept at power-up, a structural security advantage over SRAM FPGAs. The -55C to +125C M grade extends deployment to harsh outdoor and vehicle-mounted controllers. Designers can partition sensitive logic in the 75,264-cell fabric while using the 341 I/Os for tamper-detection loops and multi-voltage sensor interfaces. Follow Microchip security application notes for flash-lock and design-readback-disable settings, and recompile with current Libero SoC releases to carry latest security fixes.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho A3PE3000L-FGG484M — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | M1A3PE3000L-FGG484M | A3PE3000L-FGG484 | A3PE3000L-1FGG484I | A3PE3000L-FG484M | A3PE3000L-1FG484I |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (FGG484), 23 x 23 mm, 1.0 mm pitch | FBGA-484 (FGG484) - same | FBGA-484 (FGG484) - same | FBGA-484 (FGG484) - same | FBGA-484 (FG484) - same footprint, lead-finish variant | FBGA-484 (FG484) - same footprint, lead-finish variant |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology (M1 rebrand) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates / Cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells |
| User I/Os | 341 | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | Standard | Standard | Standard | -1 (faster) | Standard | -1 (faster) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | Yes | Yes |
| RoHS / Lead Finish | RoHS compliant (GGG lead-free balls) | Yes (GGG) | Yes (GGG) | Yes (GGG) | Non-RoHS FG finish per Xecor comparison | Non-RoHS FG finish |
Bảo phân biệt quan trọng
- Military temperature range in the same FGG484 footprint (vsA3PE3000L-1FGG484I)
- ~40% lower dynamic and ~50% lower static power than ProASIC3 (vsA3PE3000-FGG484)
- Dual-sourcing via M1 rebrand (vsM1A3PE3000L-FGG484M)
Ghi chú thiết kế
Provide independent, well-decoupled 1.2V and 1.5V core rails plus I/O bank supplies (typically 3.3V/2.5V/1.8V per bank). Use at least 10uF bulk plus 0.1uF ceramic per power ball group, placed within 2 mm of the ball via. Verify power-on ramp rates against the DS50003268 datasheet power-up requirements; the non-volatile flash fabric means the device becomes active immediately, so I/O banks must be valid before or with the core to prevent bus contention during hot insertion. Use Microchip's power calculator to estimate static and dynamic current before selecting regulators, and account for Flash*Freeze entry/exit current transients.
The FGG484 is a 1.0 mm pitch, 23 x 23 mm BGA; standard 0.5 mm via-in-pad with via filled and capped, or dog-bone fanout on 1.0 mm pitch, both work. Plan at least four signal layers plus two dedicated planes for a comfortable 341-I/O breakout. Solder mask-defined vs non-solder-mask-defined pads must match Microchip's land-pattern recommendation to ensure reliable ball wetting. For the military M grade, specify X-ray inspection of BGA joints per your quality process, and store trays per MSL rating before reflow - bake if the floor-life clock is exceeded.
Three recurring mistakes: (1) copying the pinout from an A3PE3000 (non-L) datasheet - verify against the ProASIC3L FGG484 table in DS50003268; (2) leaving the Flash*Freeze pin floating or mis-assigned, which either blocks low-power entry or causes unintended state retention behavior - assign it deliberately in Libero before layout freeze; (3) assuming the FG and FGG suffixes are interchangeable - they differ in ball lead finish (RoHS), which matters for procurement and process qualification even though the electrical pinout is identical. Always recompile the design for the exact target MPN and speed grade.
Thông tin tuân thủ
RoHS Code 'Yes' per Xecor comparison data for the FGG484M variant; the FG (non-GGG) ball-finish siblings are flagged non-RoHS in the same source. REACH, halogen-free, and conflict-minerals status not stated in provided data.
