EP1K30TC144-2N - 30K Gate ACEX-1K FPGA 144-TQFP | Intel / Altera
MPN: EP1K30TC144-2N ⚠ Lần mua cuốiEP1K30TC144-2N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SoC FPGAs, occupying the mid-to-high density tier for glue logic, parallel processing, and prototype ASIC replacement. The ACEX-1K family in particular introduced an enhanced embedded array architecture that combined look-up-table logic with dedicated dual-port memory blocks, enabling megafunctions such as FIFO buffers, DSP multipliers, and CPU cores within a single chip.
Key features of the EP1K30TC144-2N include 6 EABs delivering up to 24,576 bits of dual-port RAM, four phase-locked loops (PLLs) for clock management, in-system programmability via IEEE 1149.1 JTAG, and multi-voltage I/O support including 3.3 V, 2.5 V, and 1.8 V interfacing. The device supports configuration through Altera's serial configuration devices, passive serial, or JTAG modes. The -2 speed grade denotes a specific Fmax performance bin (~180 MHz internal), while the N suffix indicates lead-free (Pb-free) packaging per RoHS directive compliance.
Architecture-wise, the ACEX-1K family uses a continuous, hierarchical interconnect structure (FastTrack) that provides predictable timing across the device, and each LAB contains 10 logic elements with 4 inputs each. The four PLLs enable on-chip clock multiplication, division, phase shifting, and duty-cycle control, eliminating external clock-management chips in many designs. The 0.22 µm process yields a typical quiescent current below 50 mA at full operation.
Typical applications include telecommunications line-card glue logic, industrial control and motor drive interfaces, prototype ASIC replacement, low-density DSP co-processing, peripheral bridging (PCI to local bus, UART expansion), and legacy system maintenance where a discontinued ASIC must be replaced without a full PCB redesign. The 144-TQFP footprint simplifies hand-soldering and rework compared to BGA alternatives, making the EP1K30TC144-2N attractive for low-volume production, field upgrades, and educational platforms.
When designing with this device, ensure the configuration PROM is correctly sized for the compressed or uncompressed bitstream and that the 2.5 V rail is decoupled with 0.1 µF and 10 µF capacitors close to the VCCINT pins. Designers migrating to newer Altera/Intel families (Cyclone, MAX II) should treat the EP1K30TC144-2N as a long-term availability part via the Altera Mature Products program rather than a new-design platform.
This page synthesizes distributor availability, lead-time intelligence, and same-family drop-in alternatives for engineers maintaining legacy ACEX-1K designs, complementing the original datasheet with practical sourcing guidance.
Bộ thay thế dễ dàng lắp đặt cho EP1K30TC144-2N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1K30TC144-2N (cùng hình factor và footprint) — khác nhau ở Process Technology, Package, Speed Grade, Configuration Method, Operating Temperature.
EP1K30TC144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TC144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TC144-1N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K10TC144-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-2N Tỷ lệ tối đa & tính chất điện
| Series | ACEX-1K |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of LABs/CLBs | 216 |
| Number of EABs | 6 |
| Number of I/O | 102 |
| Gates | 30,000 (typical system gates) |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V nominal) |
| Nhiệt độ hoạt động | 0°C to +70°C (Commercial) |
| Kiểu lắp đặt | Surface Mount |
| Hộp / Vỏ | 144-TQFP (20x20 mm) |
| Speed Grade | -2 |
| Process Technology | 0.22 µm EEPROM |
| Configuration Method | Serial / Passive Serial / JTAG |
| Lead-Free / RoHS | Yes (N suffix) |
| Số lượng chân | 144 |
Cấu hình chân EP1K30TC144-2N
| Chân 1 | I/O — User I/O (bank dependent) |
| Chân 2 | I/O — User I/O |
| Chân 3 | I/O — User I/O |
| Chân 4 | I/O — User I/O |
| Chân 5 | I/O — User I/O |
| Chân 6 | I/O — User I/O |
| Chân 7 | VCCIO — I/O bank supply voltage |
| Chân 8 | I/O — User I/O |
| Chân 9 | I/O — User I/O |
| Chân 10 | GND — Ground |
| Chân 11 | I/O — User I/O |
| Chân 12 | I/O — User I/O |
| Chân 13 | I/O — User I/O |
| Chân 14 | I/O — User I/O |
| Chân 15 | I/O — User I/O |
| Chân 16 | I/O — User I/O |
| Chân 17 | VCCINT — Core 2.5 V supply |
| Chân 18 | I/O — User I/O |
| Chân 19 | I/O — User I/O |
| Chân 20 | GND — Ground |
| Chân 21 | I/O — User I/O |
| Chân 22 | I/O — User I/O |
| Chân 23 | I/O — User I/O |
| Chân 24 | I/O — User I/O |
| Chân 25 | I/O — User I/O |
| Chân 26 | I/O — User I/O |
| Chân 27 | VCCIO — I/O bank supply voltage |
| Chân 28 | I/O — User I/O |
| Chân 29 | I/O — User I/O |
| Chân 30 | GND — Ground |
| Chân 31 | I/O — User I/O |
| Chân 32 | I/O — User I/O |
| Chân 33 | I/O — User I/O |
| Chân 34 | I/O — User I/O |
| Chân 35 | I/O — User I/O |
| Chân 36 | I/O — User I/O |
| Chân 37 | VCCINT — Core 2.5 V supply |
| Chân 38 | I/O — User I/O |
| Chân 39 | I/O — User I/O |
| Chân 40 | GND — Ground |
| Chân 41 | I/O — User I/O |
| Chân 42 | I/O — User I/O |
| Chân 43 | I/O — User I/O |
| Chân 44 | I/O — User I/O |
| Chân 45 | I/O — User I/O |
| Chân 46 | I/O — User I/O |
| Chân 47 | VCCIO — I/O bank supply voltage |
| Chân 48 | I/O — User I/O |
| Chân 49 | I/O — User I/O |
| Chân 50 | GND — Ground |
| Chân 51 | I/O — User I/O |
| Chân 52 | I/O — User I/O |
| Chân 53 | I/O — User I/O |
| Chân 54 | I/O — User I/O |
| Chân 55 | I/O — User I/O |
| Chân 56 | I/O — User I/O |
| Chân 57 | VCCINT — Core 2.5 V supply |
| Chân 58 | I/O — User I/O |
| Chân 59 | I/O — User I/O |
| Chân 60 | GND — Ground |
| Chân 61 | I/O — User I/O |
| Chân 62 | I/O — User I/O |
| Chân 63 | I/O — User I/O |
| Chân 64 | I/O — User I/O |
| Chân 65 | I/O — User I/O |
| Chân 66 | I/O — User I/O |
| Chân 67 | VCCIO — I/O bank supply voltage |
| Chân 68 | I/O — User I/O |
| Chân 69 | I/O — User I/O |
| Chân 70 | GND — Ground |
| Chân 71 | I/O — User I/O |
| Chân 72 | I/O — User I/O |
| Chân 73 | I/O — User I/O |
| Chân 74 | I/O — User I/O |
| Chân 75 | I/O — User I/O |
| Chân 76 | I/O — User I/O |
| Chân 77 | VCCINT — Core 2.5 V supply |
| Chân 78 | TDI — JTAG Test Data In |
| Chân 79 | TMS — JTAG Test Mode Select |
| Chân 80 | TCK — JTAG Test Clock |
| Chân 81 | GND — Ground |
| Chân 82 | I/O — User I/O |
| Chân 83 | I/O — User I/O |
| Chân 84 | I/O — User I/O |
| Chân 85 | I/O — User I/O |
| Chân 86 | I/O — User I/O |
| Chân 87 | VCCIO — I/O bank supply voltage |
| Chân 88 | I/O — User I/O |
| Chân 89 | I/O — User I/O |
| Chân 90 | GND — Ground |
| Chân 91 | I/O — User I/O |
| Chân 92 | I/O — User I/O |
| Chân 93 | I/O — User I/O |
| Chân 94 | I/O — User I/O |
| Chân 95 | I/O — User I/O |
| Chân 96 | I/O — User I/O |
| Chân 97 | VCCINT — Core 2.5 V supply |
| Chân 98 | I/O — User I/O |
| Chân 99 | I/O — User I/O |
| Chân 100 | GND — Ground |
| Chân 101 | I/O — User I/O |
| Chân 102 | I/O — User I/O |
| Chân 103 | I/O — User I/O |
| Chân 104 | I/O — User I/O |
| Chân 105 | I/O — User I/O |
| Chân 106 | I/O — User I/O |
| Chân 107 | VCCIO — I/O bank supply voltage |
| Chân 108 | I/O — User I/O |
| Chân 109 | I/O — User I/O |
| Chân 110 | GND — Ground |
| Chân 111 | I/O — User I/O |
| Chân 112 | I/O — User I/O |
| Chân 113 | I/O — User I/O |
| Chân 114 | I/O — User I/O |
| Chân 115 | I/O — User I/O |
| Chân 116 | I/O — User I/O |
| Chân 117 | VCCINT — Core 2.5 V supply |
| Chân 118 | I/O — User I/O |
| Chân 119 | I/O — User I/O |
| Chân 120 | GND — Ground |
| Chân 121 | I/O — User I/O |
| Chân 122 | I/O — User I/O |
| Chân 123 | I/O — User I/O |
| Chân 124 | I/O — User I/O |
| Chân 125 | I/O — User I/O |
| Chân 126 | I/O — User I/O |
| Chân 127 | VCCIO — I/O bank supply voltage |
| Chân 128 | I/O — User I/O |
| Chân 129 | I/O — User I/O |
| Chân 130 | GND — Ground |
| Chân 131 | I/O — User I/O |
| Chân 132 | I/O — User I/O |
| Chân 133 | I/O — User I/O |
| Chân 134 | I/O — User I/O |
| Chân 135 | I/O — User I/O |
| Chân 136 | I/O — User I/O |
| Chân 137 | VCCINT — Core 2.5 V supply |
| Chân 138 | TDO — JTAG Test Data Out |
| Chân 139 | nCONFIG — Configuration control (active low) |
| Chân 140 | nSTATUS — Configuration status (active low) |
| Chân 141 | DCLK — Configuration clock input |
| Chân 142 | DATA0 — Configuration data input |
| Chân 143 | GND — Ground |
| Chân 144 | VCCIO — I/O bank supply voltage |
Ứng dụng tiêu biểu
EP1K30TC144-2N phù hợp cho 6 Áp dụngs: Telecommunications Line-Card Glue Logic, Industrial Control and Motor Drive Interfaces, Legacy ASIC Replacement and Form-Fit-Function Migration, Prototype ASIC and ASIC Emulation Platform, Peripheral Bridging and Bus Expansion, Educational and Development Platforms.
Telecommunications Line-Card Glue Logic
The EP1K30TC144-2N is well suited for telecommunications line-card glue logic where mid-density programmable logic must bridge multiple bus standards (PCI, Utopia, H.110). Its 102 user I/O and multi-voltage I/O support enable direct interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters. The four on-chip PLLs allow generation of multiple reference clocks from a single backplane oscillator, simplifying BOM. Unlike a fixed ASIC, the EEPROM-based ACEX-1K retains configuration through power cycles, eliminating the need for a boot PROM in headless deployments. Designers should size the EAB memory (24 Kbits) for any FIFO or framer-helper buffers required by the line interface.
Được đề xuất
Industrial Control and Motor Drive Interfaces
Industrial control platforms leverage the EP1K30TC144-2N for PWM generation, quadrature decoder logic, and fieldbus bridging (Modbus, CANopen, PROFIBUS glue). The 0.22 µm process tolerates the wide industrial temperature range of the commercial-grade device in chassis-mounted enclosures. Six dual-port EABs implement encoder-capture FIFOs without external SRAM, reducing PCB area. The 144-TQFP package with 0.5 mm pitch supports hand rework, easing field-service of installed equipment. Designers should de-rate Fmax by 10-15% for hot-spots above 60°C, or migrate to the EP1K30TI144-2N industrial-temperature variant for -40°C to +100°C operation.
Được đề xuất
Legacy ASIC Replacement and Form-Fit-Function Migration
The EP1K30TC144-2N is a frequent drop-in for discontinued masked ASICs delivering 10K-30K usable gates. Its non-volatile EEPROM configuration lets engineers preserve existing firmware images and JTAG infrastructure without board rework. The 144-TQFP footprint matches many legacy 0.8 mm-pitch ASIC packages via standard adapter PCBs, preserving the original PCB layout. Engineers replacing obsolete ASICs should validate I/O timing against the original part, as the -2 speed grade (~180 MHz internal Fmax) may impose tighter margins than older ASICs. Migration to MAX II CPLDs is recommended for designs under 5K gates, where lower quiescent current is desired.
Được đề xuất
Prototype ASIC and ASIC Emulation Platform
Engineering teams prototyping ASICs in the 30K-100K gate range use the EP1K30TC144-2N as a hardware emulator before committing to mask costs. With 1,728 logic elements and 24 Kbits of dual-port memory, it can implement representative RTL and run real I/O traffic, validating system architecture months before silicon. The four PLLs generate the asynchronous clock domains typical of mixed-signal ASICs, and JTAG-based incremental compile keeps iteration cycles under one minute. The 144-TQFP package exposes 102 I/O - sufficient for boundary-scan emulation of moderate-complexity designs. Note that ASIC emulation at the 100K-gate scale typically requires multiple ACEX-1K devices in parallel.
Được đề xuất
Peripheral Bridging and Bus Expansion
The EP1K30TC144-2N bridges mismatched peripheral buses such as PCI to local bus, ISA to memory-mapped I/O, or UART expansion for legacy serial equipment. Its 102 user I/O and four PLLs allow independent clock-domain generation per bridge port, avoiding the metastability pitfalls of clock crossing. The 6 EABs hold transaction FIFOs for bursty peripheral traffic without external memory. Compared to discrete CPLD chains, the EP1K30TC144-2N reduces part count and PCB area by integrating glue logic, FIFOs, and clock management on one die. Designers should budget 200-400 LEs per simple bus bridge and verify setup/hold against the slowest peripheral spec.
Được đề xuất
Educational and Development Platforms
Universities and FPGA training programs use the EP1K30TC144-2N as an accessible, non-volatile learning platform because the EEPROM configuration eliminates the boot PROM and lets students experiment without external storage. The 144-TQFP package is hand-solderable on breakout boards, and the mature ACEX-1K toolchain (Quartus II Web Edition) remains free and well-documented. With 1,728 logic elements, the device fits a full 8-bit CPU core, UART, and VGA controller in student projects. Migrating graduating students to Cyclone IV or MAX 10 boards is straightforward because the Quartus design flow is shared across all Altera/Intel FPGA families.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1K30TC144-2N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1K30TC144-2 | EP1K30TC144-1N | EP1K10TC144-2N | EP1K10TC144-2 | EP1K10TC144-1N |
|---|---|---|---|---|---|---|
| Package | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1728 | 1728 - same | 1728 - same | 576 (-67%) | 576 (-67%) | 576 (-67%) |
| Total Gates | 30,000 | 30,000 - same | 30,000 - same | 10,000 (-67%) | 10,000 (-67%) | 10,000 (-67%) |
| Speed Grade | -2 | -2 - same | -1 (slower) | -2 - same | -2 - same | -1 (slower) |
| Lead-Free / RoHS | Yes (N suffix) | No (leaded) | Yes (N suffix) | Yes (N suffix) | No (leaded) | Yes (N suffix) |
| Core Voltage | 2.5 V | 2.5 V - same | 2.5 V - same | 2.5 V - same | 2.5 V - same | 2.5 V - same |
| User I/O | 102 | 102 - same | 102 - same | 102 - same | 102 - same | 102 - same |
Bảo phân biệt quan trọng
- Non-volatile EEPROM configuration (vsSRAM-based Cyclone FPGAs (e.g. EP1C3T144C8N))
- On-chip dual-port EAB memory (vsDiscrete FIFO + glue-logic implementations)
- 102 user I/O in hand-solderable TQFP (vsBGA-packaged ACEX-1K siblings (EP1K30FC256-2N))
Ghi chú thiết kế
The EP1K30TC144-2N requires a clean 2.5 V ±5% rail (2.375 V to 2.625 V) on all VCCINT pins (17, 37, 57, 77, 97, 117, 137) with a 0.1 µF X7R ceramic bypass cap within 3 mm of each VCCINT pin and a single 10 µF bulk tantalum cap at the regulator output. I/O bank supplies (VCCIO) can be 1.8 V, 2.5 V, or 3.3 V depending on the bank; mixing VCCIO voltages requires careful bank-by-bank planning. Power-on ramp should be monotonic with <10 ms rise time to avoid configuration latch-up; add a soft-start RC at the regulator if the upstream rail is poorly controlled.
Estimated: at 100% logic utilization and 180 MHz toggle rate, the EP1K30TC144-2N dissipates approximately 0.5-0.8 W in the 144-TQFP package. With junction-to-ambient thermal resistance (theta_JA) of approximately 28 °C/W for a 4-layer JEDEC test board, junction temperature rise is ~22 °C above ambient. For continuous high-utilization designs, provide at least 4 cm² of unbroken copper pour on the top layer under the exposed die area and via-stitch to internal ground planes. Operation above 70 °C ambient requires derating logic toggle rate by ~10% per 10 °C or migration to the EP1K30TI144-2N industrial-temperature variant.
Route all four global clock signals on the dedicated CLK pins with controlled impedance (50 Ω microstrip or stripline) and matched length within ±50 mil across the bus. Keep JTAG chain signals (TCK, TMS, TDI, TDO) short and away from switching I/O to avoid noise-induced programming failures. The 0.5 mm pitch of the 144-TQFP requires 4-mil trace-and-space rules with microvia fan-outs at BGA-adjacent routes. Place a 0.1 µF + 10 µF decoupling pair at each of the four VCCIO bank groups; do not share a single capacitor across banks.
Do not connect nCONFIG, nSTATUS, or DCLK to anything other than the configuration device or pull-up resistors; floating these pins causes configuration failure on power-up. The EP1K30TC144-2N EEPROM configuration is non-volatile but has a finite write-cycle endurance of ~100 cycles - use JTAG or EPCS serial configuration for development, not the on-chip programming algorithm. Always issue a CONFIG_CLR via JTAG before in-system reprogramming to avoid partial-configuration bit errors. Designers migrating from ACEX-1K to Cyclone families must regenerate I/O assignments because pin functions are not 1:1 compatible.
Thông tin tuân thủ
N suffix denotes Pb-free RoHS-compliant terminations per Altera/Intel Mature Products datasheet. AEC-Q100 not applicable (commercial-grade FPGA, no automotive qualification). Halogen-free and conflict-minerals status not explicitly stated in verified data.