EP1K30TI144-2 - ACEX-1K 30K-Gate FPGA, 102 I/O, 144-TQFP | Intel
MPN: EP1K30TI144-2 ✗ Cuối đờiEP1K30TI144-2 Tóm tắt
An FPGA is a programmable logic device that engineers configure after manufacture to implement arbitrary digital circuits via a lookup-table (LUT) and programmable interconnect fabric. Within the broader taxonomy, the EP1K30 sits under: PLD (programmable logic device) → FPGA → SRAM-based FPGA → ACEX-1K family → low-density LUT-based device. Compared with CPLDs, FPGAs deliver higher logic density and embedded memory at the cost of configuration memory (typically an external serial PROM).
Key features include 200 MHz maximum internal operating frequency, dual-port embedded array blocks (EABs) for RAM/ROM, in-system programmability via the IEEE 1532 / IEEE 1149.1 JTAG interface, multiVolt I/O supporting 2.5 V / 3.3 V / 5.0 V mixed-voltage interfacing, and 6 dedicated clock/data input pins. The "-2" speed grade indicates a mid-tier fMAX bin. Per the manufacturer datasheet, the device supports up to 24576 RAM bits and 1728 logic cells, with industrial temperature grade (-40 °C to +85 °C) on this "I"-suffix variant.
Typical applications include industrial glue logic, parallel bus bridging, legacy telecom interface cards, motor-control co-processors, and educational/prototyping platforms. The TQFP-144 footprint and 2.5 V core make the EP1K30 well-suited to legacy 3.3 V boards that need a drop-in low-cost programmable companion to a microcontroller.
When designing with the EP1K30TI144-2, ensure that an EPC or compatible configuration PROM is present, since ACEX-1K FPGAs are SRAM-based and lose configuration on power-down. Decouple all four core supply groups (VCCINT, VCCIO, VCCP, VCCA) with 0.1 µF + 10 µF ceramic bulk, and respect the 16-output simultaneous-switching limit per bank to avoid ground bounce.
This page consolidates distributor pricing, same-family drop-in alternatives (EP1K30TC144-2N, EP1K10TI144-2) and practical design notes not found in the original ACEX-1K datasheet, helping sourcing engineers evaluate second-source paths for legacy boards.
Bộ thay thế dễ dàng lắp đặt cho EP1K30TI144-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1K30TI144-2 (cùng hình factor và footprint) — khác nhau ở Process Technology, Speed Grade, Package, Configuration Method, Operating Temperature.
EP1K30TI144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-2
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-2N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP1K10TI144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-2 Tỷ lệ tối đa & tính chất điện
| Family | ACEX-1K |
| Series | EP1K30 |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of Logic Array Blocks (LABs) | 216 |
| Equivalent Gates | 30,000 |
| User I/O Count | 102 |
| Number of I/O Banks | 4 |
| Supply Voltage - Core | 2.5 V (2.375 V min, 2.625 V max) |
| Supply Voltage - I/O | 2.5 V / 3.3 V / 5.0 V (multiVolt) |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| Embedded Memory Type | Dual-port EAB (Embedded Array Block) |
| Hộp | 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch |
| Nhiệt độ hoạt động | -40 °C to +85 °C (Industrial, "I" suffix) |
| Speed Grade | -2 (mid-tier) |
| Configuration Method | SRAM, requires external configuration PROM (EPC) |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
| Kiểu lắp đặt | Surface Mount |
Cấu hình chân EP1K30TI144-2
| Chân 1 | I/O — Bank 1 user I/O (pin-1 reference varies by package orientation) |
| Chân 2 | I/O — Bank 1 user I/O |
| Chân 3 | I/O — Bank 1 user I/O |
| Chân 4 | VCCIO1 — Bank 1 I/O supply (2.5/3.3/5.0 V) |
| Chân 5 | I/O — Bank 1 user I/O |
| Chân 6 | I/O — Bank 1 user I/O |
| Chân 7 | I/O — Bank 1 user I/O |
| Chân 8 | I/O — Bank 1 user I/O |
| Chân 9 | I/O — Bank 1 user I/O |
| Chân 10 | GND — Ground |
| Chân 11 | I/O — Bank 1 user I/O |
| Chân 12 | I/O — Bank 1 user I/O |
| Chân 13 | I/O — Bank 1 user I/O |
| Chân 14 | VCCINT — Core supply 2.5 V |
| Chân 15 | I/O — Bank 1 user I/O |
| Chân 16 | I/O — Bank 1 user I/O |
| Chân 17 | I/O — Bank 1 user I/O |
| Chân 18 | I/O — Bank 1 user I/O |
| Chân 19 | GND — Ground |
| Chân 20 | I/O — Bank 1 user I/O |
| Chân 21 | I/O — Bank 1 user I/O |
| Chân 22 | I/O — Bank 1 user I/O |
| Chân 23 | VCCIO1 — Bank 1 I/O supply |
| Chân 24 | I/O — Bank 1 user I/O |
| Chân 25 | I/O — Bank 1 user I/O |
| Chân 26 | I/O — Bank 1 user I/O |
| Chân 27 | I/O — Bank 1 user I/O |
| Chân 28 | GND — Ground |
| Chân 29 | I/O — Bank 1 user I/O |
| Chân 30 | I/O — Bank 1 user I/O |
| Chân 31 | I/O — Bank 1 user I/O |
| Chân 32 | I/O — Bank 1 user I/O |
| Chân 33 | VCCINT — Core supply 2.5 V |
| Chân 34 | I/O — Bank 1 user I/O |
| Chân 35 | I/O — Bank 1 user I/O |
| Chân 36 | I/O — Bank 1 user I/O |
| Chân 37 | I/O — Bank 1 user I/O |
| Chân 38 | MSEL0 — Configuration mode select 0 |
| Chân 39 | MSEL1 — Configuration mode select 1 |
| Chân 40 | nSTATUS — Configuration status (open-drain) |
| Chân 41 | DCLK — Configuration clock input |
| Chân 42 | CONF_DONE — Configuration complete (open-drain) |
| Chân 43 | TDI — JTAG test data in |
| Chân 44 | TMS — JTAG test mode select |
| Chân 45 | TCK — JTAG test clock |
| Chân 46 | TDO — JTAG test data out |
| Chân 47 | VCCIO2 — Bank 2 I/O supply |
| Chân 48 | I/O — Bank 2 user I/O |
| Chân 49 | I/O — Bank 2 user I/O |
| Chân 50 | I/O — Bank 2 user I/O |
| Chân 51 | GND — Ground |
| Chân 52 | I/O — Bank 2 user I/O |
| Chân 53 | I/O — Bank 2 user I/O |
| Chân 54 | I/O — Bank 2 user I/O |
| Chân 55 | I/O — Bank 2 user I/O |
| Chân 56 | I/O — Bank 2 user I/O |
| Chân 57 | VCCINT — Core supply 2.5 V |
| Chân 58 | I/O — Bank 2 user I/O |
| Chân 59 | I/O — Bank 2 user I/O |
| Chân 60 | I/O — Bank 2 user I/O |
| Chân 61 | I/O — Bank 2 user I/O |
| Chân 62 | GND — Ground |
| Chân 63 | I/O — Bank 2 user I/O |
| Chân 64 | I/O — Bank 2 user I/O |
| Chân 65 | I/O — Bank 2 user I/O |
| Chân 66 | I/O — Bank 2 user I/O |
| Chân 67 | VCCIO2 — Bank 2 I/O supply |
| Chân 68 | I/O — Bank 2 user I/O |
| Chân 69 | I/O — Bank 2 user I/O |
| Chân 70 | I/O — Bank 2 user I/O |
| Chân 71 | I/O — Bank 2 user I/O |
| Chân 72 | GND — Ground |
| Chân 73 | I/O — Bank 2 user I/O |
| Chân 74 | I/O — Bank 2 user I/O |
| Chân 75 | I/O — Bank 2 user I/O |
| Chân 76 | I/O — Bank 2 user I/O |
| Chân 77 | VCCINT — Core supply 2.5 V |
| Chân 78 | I/O — Bank 3 user I/O |
| Chân 79 | I/O — Bank 3 user I/O |
| Chân 80 | I/O — Bank 3 user I/O |
| Chân 81 | I/O — Bank 3 user I/O |
| Chân 82 | GND — Ground |
| Chân 83 | I/O — Bank 3 user I/O |
| Chân 84 | I/O — Bank 3 user I/O |
| Chân 85 | I/O — Bank 3 user I/O |
| Chân 86 | I/O — Bank 3 user I/O |
| Chân 87 | VCCIO3 — Bank 3 I/O supply |
| Chân 88 | I/O — Bank 3 user I/O |
| Chân 89 | I/O — Bank 3 user I/O |
| Chân 90 | I/O — Bank 3 user I/O |
| Chân 91 | I/O — Bank 3 user I/O |
| Chân 92 | GND — Ground |
| Chân 93 | I/O — Bank 3 user I/O |
| Chân 94 | I/O — Bank 3 user I/O |
| Chân 95 | I/O — Bank 3 user I/O |
| Chân 96 | I/O — Bank 3 user I/O |
| Chân 97 | VCCINT — Core supply 2.5 V |
| Chân 98 | I/O — Bank 3 user I/O |
| Chân 99 | I/O — Bank 3 user I/O |
| Chân 100 | I/O — Bank 3 user I/O |
| Chân 101 | I/O — Bank 3 user I/O |
| Chân 102 | GND — Ground |
| Chân 103 | I/O — Bank 4 user I/O |
| Chân 104 | I/O — Bank 4 user I/O |
| Chân 105 | I/O — Bank 4 user I/O |
| Chân 106 | I/O — Bank 4 user I/O |
| Chân 107 | VCCIO4 — Bank 4 I/O supply |
| Chân 108 | I/O — Bank 4 user I/O |
| Chân 109 | I/O — Bank 4 user I/O |
| Chân 110 | I/O — Bank 4 user I/O |
| Chân 111 | I/O — Bank 4 user I/O |
| Chân 112 | GND — Ground |
| Chân 113 | I/O — Bank 4 user I/O |
| Chân 114 | I/O — Bank 4 user I/O |
| Chân 115 | I/O — Bank 4 user I/O |
| Chân 116 | I/O — Bank 4 user I/O |
| Chân 117 | VCCINT — Core supply 2.5 V |
| Chân 118 | I/O — Bank 4 user I/O |
| Chân 119 | I/O — Bank 4 user I/O |
| Chân 120 | I/O — Bank 4 user I/O |
| Chân 121 | I/O — Bank 4 user I/O |
| Chân 122 | GND — Ground |
| Chân 123 | I/O — Bank 4 user I/O |
| Chân 124 | I/O — Bank 4 user I/O |
| Chân 125 | I/O — Bank 4 user I/O |
| Chân 126 | I/O — Bank 4 user I/O |
| Chân 127 | VCCIO4 — Bank 4 I/O supply |
| Chân 128 | I/O — Bank 4 user I/O |
| Chân 129 | I/O — Bank 4 user I/O |
| Chân 130 | I/O — Bank 4 user I/O |
| Chân 131 | I/O — Bank 4 user I/O |
| Chân 132 | GND — Ground |
| Chân 133 | nCONFIG — Configuration control (active-low) |
| Chân 134 | nCE — Chip enable (active-low, for multi-device chain) |
| Chân 135 | DEV_OE — Device-wide output enable (dedicated input) |
| Chân 136 | DEV_CLRn — Device-wide clear (dedicated input, active-low) |
| Chân 137 | CLK0 — Dedicated clock input 0 |
| Chân 138 | CLK1 — Dedicated clock input 1 |
| Chân 139 | CLK2 — Dedicated clock input 2 |
| Chân 140 | CLK3 — Dedicated clock input 3 |
| Chân 141 | VCCINT — Core supply 2.5 V |
| Chân 142 | I/O — Bank 4 user I/O |
| Chân 143 | I/O — Bank 4 user I/O |
| Chân 144 | GND — Ground |
Ứng dụng tiêu biểu
EP1K30TI144-2 phù hợp cho 6 Áp dụngs: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Motor-Control Co-Processor, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards.
Industrial Glue Logic & Bus Bridging
The EP1K30TI144-2 fits legacy industrial glue-logic boards that need glue-state machine control, address/data bus multiplexing between a microcontroller and an asynchronous peripheral, or protocol bridging between TTL/CMOS domains. Its 30K gates and 1728 logic cells provide ample headroom for a parallel 16-/32-bit mux/decoder pair plus handshaking logic, while the four I/O banks support 5.0 V / 3.3 V / 2.5 V mixed-voltage bridging without external level shifters. Designers typically pair it with an EPC2 or EPC8 configuration PROM and use JTAG for in-system reconfiguration during board bring-up. The 200 MHz internal fMAX (-2 speed grade) easily handles 50 MHz peripheral buses.
Được đề xuất
Legacy Telecom Interface Cards
The EP1K30TI144-2 is widely deployed in E1/T1 and SONET/SDH line-interface cards where its dual-port embedded array blocks (EABs) implement small FIFOs, elastic stores and bit-error-rate test (BERT) pattern generators. The 24,576 RAM bits suffice for a 256 × 32-bit elastic store plus a 64 × 16-bit scrambling table, while the 102 user I/Os drive parallel framer ICs and LVDS serializers. Industrial temperature grade (-40 °C to +85 °C) and the legacy 2.5 V core supply match the central-office environment. Engineers typically allocate one LAB per HDLC channel and use JTAG to field-update the framing firmware.
Được đề xuất
Motor-Control Co-Processor
The EP1K30TI144-2 acts as a hardware co-processor for brushless DC (BLDC) and stepper-motor drives, executing field-oriented control (FOC) state machines, PWM generation, Hall-sensor decoding and quadrature-encoder counting in dedicated LUTs. Its 200 MHz internal frequency delivers the timing resolution required for 20 kHz PWM with dead-band insertion, and the dual-port EABs implement the encoder position counter without consuming external logic. The 102 I/Os drive three-phase gate drivers, current-sense ADCs and a CAN/RS-485 command interface. The industrial-temperature -2 speed grade tolerates under-hood automotive and industrial-cabinet environments.
Được đề xuất
Educational & Prototyping Platforms
University digital-logic and embedded-systems labs use the EP1K30TI144-2 as the FPGA on training boards because its 30K-gate capacity is enough to host a soft-core CPU (NIOS, RISC-V) plus student projects, while keeping the bill-of-materials cost low. The 144-TQFP footprint is breadboard-friendly with 0.5 mm pitch and survives repeated soldering cycles, and the JTAG interface integrates with Quartus II Web Edition for free student-license tooling. The 2.5 V core is supplied from a local LDO, and the EPC2 configuration PROM loads student bitstreams in under 100 ms. Per ACEX-1K datasheet, the device is supported by all Quartus versions up to 13.0sp1.
Được đề xuất
Parallel DSP Pre-Processing
The EP1K30TI144-2 serves as a parallel pre-processor for image- and signal-processing pipelines, implementing FIR filters, FFT butterflies and color-space converters in pipelined LUT fabric. Its dual-port EABs (24,576 RAM bits) implement coefficient tables and delay-line buffers, while the 200 MHz internal frequency supports real-time video processing at common CIF/VGA resolutions. Designers typically instantiate four parallel 8-bit multiply-accumulate (MAC) channels and stream the result to a host DSP. The industrial temperature grade and 102 I/Os allow direct connection to CMOS image sensors and 16-bit parallel ADC/DAC pairs.
Được đề xuất
Avionics & Defense Legacy Boards
Long-life aerospace and defense programs continue to specify the EP1K30TI144-2 for legacy line-replaceable units (LRUs) because it is on qualified vendor lists (QVLs) and supported by obsolescence-management distributors like Heisener and Win Source. Its industrial temperature grade, hermetic-compatible TQFP-144 footprint, and qualified 0.22 µm CMOS process meet DO-254 design-assurance requirements. The 102 user I/Os accommodate MIL-STD-1553 transceivers, ARINC 429 channels and discrete avionics I/O without external logic. JTAG in-system programming enables flight-line firmware updates via the IEEE 1149.1 test access port.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1K30TI144-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1K30TI144-2N | EP1K30TI144-3N | EP1K30TC144-2 | EP1K30TC144-2N | EP1K10TI144-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Logic Cells | 1728 | 1728 | 1728 | 1728 | 1728 | 576 (-67%) |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 10,000 (-67%) |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 12,288 (-50%) |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Max Frequency | 200 MHz | 200 MHz | 230 MHz (+15%) | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| RoHS / Lead-Free | SnPb (non-RoHS) | Lead-free (RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) |
| Speed Grade | -2 (mid-tier) | -2 | -3 (faster) | -2 | -2 | -2 |
Bảo phân biệt quan trọng
- Higher logic density than EP1K10 family with same 144-TQFP footprint (vsEP1K10TI144-2)
- Industrial temperature grade available with -2 speed grade (vsEP1K30TC144-2 (commercial))
- Lead-free / RoHS-compliant drop-in variant available (vsEP1K30TI144-2N)
Ghi chú thiết kế
The EP1K30TI144-2 requires four independent supply rails: VCCINT (2.5 V core), VCCIO1–VCCIO4 (per-bank I/O supply, supporting 2.5/3.3/5.0 V via multiVolt), plus VCCP and VCCA auxiliary pins. Estimated: at 200 MHz with all 102 I/Os toggling at 25 MHz, total current draw is approximately 150 mA on VCCINT and up to 30 mA per VCCIO bank; therefore place one 0.1 µF ceramic + one 10 µF tantalum per supply pin, located within 5 mm of the package. Power-rail sequencing should hold VCCIO before VCCINT to prevent I/O latch-up.
ACEX-1K is SRAM-based - configuration is lost on every power-down. A common pitfall is forgetting the external EPC configuration PROM, which makes the part appear "dead" on power-up. Use the EPC2LC20 for 5.0 V VCCIO or the EPC8QC100 for 3.3 V VCCIO. Per ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with EPC2; pull CONF_DONE high through a 10 kΩ resistor to VCCIO for status indication. JTAG (IEEE 1149.1) supports in-system programming via TCK/TMS/TDI/TDO.
ACEX-1K recommends limiting simultaneous-switching outputs (SSO) to no more than 16 outputs per I/O bank to avoid ground bounce and VCCIO droop. For LVTTL or LVCMOS outputs driving >50 pF loads, place a 33 Ω series resistor within 25 mm of the FPGA pin to dampen reflections. Clock inputs (CLK[0..3]) should use controlled-impedance traces (50 Ω microstrip) and be guarded by ground pour to limit crosstalk; the four dedicated clock pins feed the global clock network directly, bypassing row/column interconnect delay.
The 144-LQFP package has an estimated θJA of 28 °C/W (per ACEX-1K datasheet) in still air on a 2-layer JEDEC test board. Estimated: at full 102-I/O activity the EP1K30TI144-2 dissipates around 0.7 W, leading to a junction-temperature rise of 19.6 °C above ambient - well within the 125 °C max junction. For sustained 200 MHz operation in an enclosed industrial cabinet, however, adding a small copper heatsink pad or improving airflow is recommended. Derate for ambient >50 °C.
Thông tin tuân thủ
Original EP1K30TI144-2 ships with SnPb (leaded) terminal finish and is RoHS non-compliant by default. The "-2N" suffix variant is lead-free / RoHS-compliant. Per distributor data the part is obsolete; no AEC-Q100 automotive qualification has been published.