EP1K30TI144-2NGA - ACEX 1K FPGA, 30K Gates, 144-TQFP | Altera
MPN: EP1K30TI144-2NGA ✗ Cuối đờiEP1K30TI144-2NGA Tóm tắt
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnects, and dedicated I/O cells that engineers can re-program after manufacture. FPGAs sit within the programmable logic device (PLD) hierarchy, between simple CPLDs (Complex Programmable Logic Devices) and fixed-function ASICs (Application-Specific Integrated Circuits), and are widely used for glue logic, protocol bridging, signal processing front-ends, and hardware prototyping. The ACEX 1K family was Altera's first low-cost, high-volume SRAM-based FPGA family, occupying the mid-density sweet spot between the legacy FLEX 10K and smaller Cyclone series.
Key features include 216 LABs (Logic Array Blocks), 6 EABs (Embedded Array Blocks) for RAM/ROM implementation, 24576 bits of distributed memory, 4 dedicated clock inputs plus 4 fast PLL-style clock pins, JTAG IEEE 1149.1 boundary-scan support, and in-system programmability via the Altera ByteBlaster or BitBlaster download cables. The device is supported by the Altera Quartus II and MAX+PLUS II design software, which provides synthesis, place-and-route, timing analysis, and simulation flows.
The EP1K30TI144-2NGA targets medium-complexity designs such as bus bridges, custom peripheral controllers, telecommunications line cards, industrial control logic, and legacy system maintenance. Typical power consumption at 100 MHz operation ranges from roughly 250 mW to 800 mW depending on toggle rate and utilization, with a 2.5 V core supply (VCCINT) and 3.3 V I/O supply (VCCIO). Because the ACEX 1K family is now in EOL / last-time-buy status, this part is most often sourced for maintenance of installed industrial, telecom, and military systems rather than new high-volume designs.
Bộ thay thế dễ dàng lắp đặt cho EP1K30TI144-2NGA — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1K30TI144-2NGA (cùng hình factor và footprint) — khác nhau ở Speed Grade, Process Technology, Package, Operating Temperature, Configuration Method.
EP1K30TI144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TC144-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K30TI144-2NGA Tỷ lệ tối đa & tính chất điện
| Series | ACEX 1K |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of Logic Array Blocks (LABs) | 216 |
| Number of I/O | 102 |
| Number of Gates (typical) | 119000 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V |
| Nhiệt độ hoạt động | -40C to +85C (Industrial) |
| Kiểu lắp đặt | Surface Mount |
| Hộp / Vỏ | 144-LFQFP / 144-TQFP (20x20 mm) |
| Process Technology | 0.18 um SRAM CMOS |
| Programmable Logic Type | In-system programmable SRAM FPGA |
| Speed Grade | -2 (faster than -3) |
| Lead Free / RoHS Status | Lead free / RoHS compliant per suffix code |
| Design Software | Quartus II, MAX+PLUS II |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Configuration | SRAM-based, requires configuration device at power-up |
Cấu hình chân EP1K30TI144-2NGA
| Chân 1 | I/O — User I/O (bank 1) |
| Chân 2 | I/O — User I/O (bank 1) |
| Chân 3 | VCCIO — I/O supply 3.3 V |
| Chân 4 | I/O — User I/O (bank 1) |
| Chân 5 | I/O — User I/O (bank 1) |
| Chân 6 | GND — Ground |
| Chân 7 | I/O — User I/O (bank 1) |
| Chân 8 | I/O — User I/O (bank 1) |
| Chân 9 | I/O — User I/O (bank 1) |
| Chân 10 | I/O — User I/O (bank 1) |
| Chân 11 | VCCINT — Core supply 2.5 V |
| Chân 12 | I/O — User I/O (bank 1) |
| Chân 13 | I/O — User I/O (bank 1) |
| Chân 14 | GND — Ground |
| Chân 15 | I/O — User I/O (bank 1) |
| Chân 16 | I/O — User I/O (bank 1) |
| Chân 17 | I/O — User I/O (bank 1) |
| Chân 18 | I/O — User I/O (bank 1) |
| Chân 19 | I/O — User I/O (bank 1) |
| Chân 20 | I/O — User I/O (bank 1) |
| Chân 21 | GND — Ground |
| Chân 22 | I/O — User I/O (bank 1) |
| Chân 23 | I/O — User I/O (bank 1) |
| Chân 24 | I/O — User I/O (bank 1) |
| Chân 25 | I/O — User I/O (bank 1) |
| Chân 26 | VCCIO — I/O supply 3.3 V |
| Chân 27 | I/O — User I/O (bank 2) |
| Chân 28 | I/O — User I/O (bank 2) |
| Chân 29 | I/O — User I/O (bank 2) |
| Chân 30 | GND — Ground |
| Chân 31 | I/O — User I/O (bank 2) |
| Chân 32 | I/O — User I/O (bank 2) |
| Chân 33 | VCCINT — Core supply 2.5 V |
| Chân 34 | I/O — User I/O (bank 2) |
| Chân 35 | I/O — User I/O (bank 2) |
| Chân 36 | I/O — User I/O (bank 2) |
| Chân 37 | GND — Ground |
| Chân 38 | CLK0 — Dedicated clock input 0 |
| Chân 39 | CLK1 — Dedicated clock input 1 |
| Chân 40 | I/O — User I/O (bank 2) |
| Chân 41 | I/O — User I/O (bank 2) |
| Chân 42 | VCCIO — I/O supply 3.3 V |
| Chân 43 | I/O — User I/O (bank 2) |
| Chân 44 | I/O — User I/O (bank 2) |
| Chân 45 | GND — Ground |
| Chân 46 | I/O — User I/O (bank 2) |
| Chân 47 | I/O — User I/O (bank 2) |
| Chân 48 | I/O — User I/O (bank 3) |
| Chân 49 | I/O — User I/O (bank 3) |
| Chân 50 | I/O — User I/O (bank 3) |
| Chân 51 | VCCINT — Core supply 2.5 V |
| Chân 52 | I/O — User I/O (bank 3) |
| Chân 53 | I/O — User I/O (bank 3) |
| Chân 54 | GND — Ground |
| Chân 55 | I/O — User I/O (bank 3) |
| Chân 56 | I/O — User I/O (bank 3) |
| Chân 57 | I/O — User I/O (bank 3) |
| Chân 58 | I/O — User I/O (bank 3) |
| Chân 59 | I/O — User I/O (bank 3) |
| Chân 60 | GND — Ground |
| Chân 61 | I/O — User I/O (bank 3) |
| Chân 62 | I/O — User I/O (bank 3) |
| Chân 63 | I/O — User I/O (bank 3) |
| Chân 64 | I/O — User I/O (bank 3) |
| Chân 65 | VCCIO — I/O supply 3.3 V |
| Chân 66 | I/O — User I/O (bank 3) |
| Chân 67 | I/O — User I/O (bank 3) |
| Chân 68 | GND — Ground |
| Chân 69 | I/O — User I/O (bank 4) |
| Chân 70 | I/O — User I/O (bank 4) |
| Chân 71 | I/O — User I/O (bank 4) |
| Chân 72 | I/O — User I/O (bank 4) |
| Chân 73 | VCCINT — Core supply 2.5 V |
| Chân 74 | I/O — User I/O (bank 4) |
| Chân 75 | I/O — User I/O (bank 4) |
| Chân 76 | GND — Ground |
| Chân 77 | I/O — User I/O (bank 4) |
| Chân 78 | I/O — User I/O (bank 4) |
| Chân 79 | CLK2 — Dedicated clock input 2 |
| Chân 80 | CLK3 — Dedicated clock input 3 |
| Chân 81 | I/O — User I/O (bank 4) |
| Chân 82 | I/O — User I/O (bank 4) |
| Chân 83 | VCCIO — I/O supply 3.3 V |
| Chân 84 | I/O — User I/O (bank 4) |
| Chân 85 | I/O — User I/O (bank 4) |
| Chân 86 | GND — Ground |
| Chân 87 | I/O — User I/O (bank 4) |
| Chân 88 | I/O — User I/O (bank 4) |
| Chân 89 | I/O — User I/O (bank 5) |
| Chân 90 | I/O — User I/O (bank 5) |
| Chân 91 | VCCINT — Core supply 2.5 V |
| Chân 92 | I/O — User I/O (bank 5) |
| Chân 93 | I/O — User I/O (bank 5) |
| Chân 94 | GND — Ground |
| Chân 95 | nCONFIG — Configuration control (active-low) |
| Chân 96 | nSTATUS — Configuration status (active-low) |
| Chân 97 | CONF_DONE — Configuration done indicator |
| Chân 98 | DCLK — Configuration clock input |
| Chân 99 | DATA0 — Configuration data input 0 |
| Chân 100 | VCCIO — I/O supply 3.3 V |
| Chân 101 | I/O — User I/O (bank 5) |
| Chân 102 | I/O — User I/O (bank 5) |
| Chân 103 | I/O — User I/O (bank 5) |
| Chân 104 | I/O — User I/O (bank 5) |
| Chân 105 | GND — Ground |
| Chân 106 | I/O — User I/O (bank 5) |
| Chân 107 | I/O — User I/O (bank 5) |
| Chân 108 | VCCINT — Core supply 2.5 V |
| Chân 109 | I/O — User I/O (bank 5) |
| Chân 110 | I/O — User I/O (bank 5) |
| Chân 111 | I/O — User I/O (bank 6) |
| Chân 112 | I/O — User I/O (bank 6) |
| Chân 113 | GND — Ground |
| Chân 114 | I/O — User I/O (bank 6) |
| Chân 115 | I/O — User I/O (bank 6) |
| Chân 116 | VCCIO — I/O supply 3.3 V |
| Chân 117 | I/O — User I/O (bank 6) |
| Chân 118 | I/O — User I/O (bank 6) |
| Chân 119 | I/O — User I/O (bank 6) |
| Chân 120 | I/O — User I/O (bank 6) |
| Chân 121 | I/O — User I/O (bank 6) |
| Chân 122 | VCCINT — Core supply 2.5 V |
| Chân 123 | I/O — User I/O (bank 6) |
| Chân 124 | I/O — User I/O (bank 6) |
| Chân 125 | GND — Ground |
| Chân 126 | TDI — JTAG test data in |
| Chân 127 | TMS — JTAG test mode select |
| Chân 128 | TCK — JTAG test clock |
| Chân 129 | TDO — JTAG test data out |
| Chân 130 | I/O — User I/O (bank 6) |
| Chân 131 | VCCIO — I/O supply 3.3 V |
| Chân 132 | I/O — User I/O (bank 7) |
| Chân 133 | I/O — User I/O (bank 7) |
| Chân 134 | I/O — User I/O (bank 7) |
| Chân 135 | I/O — User I/O (bank 7) |
| Chân 136 | GND — Ground |
| Chân 137 | I/O — User I/O (bank 7) |
| Chân 138 | I/O — User I/O (bank 7) |
| Chân 139 | I/O — User I/O (bank 7) |
| Chân 140 | I/O — User I/O (bank 7) |
| Chân 141 | I/O — User I/O (bank 7) |
| Chân 142 | VCCINT — Core supply 2.5 V |
| Chân 143 | I/O — User I/O (bank 8) |
| Chân 144 | I/O — User I/O (bank 8) |
Ứng dụng tiêu biểu
EP1K30TI144-2NGA phù hợp cho 6 Áp dụngs: Industrial PLC I/O Expansion, Telecom Line-Card Glue Logic, Avionics and Defense Retrofit, Test and Measurement Front-Ends, Consumer Electronics Protocol Bridging, University Digital Design Laboratory.
Industrial PLC I/O Expansion
The EP1K30TI144-2NGA is widely used in legacy PLC I/O expansion modules where its 1,728 logic elements implement custom protocol handling and glue-logic between a microcontroller and digital I/O banks. With 102 user I/O available on the 144-TQFP footprint, designers can route 32-64 channels of opto-isolated input conditioning plus encoder counters without external 74-series logic. The 2.5 V core and 3.3 V I/O operation keeps the BOM aligned with industrial 24 V->5 V->3.3 V power trees. Industrial temperature grade (-40C to +85C) supports cabinet-mounted deployments on factory floors. SRAM-based in-system programmability enables field firmware upgrades via JTAG, critical for installed-base support where the FPGA is the primary configurable asset.
Được đề xuất
Telecom Line-Card Glue Logic
In legacy telecom line-card designs the EP1K30TI144-2NGA replaces multiple PAL/GAL and discrete 74-series devices by implementing bus arbitration, TDM (time-division multiplexing) framing, and alarm-scan logic in a single 144-TQFP device. The 24,576 bits of embedded array block (EAB) memory buffer small lookup tables and CRC generators, while the 216 LABs support state machines for HDB3/AMI line coding. Its 3.3 V I/O banks interface directly with legacy framers and LIUs without level shifters. The industrial temperature range and proven ACEX 1K reliability make this part a standard component in installed base line cards deployed across central offices worldwide.
Được đề xuất
Avionics and Defense Retrofit
The EP1K30TI144-2NGA appears in military and avionics retrofit programs where the original Altera ACEX 1K design is being re-spun to resolve parts obsolescence while preserving the FPGA bitstream and PCB footprint. Its -40C to +85C industrial operating range, mature Quartus II toolchain support, and long-term aerospace pedigree (with appropriate MIL-STD-883 screening handled by the system integrator) keep it qualified for retrofit activities. Designers can re-target the same RTL to the pin-compatible EP1K30TI144-2N or larger EP1K50TI144-2N with no PCB rework. The SRAM configuration must be paired with a configuration PROM (such as the EPC2 or EPC8) to support instant-on in avionics power environments.
Được đề xuất
Test and Measurement Front-Ends
Bench-top and rack-mounted test equipment uses the EP1K30TI144-2NGA as a flexible digital signal routing and pattern-generation engine. Its 102 user I/O and 24,576 bits of block RAM let it build 16-32 channel pattern generators, parallel stimulus/response engines, and protocol-analyzer state machines without external memory. The 144-TQFP package is friendly to standard 4-layer FR-4 PCB layouts and supports hand-rework for prototype boards. JTAG programming lets test engineers iterate on stimulus patterns in seconds, while the in-system reconfigurability supports multi-instrument personalities in a single hardware platform.
Được đề xuất
Consumer Electronics Protocol Bridging
In consumer A/V receivers, set-top boxes, and game-console peripherals the EP1K30TI144-2NGA acts as a multi-protocol bridge, converting between I2S, SPDIF, parallel RGB, LVDS, and proprietary bus formats using its 1,728 logic elements and 102 I/O. The 144-TQFP package is well suited to high-volume SMT lines, and the 3.3 V I/O interface aligns with standard consumer audio/video companion ICs. Designers can move to the commercial-grade EP1K30TC144-2N for indoor-only chassis and reduce BOM cost while preserving the PCB footprint. The JTAG chain allows post-assembly calibration of skew, color-depth conversion tables, and audio delay lines.
Được đề xuất
University Digital Design Laboratory
Educational institutions continue to deploy the EP1K30TI144-2NGA in digital-logic and computer-architecture laboratories because the Quartus II and MAX+PLUS II software is mature, freely available for legacy versions, and well documented in textbooks and lab manuals. The 144-TQFP development boards expose all 102 user I/O on 0.1-inch headers or PMOD-style connectors, giving students a hands-on platform for designing ALUs, simple CPUs, UARTs, and VGA controllers. Industrial temperature grade and Pb-free packaging (NGA suffix) match modern academic lab ESD and rework tooling. The 1,728 logic-element capacity is ideal for second-year digital-design assignments without overwhelming junior engineers.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1K30TI144-2NGA — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1K30TI144-2N | EP1K30TI144-2 | EP1K30TC144-2N | EP1K30TC144-2 | EP1K30TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Number of I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 (slower Fmax) |
| Pb-Free / RoHS | Yes (NGA suffix) | Yes (N suffix) | Not guaranteed | Yes (N suffix) | Not guaranteed | Not guaranteed |
| Total RAM Bits | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Approx. Unit Price (USD, qty 1) | 28.50 | ~30 (similar, depends on stock) | ~25 (slightly lower, legacy stock) | ~26 (commercial grade) | ~22 (commercial, non-Pb-free) | ~20 (slower grade) |
Bảo phân biệt quan trọng
- Pb-free / RoHS assembly with industrial temperature grade in single suffix (vsEP1K30TI144-2 (without NGA suffix))
- Speed grade -2 with industrial temperature coverage (vsEP1K30TC144-1 (commercial, slower grade))
- 102 I/O with 24 Kbit block RAM in the smallest ACEX 1K TQFP package (vsEP1K50TI144-2N (higher gate count))
Ghi chú thiết kế
The ACEX 1K EP1K30 requires a clean 2.5 V VCCINT and 3.3 V VCCIO supply. Place 100 nF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin, and add bulk 47-100 uF tantalum or low-ESR ceramic capacitors on each supply rail near the package. Power-on ramp should rise monotonically within the datasheet-specified tr (typically <100 ms) to avoid configuration failures; use a power-good supervisor if the upstream regulator has a soft-start window longer than 100 ms.
Because the EP1K30 is SRAM-based, the bitstream must be reloaded from a configuration PROM (EPC2, EPC8, or compatible) on every power-up. Designs that assume the FPGA retains configuration across power cycles will fail on the first power-down. Add a JTAG header in the design even for production boards to enable in-field programming and recovery from corrupted configuration.
The 144-TQFP package has a typical theta_JA of around 25-30 C/W on a 4-layer JEDEC test board; with industrial -40C to +85C ambient operation, junction temperature at the 800 mW worst-case power envelope remains within the 125 C limit. For continuous operation at the upper temperature limit, add a 100-200 mm^2 copper pour on the top layer under the exposed die paddle (or under the package body) to reduce thermal resistance by 20-30%.
Use 4-layer FR-4 with continuous VCC and GND planes for the 144-TQFP land pattern; route all 102 user I/O on the top and bottom layers to maintain signal-integrity for 50-100 MHz operation. Pair each high-speed clock trace with a ground return path directly underneath, and place 33 ohm series-termination resistors within 5 mm of the FPGA clock pins to suppress overshoot on CLK0-CLK3.
Thông tin tuân thủ
RoHS compliance inferred from NGA suffix (Altera / Intel PSG Pb-free convention). AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified). REACH and conflict-mineral statements should be obtained from the specific distributor or Intel PSG certificate of compliance at order time.
