EP1S10F780I6 - Stratix FPGA, 10570 Cells, 780-BGA | Altera/Intel
MPN: EP1S10F780I6 ⚠ Lần mua cuốiEP1S10F780I6 Tóm tắt
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers on a single die. The Stratix architecture represents the original high-end Altera family that pioneered embedded memory and DSP blocks for high-bandwidth signal processing. Within the broader programmable logic taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) and ASICs (Application-Specific Integrated Circuits), offering ASIC-level performance with field reprogrammability. The Stratix family sits above Cyclone and below Stratix GX/Cyclone series in Altera's hierarchy, targeting applications that demand abundant logic, memory, and I/O bandwidth.
Key features of the EP1S10F780I6 include 1057 logic array blocks (LABs), 920,448 RAM bits organized in TriMatrix memory structures, dedicated DSP blocks for high-speed multiply-accumulate operations, and 8 phase-locked loops (PLLs) for clock management. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and includes True-LVDS and reduced-swing differential signaling on selected banks. A 1.5 V core supply and 1.5 V/1.8 V/2.5 V/3.3 V I/O supplies are configurable per bank.
The architecture combines a fine-grained logic fabric with column-based DSP and memory blocks, allowing efficient implementation of high-throughput pipelines. Hard intellectual property (IP) such as embedded multipliers and SERDES-ready PLLs reduces the gate overhead required for typical DSP and serial link functions, enabling multi-gigabit designs on a single device.
Typical applications include high-end telecommunications switching equipment, software-defined radio baseband processing, high-performance test and measurement instrumentation, ASIC prototyping platforms, and embedded video/image processing. The 780-pin FBGA package provides the I/O density required for parallel processing interfaces and high-bandwidth memory buses.
When designing with this device, ensure proper power supply sequencing (1.5 V core before 3.3 V I/O) to prevent latch-up, and follow Altera's Stratix Hardware Reference Manual guidelines for decoupling, thermal management, and JTAG configuration. Configuration can be loaded via passive serial (PS), fast passive parallel (FPP), or JTAG, with the configuration scheme selected via MSEL pins.
This page synthesizes distributor pricing, pin-compatible same-family alternatives, and practical design notes not found in a standalone datasheet PDF.
Bộ thay thế dễ dàng lắp đặt cho EP1S10F780I6 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1S10F780I6 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Speed Grade, Configuration Modes.
EP1S10F780C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S10F780C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S10F780C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S10F780C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S10F780C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1S10F780C5
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Xem tài liệu →EP1S10F780I6 Tỷ lệ tối đa & tính chất điện
| Family | Stratix |
| Logic Elements / Cells | 10,570 cells |
| Configurable Logic Blocks (CLBs) | 1,200 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory (RAM bits) | 920,448 bits |
| Maximum User I/Os | 426 |
| Maximum Operating Frequency | 450 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | CMOS |
| Hộp | 780-ball FineLine BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Operating Temperature (Industrial, I suffix) | -40C to +100C |
| Speed Grade | 6 |
| PLLs | 8 |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| Trạng thái RoHS | Compliant (lead-free FBGA package) |
Hướng dẫn cấu hình chân EP1S10F780I6 780-ball fineline bga (fbga-780), 29 x 29 mm, 1.0 mm pitch
Cấu hình chân cho EP1S10F780I6 (780-ball fineline bga (fbga-780), 29 x 29 mm, 1.0 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1S10F780I6.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1S10F780I6 phù hợp cho 6 Áp dụngs: Telecommunications Switching Infrastructure, Software-Defined Radio Baseband Processing, High-Performance Test & Measurement Instrumentation, ASIC Prototyping Platform, Embedded Video and Image Processing, Military and Aerospace Signal Processing.
Telecommunications Switching Infrastructure
The EP1S10F780I6 fits telecommunications switching infrastructure because its 920,448 bits of embedded TriMatrix memory and 8 PLLs enable multi-channel packet buffering and clock recovery across parallel telecom interfaces. The 426 user I/Os support wide parallel buses to network processors and SERDES companion chips, while the 1.5 V core keeps per-channel power below 15 mW typical. Compared to ASIC solutions, the Stratix silicon allows late-stage protocol customization for emerging standards like POS-PHY Level 4 and SPI-4.2. The industrial temperature grade covers central-office and outside-plant deployment environments, and the FBGA-780 package provides the I/O density required for full-duplex OC-192 framer interfaces.
Được đề xuất
Software-Defined Radio Baseband Processing
The EP1S10F780I6 serves software-defined radio baseband processing due to its dedicated DSP blocks that accelerate multiply-accumulate operations critical to FFT and channelization algorithms. At 450 MHz fabric speed, the device can process 100 MHz-wide LTE waveforms in real time while sustaining the timing margins required for ADC/DAC interfacing. The 426 I/Os support parallel LVDS ADC/DAC connections for direct-IF sampling architectures, eliminating analog downconversion stages. The 8 PLLs generate independent sample clocks for multiple antenna channels. Industrial temperature grade enables deployment in outdoor base-station enclosures where ambient temperature can swing across the full -40C to +100C range.
Được đề xuất
High-Performance Test & Measurement Instrumentation
Test and measurement instrumentation uses the EP1S10F780I6 because its high logic density (10,570 cells) and abundant I/O support multi-channel arbitrary waveform generators, logic analyzers, and protocol analyzers. The 426 user I/Os accommodate parallel ADC/DAC arrays sampling at hundreds of MSPS, while the 920 Kbits of TriMatrix memory buffer deep waveform captures between trigger events. Industrial temperature grade ensures measurement accuracy over laboratory, factory-floor, and field-deployed test environments. The FBGA-780 package supports dense PCB layouts where signal integrity demands short, matched-length traces between the FPGA and adjacent analog components.
Được đề xuất
ASIC Prototyping Platform
The EP1S10F780I6 functions as an ASIC prototyping platform where its Stratix architecture mirrors the silicon of contemporary ASIC libraries, enabling pre-silicon validation of multi-million-gate designs. Engineers can partition designs across multiple EP1S10 devices using LVDS-based chip-to-chip links; the 426 I/Os provide the high-density side-band channels required for boundary scan, JTAG daisy-chains, and inter-FPGA clock distribution. The 1.5 V core mirrors typical ASIC core voltages, simplifying I/O voltage translation. Industrial temperature grade supports extended validation across temperature corners. Last-time-buy status makes existing EP1S10 stock attractive for legacy prototype runs where replacement silicon is not available.
Được đề xuất
Embedded Video and Image Processing
The EP1S10F780I6 serves embedded video and image processing because its parallel logic fabric and 426 I/Os can ingest uncompressed SDI, CameraLink, or LVDS-based video streams at full frame rate. The 920 Kbits of TriMatrix memory acts as line buffers and frame stores for real-time pipelined image processing like color-space conversion, scaling, and edge detection. With 8 PLLs, the device generates independent pixel clocks for multi-camera capture or multi-display output. The industrial temperature grade suits industrial machine vision and automotive vision systems where ambient temperature varies widely. The FBGA-780 package supports dense camera-link-to-display routing on compact PCBs.
Được đề xuất
Military and Aerospace Signal Processing
The EP1S10F780I6 is used in military and aerospace signal processing applications including radar baseband, electronic warfare subsystems, and secure communications. The industrial temperature grade (-40C to +100C) covers most MIL-STD-810 environmental profiles, while the 10,570-cell fabric implements real-time FFT, beamforming, and spread-spectrum processing. The 426 user I/Os support high-speed LVDS links to RF ADCs/DACs and to optical transceivers for high-bandwidth data offload. Last-time-buy status means remaining inventory is appropriate for sustainment of legacy fielded systems where the original Stratix silicon has been validated to program-of-record requirements.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1S10F780I6 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1S10F780C7N | EP1S10F780C7 | EP1S10F780C6N | EP1S10F780C6 | EP1S10F780C5N | EP1S10F780C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | FBGA-780 (29x29 mm, 1.0 mm pitch) | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same | FBGA-780 (29x29 mm, 1.0 mm pitch) - same |
| Logic Cells | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded RAM (bits) | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 |
| User I/Os | 426 | 426 | 426 | 426 | 426 | 426 | 426 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 6 | 7 (faster Fmax) | 7 (faster Fmax) | 6 (same Fmax) | 6 (same Fmax) | 5 (slower Fmax) | 5 (slower Fmax) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Bảo phân biệt quan trọng
- Industrial temperature grade for harsh-environment deployment (vsEP1S10F780C7N)
- Speed grade 6 - balanced Fmax and power (vsEP1S10F780C5N)
- 426 user I/Os for high-density parallel interfaces (vsEP1S10F484C7N)
- Drop-in compatibility with full Stratix family (vsEP1K50FC256-3)
Ghi chú thiết kế
The EP1S10F780I6 requires power supply sequencing: the 1.5 V VCCINT (core) must ramp before or simultaneously with the 3.3 V VCCIO (I/O) supplies to prevent I/O latch-up. Use a power-good sequencer or the dedicated Altera power sequencer reference design. Add at least 4 x 100 uF bulk tantalum capacitors and 20 x 0.1 uF ceramic decoupling capacitors distributed around the FBGA-780 footprint. Each PLL requires a separate filtered 2.5 V analog supply (VCCA_PLL) - do not share this rail with noisy digital supplies.
Estimated: at full utilization (10,570 cells @ 80% toggle rate, 426 I/Os @ 100 MHz), the EP1S10F780I6 dissipates approximately 4-6 W. With the FBGA-780 package thermal resistance of approximately 15 C/W (junction-to-ambient with 4-layer PCB and no heatsink), junction temperature could rise 60-90 C above ambient. For industrial-grade operation at +100C ambient, either reduce clock rates, use a heatsink with thermal interface material, or implement airflow. A 6-layer PCB with internal power/ground planes is strongly recommended over 4-layer to lower junction-to-ambient thermal resistance to 8-10 C/W.
The FBGA-780 package uses 1.0 mm ball pitch requiring microvia (laser-drilled) PCB technology. Use 4-mil laser-drilled microvias in pad, 8-mil capture pads, and 4-mil traces between balls. Route all differential pairs (LVDS) with 100 ohm differential impedance and length matching within 20 mil. Route all global clocks on inner signal layers adjacent to a solid ground plane. Provide a continuous ground plane directly under the BGA paddle to reduce ground bounce and provide a low-inductance return path.
Do not confuse the EP1S10F780I6 with EP1S10F672I7N (different package, 672-pin) or EP1S10F484I6N (484-pin) - these are NOT drop-in replacements. Always confirm MSEL pin configuration matches the intended configuration mode (PS, FPP, or JTAG). Unused I/O pins must be set to tri-state with weak pull-up in the Quartus II pin assignment file to minimize power and avoid floating-input oscillation. Configuration bitstreams generated for speed grade 6 will NOT operate correctly on speed grade 7 or 5 devices - regenerate the bitstream for the actual device part number.
Place the EP1S10F780I6 configuration PROM (EPCS4 or EPCS16) within 2 inches of the FPGA's DCLK and DATA0 pins to ensure signal integrity during configuration. If using FPP (Fast Passive Parallel) mode, route 8-bit parallel configuration data with matched length within 1 inch of all 8 data lines. JTAG signals (TCK, TMS, TDI, TDO) must be pulled up to VCCIO of bank 8 with 10 kohm resistors per the Stratix handbook. Reserve at least 4 GPIO pins near the FPGA for user LEDs and test points for bring-up debugging.
Thông tin tuân thủ
RoHS compliance per Altera/Intel PSG lead-free FBGA packaging. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade IC. Last-time-buy status limits long-term automotive deployment.
